AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

ID 683387
Date 3/29/2021
Public

3.1. Intel® Stratix® 10 Physical Package Structure

Figure 1. Physical Package StructureThis is a typical package structure relevant to thermal analysis and as laid out in the compact thermal models. This package only shows the core fabric die and transceiver dies.
Figure 2. Package Top View