AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

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ID 683387
Date 3/29/2021
Public
Document Table of Contents
Document Table of Contents x
1. List of Abbreviations 2. Introduction 3. Intel® Stratix® 10 FPGA Package Mechanical Design 4. Intel® Stratix® 10 FPGA Thermal Design Parameters 5. Thermal Design Process for Intel® Stratix® 10 Devices 6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices 7. Maximum Power and Typical Power 8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator
3. Intel® Stratix® 10 FPGA Package Mechanical Design x
3.1. Intel® Stratix® 10 Physical Package Structure
4. Intel® Stratix® 10 FPGA Thermal Design Parameters x
4.1. Intel® Stratix® 10 Compact Thermal Model (CTM) 4.2. Intel® Stratix® 10 Temperature Sensing 4.3. Thermal Sensor Accuracy
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices x
6.1. Device Selection 6.2. Logic Design Information 6.3. Thermal Settings and Parameters 6.4. Thermal Design Optimization 6.5. Updating Thermal Parameters 6.6. Intel® Stratix® 10 Device with PCIe Thermal Design Example 1 6.7. Heat Sink 6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method)
6.8. Intel® Stratix® 10 Device with PCIe Thermal Design Example 2 (Alternate Method) x
6.8.1. Analyzing 1U Sled with 3 FPGAs
1. List of Abbreviations
2. Introduction
3. Intel® Stratix® 10 FPGA Package Mechanical Design
4. Intel® Stratix® 10 FPGA Thermal Design Parameters
5. Thermal Design Process for Intel® Stratix® 10 Devices
6. Power and Thermal Calculator (PTC) for Intel® Stratix® 10 Devices
7. Maximum Power and Typical Power
8. Document Revision History for AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

7. Maximum Power and Typical Power

Part of the power dissipated in an FPGA is static power, which is the power that the configured device consumes when powered up but with no user clocks operating. Static power is dependent on device size, device grade, power characteristics, and junction temperature. The static power for individual devices within a given batch, may not be identical at a given temperature.

For example, the Intel® Stratix® 10 1SM21BE device discussed in this document has a maximum static power of 48 watts if all its dies are at 100°C. It has a typical static power of 34 watts and a minimum static power of about 26 watts. So for this device the total power dissipation may vary by as much as 22 watts.

In recognition of the static power variation between devices, Intel recommends the following steps:

  • Always assume the maximum power for thermal and power supply calculations. This ensures that the resulting values remain valid in cases where individual devices are dissipating the maximum power.
  • Assume typical power when performing power and cooling calculations for large installations. For example, if a datacenter or central office is planning a large installation containing 10,000 1SM21BE devices, the difference in power consumption between the maximum and typical cases could be significant—as much as 140 kilowatts, plus another 140 kilowatts in cooling, depending on the power usage effectiveness (PUE) of the datacenter. When planning the power and cooling operating expenses (OPEX) for large installations, calculations based on typical power may deliver a more accurate result than calculations assuming maximum power.
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