AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

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ID 683387
Date 3/29/2021
Public
Document Table of Contents
Document Table of Contents x
1. List of Abbreviations 2. Introduction 3. Intel® Stratix® 10 FPGA Package Mechanical Design 4. Intel® Stratix® 10 FPGA Thermal Design Parameters 5. Thermal Design Process for Intel® Stratix® 10 Devices 6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices 7. Maximum Power and Typical Power 8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator
3. Intel® Stratix® 10 FPGA Package Mechanical Design x
3.1. Intel® Stratix® 10 Physical Package Structure
4. Intel® Stratix® 10 FPGA Thermal Design Parameters x
4.1. Intel® Stratix® 10 Compact Thermal Model (CTM) 4.2. Intel® Stratix® 10 Temperature Sensing 4.3. Thermal Sensor Accuracy
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices x
6.1. Device Selection 6.2. Logic Design Information 6.3. Thermal Settings and Parameters 6.4. Thermal Design Optimization 6.5. Updating Thermal Parameters 6.6. Intel® Stratix® 10 Device with PCIe Thermal Design Example 1 6.7. Heat Sink 6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method)
6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method) x
6.8.1. Analyzing 1U Sled with 3 FPGAs
1. List of Abbreviations
2. Introduction
3. Intel® Stratix® 10 FPGA Package Mechanical Design
4. Intel® Stratix® 10 FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Stratix® 10 Devices
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices
7. Maximum Power and Typical Power
8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

4.1. Intel® Stratix® 10 Compact Thermal Model (CTM)

The Intel® Stratix® 10 FPGA thermal analysis requires the use of its compact thermal model (CTM) in a computational fluid dynamic (CFD) tool. The results of the CFD analysis are valid only to determine the core fabric power and integrated heat spreader (IHS) temperature. You can use these values to determine the junction temperature of all the dies.

The CFD methodology is appropriate because the CTM does not capture the details of transceiver channel placements; therefore, it cannot predict the correct junction temperature of a transceiver die. The transceiver junction temperature is calculated using the total power dissipation, IHS temperature, and thermal resistance of each die.

The latest Intel® Stratix® 10 CTMs are offered in ECXML format, which is compatible with the following CFD tools:

  • Icepak* from ANSYS
  • Flotherm* from Mentor Graphics*
  • 6SigmaET* from Future Facilities

The CTM for some older devices is available only in .PDML and .TZR format, which are compatible with Flotherm* and Icepak* respectively. Contact your Intel® support representative to obtain CTM models.

If your company does not use any of the above CFD tools, Intel® can provide a step file of the CTM, by request. The step file model is compatible with other thermal tools, such as:
  • Thermal Analysis* from SolidWorks
  • Thermal Analysis by Autodesk
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