Intel® Simics® Simulator for Intel® FPGAs: Intel Agilex® 5 E-Series Virtual Platform User Guide

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ID 786901
Date 12/04/2023
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Document Table of Contents
Document Table of Contents x
1. About This Document 2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platforms 3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models 4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model 5. Supported Use Cases A. Document Revision History
1. About This Document x
1.1. Terminology 1.2. List of Acronyms
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platforms x
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform x
2.1.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview 2.1.2. Intel Agilex® 5 E-Series Universal Virtual Platform User-Configurable Parameters 2.1.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities
2.1.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview x
2.1.1.1. Intel Agilex® 5 HPS Component 2.1.1.2. HPS Subsystem Component 2.1.1.3. FPGA Fabric Design 2.1.1.4. qsys_top Component 2.1.1.5. FPGA Component 2.1.1.6. Board Component 2.1.1.7. System Component 2.1.1.8. Target Script
2.1.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities x
2.1.3.1. Boot-To-Operating System Prompt 2.1.3.2. Basic Ethernet 2.1.3.3. CPU Power-On and Boot Core Selection 2.1.3.4. Reset Flow 2.1.3.5. General Purpose I/O (GPIO) Loopback 2.1.3.6. USB Disks Hot-Plug Support 2.1.3.7. On-Chip Memory IP FPGA Fabric Example Design 2.1.3.8. FPGA-to-HPS Bridges
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models x
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model 3.2. Virtual Platform HPS Subsystem Components 3.3. Virtual Platform qsys_top Components 3.4. Virtual Platform Board Components
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model x
3.1.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model Architecture 3.1.2. PSS Subsystem Components 3.1.3. MPU and APS Subsystem 3.1.4. MPFE Subsystem 3.1.5. Additional Intel Agilex® 5 E-Series HPS Components
3.2. Virtual Platform HPS Subsystem Components x
3.2.1. External Memory Interface (EMIF) 3.2.2. Security Device Manager (SDM)
3.3. Virtual Platform qsys_top Components x
3.3.1. FPGA Fabric
3.4. Virtual Platform Board Components x
3.4.1. Marvel EMAC PHY 3.4.2. SD Card device 3.4.3. ONFI NAND Memory Device 3.4.4. SPI Flash Device 3.4.5. AT24Cxx EEPROM Device 3.4.6. I3C Device 3.4.7. USB Disk Device 3.4.8. Intel® Simics® Text Console
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model x
4.1. Prerequisites 4.2. Intel® Simics® Simulation Setup for the Intel Agilex® 5 E-Series Device 4.3. Starting the Simulation 4.4. Getting Device Information from the Intel® Simics® Model
1. About This Document
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platforms
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model
5. Supported Use Cases
A. Document Revision History

3.4.6. I3C Device

This corresponds to an I3C testing device that supports reading and writing operations in a FIFO sequence with inverted loopback functionality. During write operations, data is written into an internal FIFO memory, then available in the memory can be read back. The internal FIFO has a size of 2048 bytes. The model supports Dynamic Address Assignment and handles RSTDAA. The model also handles the following common command codes by pushing to the FIFO corresponding data:

  • GETMWL
  • GETMRL
  • GETBCR
  • GETDCR
  • GETPID

The following parameters apply to this component:

  • pid: Corresponds to the provisional ID, a unique ID for dynamic address assigning. The possible configurable values are 0xFB1122330001, 0xFB1122330002, 0xFB1122330003, and 0xFB1122550001. Although this is a 64-bit parameter, only the lower 48 bits are valid.
  • dcr: This corresponds to the device characteristic register specifying the device function. The possible configurable values for this parameter are 0xE1, 0xE2, 0xE3, and 0xC6.
  • inverted_loopback and read_value : The inverted_loopback parameter is a boolean data set by default to false. When this parameter is set to true, the device acts as a FIFO in which all previously written bytes can be read back, applying a NOT bit-wise operation to each byte. In case the FIFO gets empty, the data in the read_value parameter is read. When the inverted_loopback parameter is set to false, the value set in the read_value parameter is also read back. The default value of the read_value parameter is 0xA5.
inverted_loopback parameter

FIFO Empty

Read Value

True

False

Read bit-wise inverted data of the data written in FIFO.

True

Read data in the read_value parameter.

False

Don’t care

Read data in the read_value parameter.

Component: i3c_device_comp

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