Intel® Cyclone® 10 LP FPGA Evaluation Kit User Guide

ID 683580
Date 12/19/2019
Public
Document Table of Contents

4.2. Intel® Cyclone® 10 LP FPGA Overview

The Intel® Cyclone® 10 LP FPGA Evaluation Board features the Intel® Cyclone® 10 LP 10CL025YU256I7G FPGA device in a 256 pin Ultra FineLine BGA package.

The Intel® Cyclone® 10 LP FPGAs are optimized for low cost and low static power, making them ideal for high-volume and cost-sensitive applications.

Table 5.   Intel® Cyclone® 10 LP FPGA
Equivalent LEs M9K Memory Blocks M9K Memory Size (Kb) 18-bit x 18-bit multipliers PLLs Transceivers Package Type
25K 66 594 66 4 --- 256-pin UBGA (14 mm x 14 mm, 0.8 mm pitch)

Intel® Cyclone® 10 LP FPGA Feature Summary

Intel® Cyclone® 10 LP FPGA devices provide a high-density sea of programmable gates, on-board resources, and general purpose I/Os. These resources satisfy the requirements of I/O expansion and chip-to-chip interfacing. The Intel® Cyclone® 10 LP FPGA architecture suits smart and connected end applications across many market segments:
  • Industrial and automotive
  • Broadcast, wireline, and wireless
  • Compute and storage
  • Government, military, and aerospace
  • Medical, consumer, and smart energy
Table 6.  Summary of Features for Intel® Cyclone® 10 LP FPGA Devices
Feature Description

Technology

  • Low-cost, low-power FPGA fabric
  • 1.0 V and 1.2 V core voltage options
  • Available in commercial, industrial, and automotive temperature grades

Packaging

  • Several package types and footprints:
    • FineLine BGA (FBGA)
    • Enhanced Thin Quad Flat Pack (EQFP)
    • Ultra FineLine BGA (UBGA)
    • Micro FineLine BGA (MBGA)
  • Multiple device densities with pin migration capability
  • RoHS6 compliance

Core architecture

  • Logic elements (LEs)—four-input look-up table (LUT) and register
  • Abundant routing/metal interconnect between all LEs

Internal memory blocks

  • M9K—9-kilobits (Kb) of embedded SRAM memory blocks, cascadable
  • Configurable as RAM (single-port, simple dual port, or true dual port), FIFO buffers, or ROM
Embedded multiplier blocks
  • One 18 × 18 or two 9 × 9 multiplier modes, cascadable
  • Complete suite of DSP IPs for algorithmic acceleration

Clock networks

  • Global clocks that drive throughout entire device, feeding all device quadrants
  • Up to 15 dedicated clock pins that can drive up to 20 global clocks

Phase-locked loops (PLLs)

  • Up to four general purpose PLLs
  • Provides robust clock management and synthesis

General-purpose I/Os (GPIOs)

  • Multiple I/O standards support
  • Programmable I/O features
  • True LVDS and emulated LVDS transmitters and receivers
  • On-chip termination (OCT)
SEU mitigation SEU detection during configuration and operation

Configuration

  • Active serial (AS), passive serial (PS), fast passive parallel (FPP)
  • JTAG configuration scheme
  • Configuration data decompression
  • Remote system upgrade