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1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings
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3.1. CTM File Format
Intel offers the latest CTMs in ECXML format and as STEP files.
ECXML files are compatible with the following CFD tools:
- Icepak* from ANSYS
- Flotherm* from Mentor Graphics*
- 6SigmaET* from Cadence
You can use STEP files with CAD-based CFD analysis tools such as Solid Works or Autodesk. STEP files do not have built-in material thermal properties, built-in sensors, or built-in 2D power planes like the ECXML files. Intel provides the material thermal properties in a separate file, and you must input that into the model. For power, you must assign it to the die and also add it to your own thermal sensor.