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4.9.7. Cooling Design
The Intel® Stratix® 10 MX FPGA development kit utilizes air-cooled design to maintain proper cooling of the board at maximum loads. Air is forced to blow from the front to the rear of the enclosure by two 40 mm x 40 mm fans. It requires a total airflow of 22 CFM to cool the board with maximum power of 243 W at 25 °C. Top cover is required during operations for proper cooling of the board.
CAUTION:
Please ensure that the fan cable is connected during operation.