Intel® Simics® Simulator for Intel® FPGAs: Intel Agilex® 5 E-Series Virtual Platform User Guide

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ID 786901
Date 12/04/2023
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Document Table of Contents
Document Table of Contents x
1. About This Document 2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platforms 3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models 4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model 5. Supported Use Cases A. Document Revision History
1. About This Document x
1.1. Terminology 1.2. List of Acronyms
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platforms x
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform
2.1. Intel Agilex® 5 E-Series Universal Virtual Platform x
2.1.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview 2.1.2. Intel Agilex® 5 E-Series Universal Virtual Platform User-Configurable Parameters 2.1.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities
2.1.1. Intel Agilex® 5 E-Series Universal Virtual Platform Overview x
2.1.1.1. Intel Agilex® 5 HPS Component 2.1.1.2. HPS Subsystem Component 2.1.1.3. FPGA Fabric Design 2.1.1.4. qsys_top Component 2.1.1.5. FPGA Component 2.1.1.6. Board Component 2.1.1.7. System Component 2.1.1.8. Target Script
2.1.3. Intel Agilex® 5 E-Series Virtual Platform Key Capabilities x
2.1.3.1. Boot-To-Operating System Prompt 2.1.3.2. Basic Ethernet 2.1.3.3. CPU Power-On and Boot Core Selection 2.1.3.4. Reset Flow 2.1.3.5. General Purpose I/O (GPIO) Loopback 2.1.3.6. USB Disks Hot-Plug Support 2.1.3.7. On-Chip Memory IP FPGA Fabric Example Design 2.1.3.8. FPGA-to-HPS Bridges
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models x
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model 3.2. Virtual Platform HPS Subsystem Components 3.3. Virtual Platform qsys_top Components 3.4. Virtual Platform Board Components
3.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model x
3.1.1. Intel Agilex® 5 E-Series HPS Intel® Simics® Model Architecture 3.1.2. PSS Subsystem Components 3.1.3. MPU and APS Subsystem 3.1.4. MPFE Subsystem 3.1.5. Additional Intel Agilex® 5 E-Series HPS Components
3.2. Virtual Platform HPS Subsystem Components x
3.2.1. External Memory Interface (EMIF) 3.2.2. Security Device Manager (SDM)
3.3. Virtual Platform qsys_top Components x
3.3.1. FPGA Fabric
3.4. Virtual Platform Board Components x
3.4.1. Marvel EMAC PHY 3.4.2. SD Card device 3.4.3. ONFI NAND Memory Device 3.4.4. SPI Flash Device 3.4.5. AT24Cxx EEPROM Device 3.4.6. I3C Device 3.4.7. USB Disk Device 3.4.8. Intel® Simics® Text Console
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model x
4.1. Prerequisites 4.2. Intel® Simics® Simulation Setup for the Intel Agilex® 5 E-Series Device 4.3. Starting the Simulation 4.4. Getting Device Information from the Intel® Simics® Model
1. About This Document
2. Intel Agilex® 5 E-Series Intel® Simics® Virtual Platforms
3. Intel Agilex® 5 E-Series Virtual Platform Component Intel® Simics® Models
4. Running a Simulation with the Intel Agilex® 5 E-Series HPS Model
5. Supported Use Cases
A. Document Revision History

3.4.5. AT24Cxx EEPROM Device

AT24Cxx EEPROM device represents an Intel® Simics® model of the I2C AT24Cxx target device. It is based on ATMEL’s series of serial EEPROM. It supports basic read-write operations in the respective address locations. The controller can perform read or write to the EEPROM device. This can be connected to an I2C or I3C bus.

The following parameters apply to this component and can be configured at the time the component gets instantiated. They are not expected to be configured from the virtual platform target script.

  • eeprom_size : This corresponds to the size of the memory device in terms of the number of bytes. The possible values are 1 KB and 4 KB. Devices with a size of 1 KB supports 8-bit memory addressing. Devices with a size of 4 KB support 16-bit memory addressing.
  • I2c_address : This corresponds to the address of the device in the I2C or I3C bus. Several possible addresses could be used in the devices depending on the size of the memory and the type of bus to which this is connected. The following table describes the possible configurations supported:
Memory Size Bus Type Address Range Supported

1 KB (8-bit addressing)

I2C

0x54 - 0x57

I3C

0x50 - 0x53

4 KB (16-bit addressing)

I2C

0x50

I3C

0x54

Component: AT24Cxx_comp

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