Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

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ID 813955
Date 11/25/2024
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Migration Scope 3. Functional Area 4. Quartus® Prime Software Design Migration 5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series
2. Migration Scope x
2.1. Migration Supported Packages 2.2. Migration Scenarios 2.3. Considerations for Migration Planning
2.2. Migration Scenarios x
2.2.1. Vertical Migration 2.2.2. Conditional Migration
2.3. Considerations for Migration Planning x
2.3.1. Package B15A 2.3.2. Package M16A 2.3.3. Package B18A 2.3.4. Package B23B 2.3.5. Package B23A 2.3.6. Package B32A
3. Functional Area x
3.1. I/O 3.2. LVDS SERDES 3.3. Configuration 3.4. External Memory Interface 3.5. MIPI D-PHY 3.6. HPS 3.7. Transceiver 3.8. Power 3.9. Sensor 3.10. Pinout
3.1. I/O x
3.1.1. HSIO 3.1.2. HVIO
3.1.1. HSIO x
3.1.1.1. I/O Supply Consideration 3.1.1.2. HSIO Bank Count
3.1.2. HVIO x
3.1.2.1. I/O Supply Consideration 3.1.2.2. HVIO Bank Count
3.4. External Memory Interface x
3.4.1. External Memory Protocol Supported in Agilex™ 5 E-Series Devices 3.4.2. External Memory Interface Support 3.4.3. External Memory Interface Migration Consideration
3.4.2. External Memory Interface Support x
3.4.2.1. DDR4 Interfaces 3.4.2.2. DDR5 Interfaces 3.4.2.3. LPDDR4 Interfaces 3.4.2.4. LPDDR5 Interfaces
3.7. Transceiver x
3.7.1. Migration Overview for Transceiver Application 3.7.2. GTS Transceiver Bank Name Change between Device Variant 3.7.3. GTS Transceiver Resources Count 3.7.4. Pre-planning the board Design for Migration Support 3.7.5. Preserving Unused PMA Lanes
3.7.3. GTS Transceiver Resources Count x
3.7.3.1. Transceiver Lane Count 3.7.3.2. GTS Transceiver Hard IP Block Count 3.7.3.3. USB3.1 Hard IP 3.7.3.4. PERST Pin and HVIO REFCLK Pin 3.7.3.5. CVP Requirement 3.7.3.6. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins 3.7.3.7. System PLL in Downbonded Quads
3.7.3.6. GTS Transmitter (TX) and GTS Receiver (RX) pin, Reference Clock Pin, and RCOMP Pins x
3.7.3.6.1. GTS TX and GTS RX pin, and Reference Clock Pin 3.7.3.6.2. RCOMP_GTS Pins
3.7.4. Pre-planning the board Design for Migration Support x
3.7.4.1. CDR Clock Output Pin for Multi and Single Transceiver Banks per Side Device 3.7.4.2. HVIO PLL as Secondary System PLL
3.8. Power x
3.8.1. Power Rails for Migration 3.8.2. Voltage Regulator Considerations for Agilex™ 5 Migration
3.9. Sensor x
3.9.1. Temperature Sensor Location Support
3.10. Pinout x
3.10.1. Package B23A Requirements
4. Quartus® Prime Software Design Migration x
4.1. Migration via Migration GUI for Agilex™ 5 E-Series Devices
1. Introduction
2. Migration Scope
3. Functional Area
4. Quartus® Prime Software Design Migration
5. Document Revision History for Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

3.4.1. External Memory Protocol Supported in Agilex™ 5 E-Series Devices

Agilex™ 5 E-Series devices for Device Group A support DDR4, DDR5, LPDDR4, and LPDDR5 protocols while devices for Device Group B support DDR4, LPDDR4, and LPDDR5 protocols. All Agilex™ 5 E-Series devices only support component memory type.

Refer to the Agilex™ 5 FPGAs and SoCs Device Data Sheet for details of supported protocol in Device Group A and B.

The maximum number of External Memory Interface for each device depends on the number of HSIO banks and HSIO pin counts available in the device.

Refer to Package Options, Migrations, and I/O Pins for HSIO count availability for each device.
Related Information
4
  • HSIO – High-speed I/O
  • HVIO – High voltage I/O
  • LVDS – Low voltage differential signaling channels
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