AN 1003: Multi Memory IP System Resource Planning: for Intel Agilex® 7 M-Series FPGAs

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ID 788295
Date 11/22/2023
Public
Document Table of Contents
Document Table of Contents x
1. Answers to Top FAQs 2. About This Application Note 3. Component Bandwidth Projections and Limitations 4. Resource Planning for Intel Agilex® 7 M-Series FPGAs 5. Factors Affecting NoC Performance 6. Debugging the NoC 7. Document Revision History of AN 1003: Multi Memory IP System Resource Planning for Intel Agilex® 7 M-Series FPGAs
2. About This Application Note x
2.1. Preliminary Guidelines 2.2. Document Prerequisites 2.3. Terminology for Intel Agilex® 7 M-Series FPGAs
3. Component Bandwidth Projections and Limitations x
3.1. Memory Controller Efficiency 3.2. Hard Memory NoC Bandwidth 3.3. Overall Bandwidth for NoC Systems
3.1. Memory Controller Efficiency x
3.1.1. HBM2E UIB Controller Efficiency 3.1.2. External Memory Interface Controller Efficiency
3.2. Hard Memory NoC Bandwidth x
3.2.1. Horizontal NoC Bandwidth 3.2.2. Initiator NoC Bandwidth 3.2.3. Target NoC Bandwidth 3.2.4. Initiator Target Link Bandwidth
4. Resource Planning for Intel Agilex® 7 M-Series FPGAs x
4.1. Hard Memory NoC Resource Planning Overview 4.2. I/O Bank Blockage 4.3. Planning Avalon® Streaming Utilization 4.4. Planning for Initiator Blockage Impact from GPIO, LVDS SERDES, and PHY Lite Bypass Mode 4.5. Planning NoC PLL and I/O PLL 4.6. Pin Planning for HPS EMIF 4.7. Planning for an External Memory Interface 4.8. Planning for HBM2E 4.9. Planning for the Fabric NoC 4.10. Planning for AXI4-Lite 4.11. Planning NoC and Memory Solution Clocks
4.2. I/O Bank Blockage x
4.2.1. Top Hard Memory NoC 4.2.2. Bottom Hard Memory NoC
4.10. Planning for AXI4-Lite x
4.10.1. Single AXI4 Lite Initiator for Each Horizontal NoC 4.10.2. AXI4-Lite Initiator for HBM2E 4.10.3. AXI4-Lite Initiator for EMIF
4.11. Planning NoC and Memory Solution Clocks x
4.11.1. Clocking without the Fabric NoC 4.11.2. Clocking with the Fabric NoC
5. Factors Affecting NoC Performance x
5.1. Recommended Performance Tuning Procedure 5.2. NoC Initiator and Target Clock Rate 5.3. Recommended NoC Design Topologies 5.4. Traffic Access Pattern and Memory Controller Efficiency 5.5. Traffic Access Pattern Due To Multiple Traffic Flows 5.6. Transaction Size 5.7. Congestion Interaction 5.8. Bandwidth Sharing At Each Switch 5.9. Exceeding NoC Bandwidth Limits 5.10. Maximum Number of Outstanding Transactions 5.11. QoS Priority 5.12. AxID 5.13. Example: 2x2 HBM Crossbars 5.14. Example: 16x16 Crossbar
5.3. Recommended NoC Design Topologies x
5.3.1. 1:1 Connectivity with EMIF and HBM 5.3.2. HBM Crossbars 5.3.3. Connectivity with HPS
6. Debugging the NoC x
6.1. Debugging NoC AXI Transaction Issues 6.2. Debugging NoC Bit Errors 6.3. Debugging NoC Performance Issues
6.3. Debugging NoC Performance Issues x
6.3.1. Measuring Performance with the Signal Tap Logic Analyzer 6.3.2. Measuring Performance with the Performance Monitor 6.3.3. Performance Debug Steps
1. Answers to Top FAQs
2. About This Application Note
3. Component Bandwidth Projections and Limitations
4. Resource Planning for Intel Agilex® 7 M-Series FPGAs
5. Factors Affecting NoC Performance
6. Debugging the NoC
7. Document Revision History of AN 1003: Multi Memory IP System Resource Planning for Intel Agilex® 7 M-Series FPGAs

4.6. Pin Planning for HPS EMIF

The External Memory Interfaces for HPS Intel FPGA IP supports the hard processor subsystem (HPS) to access external DRAM memory devices. HPS EMIF using I/O Banks 3C and 3D helps to illustrate the HPS configuration according to the notes that follow.
Figure 5. HPS EMIF using I/O Banks 3C and 3D


The following conditions apply to HPS EMIF using I/O Banks 3C and 3D:

  • You can use two GPIO-B banks (3C and 3D) adjacent to the HPS for HPS-EMIF. If you use only one GPIO-B bank for HPS-EMIF, that bank must be adjacent to the HPS (3D).
  • HPS MPFE has connections to two dedicated AXI4 initiators (INIU 20 and 21) and one AXI4 Lite initiator. MPFE does not support by-passing the NoC.
  • For I/O banks that you use for HPS-EMIF, you cannot use unused pins in those banks for any other I/O function.
  • If you use only I/O bank 3D for HPS EMIF, you can use I/O bank 3C for any other supported IO functions.
  • You cannot share reference clocks between HPS-EMIF IP and other IP.
  • If you use the DDR5 DIMM interface, you cannot use one channel for HPS EMIF and another for fabric EMIF.
  • There is no support for DDR4 x64 in HPS-EMIF.
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