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1. List of Abbreviations
2. Introduction
3. Intel® Stratix® 10 FPGA Package Mechanical Design
4. Intel® Stratix® 10 FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Stratix® 10 Devices
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices
7. Maximum Power and Typical Power
8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator
6.1. Device Selection
6.2. Logic Design Information
6.3. Thermal Settings and Parameters
6.4. Thermal Design Optimization
6.5. Updating Thermal Parameters
6.6. Intel® Stratix® 10 Device with PCIe Thermal Design Example 1
6.7. Heat Sink
6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method)
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6.5. Updating Thermal Parameters
The Intel® Stratix® 10 FPGA thermal design parameters are unique for every project. Thermal design parameters are mainly determined by the power, local power density, and power ratio of dies. Any change to the design requires design information to be updated accordingly in the Intel® FPGA Power and Thermal Calculator (PTC). That is, a set of thermal parameters calculated early in the project may no longer be valid if the FPGA utilization is changed later.
After you have compiled the RTL design, you should use the Intel® Quartus® Prime Power Analyzer to update the thermal parameters. A .qptc file can be exported out of the power analyzer and used in standalone PTC for ease of use if necessary.