AN 943: Thermal Modeling for Intel® Stratix® 10 FPGAs with the Intel® FPGA Power and Thermal Calculator

ID 683387
Date 3/29/2021
Public

3. Intel® Stratix® 10 FPGA Package Mechanical Design

An Intel® Stratix® 10 FPGA comes in a ball grid array (BGA) package with a copper integrated heat spreader (IHS). It can contain up to three types of dies, as follows:

  • Core fabric die. This is the main FPGA die, which contains the basic logic resources, and is available in various sizes and grades. All Intel® Stratix® 10 devices (except for the 1SG10MH_U1) have a single core fabric die.
  • Transceiver die. Transceiver dies are offered in four types: L-Tile, H-Tile, E- Tile and P-tile. Packages with E-Tile also have one H-Tile. Each transceiver tile type supports certain protocols and transceiver speeds. Depending on the package size, an Intel® Stratix® 10 device can support up to six transceiver dies. All dies have 24 transceiver channels, except for the P-tile dies which have 16 channels.
  • HBM die. The HBM die comes in two memory-die stack configurations: 4 high or 8 high. Not all Intel® Stratix® 10 packages have HBM, however those that do can have either one or two HBMs.