Thermal Design User Guide: Agilex™ 5 FPGAs and SoCs

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ID 814008
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines 2. Agilex™ 5 FPGA Mechanical Construction 3. Agilex™ 5 FPGA CTM Construction 4. Power and Thermal Calculator (PTC) 5. General FPGA Thermal Design Considerations 6. Design Examples 7. Heat Sinks 8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs A. Agilex™ 5 FPGA Product Keys and Package Drawings
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines x
1.1. Definitions of Thermal and Power Terms Used in this Document
2. Agilex™ 5 FPGA Mechanical Construction x
2.1. Built-in Temperature Sensors
2.1. Built-in Temperature Sensors x
2.1.1. Agilex™ 5 FPGA Temperature Rating
3. Agilex™ 5 FPGA CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. CTM Top Temperature, TCASE Virtual Sensor 3.4. Obtaining the CTM
4. Power and Thermal Calculator (PTC) x
4.1. PTC Thermal Tab Parameters 4.2. Thermal Analysis with the PTC 4.3. PTC Thermal Tab Calculation Options 4.4. Thermal Resistances and Low Power Devices 4.5. Sensor Temperatures on the PTC Thermal Tab
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations
5.1. FPGA Power Considerations x
5.1.1. FPGA Maximum Allowed Power Dissipation 5.1.2. Static, Dynamic, and Standby Power
5.1.2. Static, Dynamic, and Standby Power x
5.1.2.1. Future-Proofing an FPGA Thermal Design
6. Design Examples x
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode 6.2. Example 2: Solution with Temperature-Dependent Power 6.3. Example 3: Known Cooling Capacity 6.4. Example 4: Heat Sink Selection
6.1. Example 1: Constant Die Power with CFD and TJ-MAX Calculation Mode x
6.1.1. CFD Results
7. Heat Sinks x
7.1. Attachment Force 7.2. Thermal Interface Material (TIM)
1. Introduction to Agilex™ 5 FPGA Thermal Design Guidelines
2. Agilex™ 5 FPGA Mechanical Construction
3. Agilex™ 5 FPGA CTM Construction
4. Power and Thermal Calculator (PTC)
5. General FPGA Thermal Design Considerations
6. Design Examples
7. Heat Sinks
8. Document Revision History for the Thermal Design User Guide: Agilex™ 5 FPGAs
A. Agilex™ 5 FPGA Product Keys and Package Drawings

2.1. Built-in Temperature Sensors

The Agilex™ 5 FPGA die is equipped with two types of temperature sensors: digital thermal sensors and thermal diode sensors. The locations of these sensors are fixed for each die.
  • Digital thermal sensors (dts) have no physical connection to device pins, and you must read their output values using temperature sensing software.
  • Thermal diode sensors (tds) have physical connections to the pins on the FPGA. To these pins you must connect an external temperature-reading device, such as the Maxim Integrated™ Max6581, Max 31730, or Texas Instrument™ TMP468 to read the temperatures.

Both digital thermal sensors and thermal diode sensors report the temperature of their physical location on the die, which may or may not be the hottest location on the die. For this reason, the temperature of these sensors is usually less than the maximum junction temperature settings in the PTC.

For more information on temperature sensors, refer to the Sensors section in chapter 4 of: Device Design Guidelines: Agilex™ 5 FPGAs and SoCs .

Thermal diode sensors cannot be calibrated at the factory, and should be calibrated by you for each circuit board design. The choice of the external reader and the board circuitry impacts the accuracy of the results. For further details on calibration of these sensors refer to:

AN 769: Intel FPGA Remote Temperature Sensing Diode Implementation Guide.

Note: Intel recommends that you use digital thermal sensors when possible.

The following table shows the number, type, and accuracy for the sensors for Agilex™ 5 devices. Note the accuracy changes at various temperature ranges, indicated in the table.

Table 2.   Agilex™ 5 FPGA Built-in Temperature Sensors
Die Number of Pinned-out Thermal Diode* Sensors Number of Digital thermal Sensors Digital Thermal Sensor Accuracy
90-–100⁰ C -40-–90⁰ C
Agilex™ 5 FPGA fabric core die 2 4–12 +/- 3⁰ C +/- 5⁰ C
* You should calibrate the thermal diode sensor for your design.

Section Content
Agilex 5 FPGA Temperature Rating

Level Two Title