Device Migration Guidelines: Agilex™ 5 FPGAs and SoCs E-Series

ID 813955
Date 7/26/2024
Public
Document Table of Contents

3.4.3. External Memory Interface Migration Consideration

When planning for device migration, consider which EMIF protocol/configuration are intended and plan it accordingly.

Refer to the migration path for Agilex™ 5 E-Series devices in the Considerations for Migration Planning section.

The maximum number of EMIF interfaces supported when migrating to device within package B15A, M16A, and B23A are same because all devices within each of these packages have the same number of HSIO counts.

Package B23B and B32A are available with different HSIO count devices. If you are migrating from a device with smaller HSIO counts to bigger HSIO counts, you can reuse the EMIF interface as it is fully supported. Considerations must be taken when you are migrating from bigger HSIO count devices to smaller HSIO count devices where you can only utilize the HSIO count of the smaller device to determine the maximum number of EMIF interface that can be supported.

Refer to the following documents for more information regarding External Memory Interface for Agilex™ 5 E-Series devices:
  • Agilex™ 5 Device Pin-Out Files
  • Pin Connection Guidelines: Agilex™ 5 FPGAs and SoCs
  • External Memory Interface Spec Estimator Tool
  • External Memory Interfaces (EMIF) IP User Guide: Agilex™ 5 FPGA and SoCs