Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

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ID 813955
Date 4/01/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package B15A 2.3.2. Package M16A 2.3.3. Package B18A 2.3.4. Package B23B 2.3.5. Package B23A 2.3.6. Package B32A
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. HPS 3.6. Transceiver 3.7. Power 3.8. Sensor
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.1.1. HSIO x
3.1.1.1. I/O Supply Consideration 3.1.1.2. HSIO Bank Count
3.1.2. HVIO x
3.1.2.1. I/O Supply Consideration 3.1.2.2. HVIO Bank Count
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 5 E-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. DDR4 Interfaces 3.4.2.2. DDR5 Interfaces 3.4.2.3. LPDDR4 Interfaces 3.4.2.4. LPDDR5 Interfaces
3.6. Transceiver x
3.6.1. Migration Overview for Transceiver Application 3.6.2. GTS Transceiver Bank Name Change between Device Variant 3.6.3. GTS Transceiver Resources Count 3.6.4. Pre-planning the board Design for Migration Support 3.6.5. Preserving Unused PMA Lanes
3.6.3. GTS Transceiver Resources Count x
3.6.3.1. Transceiver Lane Count 3.6.3.2. GTS Transceiver Hard IP Block Count 3.6.3.3. USB3.1 Hard IP 3.6.3.4. PERST Pin and HVIO REFCLK Pin 3.6.3.5. CVP Requirement 3.6.3.6. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins 3.6.3.7. System PLL in Downbonded Quads
3.6.3.6. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins x
3.6.3.6.1. GTS TX and GTS RX pin, and Reference Clock Pin 3.6.3.6.2. RCOMP_GTS Pins
3.6.4. Pre-planning the board Design for Migration Support x
3.6.4.1. CDR Clock Output Pin for Multi and Single Transceiver Banks per Side Device 3.6.4.2. HVIO PLL as Secondary System PLL
3.7. Power x
3.7.1. Power Rails for Migration 3.7.2. Voltage Regulator Considerations for Agilex™ 5 Migration
3.8. Sensor x
3.8.1. Temperature Sensor Location Support
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 5 E-Series Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

3.8.1. Temperature Sensor Location Support

The following diagram illustrate the temperature sensor and diode location for the Agilex™ 5 E-Series. The temperature sensor and diode location availability varies across device density support.

Figure 12. Temperature Sensor Location

The following table list out the temperature sensor and diode location availability across the Agilex™ 5 E-Series devices.

Table 13.  Temperature Sensor and Diode Location Availability
Sensor Location TSD Location Agilex™ 5 E-Series Devices

A5E 005B

A5E 007B

A5E 008B

A5E 013A

A5E 013B

A5E 028A

A5E 028B

A5E 043A

A5E 065A

A5E 043B

A5E 065B

A5E 052A

A5E 052B
0 1 Yes Yes Yes Yes
1 1 – Yes Yes Yes
2 – – Yes Yes
3 – Yes Yes Yes
4 – Yes Yes Yes
3 1 Yes Yes Yes Yes
2 – – – Yes
3 – – Yes Yes
4 1 Yes Yes Yes Yes
2 – – – –
3 – – – Yes
4 – Yes Yes Yes
5 – Yes Yes Yes

For more information regarding voltage and temperature sensor for Agilex™ 5 E-Series devices, refer to the Power Management User Guide: Agilex™ 5 FPGAs and SoCs.

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