CFD |
Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems. |
CTM |
Compact Thermal Model, a geometric model that is used as an input to CFD tool. |
DTS |
Digital thermal sensor. |
FAE |
Field application engineer. |
EPE |
Early Power Estimator, a tool that estimates the power consumption of the FPGA device. |
FPGA |
Field Programmable Gate Array. |
HBM |
High Bandwidth Memory. |
IHS |
Integrated Heat Spreader - case of an Intel® Stratix® 10 FPGA. |
MCM |
Multi-Chip Module - an integrated circuit (IC) with more than one die. |
PTC |
Intel® FPGA Power and Thermal Calculator. |
RTL |
Register-transfer level. |
SCM |
Single Chip Module. |
TCASE |
Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die. |
TTP |
The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window. |
TDP |
Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes. |
TA |
Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink. |
TCORE |
Core Fabric Die Temperature. |
TJ |
Junction Temperature. |
TJ-MAX |
Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value. |
TIM |
Thermal Interface Material. |
TSD |
Temperature Sensor Diode. |
VID |
Voltage identification code. |