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1. About the External Memory Interfaces Agilex™ 5 FPGA IP
2. Agilex™ 5 FPGA EMIF IP – Introduction
3. Agilex™ 5 FPGA EMIF IP – Product Architecture
4. Agilex™ 5 FPGA EMIF IP – End-User Signals
5. Agilex™ 5 FPGA EMIF IP – Simulating Memory IP
6. Intel® Agilex™ 5 FPGA EMIF IP - DDR4 Support
7. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR4 Support
8. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR5 Support
9. Agilex™ 5 FPGA EMIF IP – Timing Closure
10. Agilex™ 5 FPGA EMIF IP – Controller Optimization
11. Agilex™ 5 FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces (EMIF) IP User Guide
3.2.1. Agilex™ 5 EMIF Architecture: I/O Subsystem
3.2.2. Agilex™ 5 EMIF Architecture: I/O SSM
3.2.3. Agilex™ 5 EMIF Architecture: HSIO Bank
3.2.4. Agilex™ 5 EMIF Architecture: I/O Lane
3.2.5. Agilex™ 5 EMIF Architecture: Input DQS Clock Tree
3.2.6. Agilex™ 5 EMIF Architecture: PHY Clock Tree
3.2.7. Agilex™ 5 EMIF Architecture: PLL Reference Clock Networks
3.2.8. Agilex™ 5 EMIF Architecture: Clock Phase Alignment
3.2.9. User Clock in Different Core Access Modes
6.4.3.1. 1 Rank x 8 Discrete (Memory Down) Topology
6.4.3.2. 1 Rank x 16 Discrete (Memory Down) Topology
6.4.3.3. VREF_CA/RESET Signal Routing Guidelines for 1 Rank x 8 and 1 Rank x 16 Discrete (Memory Down) Topology
6.4.3.4. Skew Matching Guidelines for DDR4 (Memory Down) Discrete Configurations
6.4.3.5. Power Delivery Recommendation for DDR4 Discrete Configurations
6.4.3.6. DDR4 Simulation Strategy
11.1. Interface Configuration Performance Issues
11.2. Functional Issue Evaluation
11.3. Timing Issue Characteristics
11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer
11.5. Generating Traffic with the Test Engine IP
11.6. Guidelines for Developing HDL for Traffic Generator
11.7. Hardware Debugging Guidelines
11.8. Create a Simplified Design that Demonstrates the Same Issue
11.9. Measure Power Distribution Network
11.10. Measure Signal Integrity and Setup and Hold Margin
11.11. Vary Voltage
11.12. Operate at a Lower Speed
11.13. Determine Whether the Issue Exists in Previous Versions of Software
11.14. Determine Whether the Issue Exists in the Current Version of Software
11.15. Try A Different PCB
11.16. Try Other Configurations
11.17. Debugging Checklist
11.18. Categorizing Hardware Issues
11.19. Signal Integrity Issues
11.20. Characteristics of Signal Integrity Issues
11.21. Evaluating Signal Integrity Issues
11.22. Skew
11.23. Crosstalk
11.24. Power System
11.25. Clock Signals
11.26. Address and Command Signals
11.27. Read Data Valid Window and Eye Diagram
11.28. Write Data Valid Window and Eye Diagram
11.29. Hardware and Calibration Issues
11.30. Memory Timing Parameter Evaluation
11.31. Verify that the Board Has the Correct Memory Component or DIMM Installed
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8.2.3. Pin Guidelines for Agilex™ 5 FPGA EMIF IP
The Agilex™ 5 FPGA contains I/O banks on the top and bottom edges of the device, which can be used by external memory interfaces.
Agilex™ 5 FPGA I/O banks contain 96 I/O pins. Each bank is divided into two sub-banks with 48 I/O pins in each. Sub-banks are further divided into four I/O lanes, where each I/O lane is a group of twelve I/O ports.
The I/O bank, I/O lane, and pairing pin for every physical I/O pin can be uniquely identified by the following naming convention in the device pin table:
- The I/O pins in a bank are represented as P#X#Y#, where:
- P# represents the pin number in a bank. It ranges from P0 to P95, for 96 pins in a bank.
- X# represents the bank number on a given edge of the device. X0 is the farthest bank from the zipper.
- Y# represents the top or bottom edge of the device. Y0 and Y1 refer to the I/O banks on the bottom and top edge, respectively.
- Because an IO96 bank comprises two IO48 sub-banks, all pins with P# value less than 48 (P# <48) belong to the same I/O sub-bank. All other pins belong to the second IO48 sub-bank.
- The Index Within I/O Bank value falls within one of the following ranges: 0 to 11, 12 to 23, 24 to 35, or 36 to 47, and represents one of I/O lanes 0, 1, 2, or 3, respectively.
- To determine whether I/O banks are adjacent, you can refer to the sub-bank-ordering figures for your device family in the Architecture: I/O Bank topic. In general, you can assume that I/O banks are adjacent within an I/O edge, unless the I/O bank is not bonded out on the package (indicated by the presence of the " - " symbol in the I/O table), or if the I/O bank does not contain 96 pins, indicating that it is only partially bonded out. If an I/O bank is not fully bonded out in a particular device, it cannot be included within the span of sub-banks for a larger external memory interface. In all cases, you should use the Quartus® Prime software to verify that your usage can be implemented.
- The pairing pin for an I/O pin is in the same I/O bank. You can identify the pairing pin by adding 1 to its Index Within I/O Bank number (if it is an even number), or by subtracting 1 from its Index Within I/O Bank number (if it is an odd number).