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1. About the External Memory Interfaces Agilex™ 5 FPGA IP
2. Agilex™ 5 FPGA EMIF IP – Introduction
3. Agilex™ 5 FPGA EMIF IP – Product Architecture
4. Agilex™ 5 FPGA EMIF IP – End-User Signals
5. Agilex™ 5 FPGA EMIF IP – Simulating Memory IP
6. Agilex™ 5 FPGA EMIF IP - DDR4 Support
7. Agilex™ 5 FPGA EMIF IP - DDR5 Support
8. Agilex™ 5 FPGA EMIF IP - LPDDR4 Support
9. Agilex™ 5 FPGA EMIF IP - LPDDR5 Support
10. Agilex™ 5 FPGA EMIF IP – Timing Closure
11. Agilex™ 5 FPGA EMIF IP – Controller Optimization
12. Agilex™ 5 FPGA EMIF IP – Debugging
13. Document Revision History for External Memory Interfaces (EMIF) IP User Guide
3.2.1. Agilex™ 5 EMIF Architecture: I/O Subsystem
3.2.2. Agilex™ 5 EMIF Architecture: I/O SSM
3.2.3. Agilex™ 5 EMIF Architecture: HSIO Bank
3.2.4. Agilex™ 5 EMIF Architecture: I/O Lane
3.2.5. Agilex™ 5 EMIF Architecture: Input DQS Clock Tree
3.2.6. Agilex™ 5 EMIF Architecture: PHY Clock Tree
3.2.7. Agilex™ 5 EMIF Architecture: PLL Reference Clock Networks
3.2.8. Agilex™ 5 EMIF Architecture: Clock Phase Alignment
3.2.9. User Clock in Different Core Access Modes
6.2.3.1. Address and Command Pin Placement for DDR4
6.2.3.2. DDR4 Data Width Mapping
6.2.3.3. General Guidelines
6.2.3.4. x4 DIMM Implementation
6.2.3.5. Specific Pin Connection Requirements
6.2.3.6. Command and Address Signals
6.2.3.7. Clock Signals
6.2.3.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.4.3.1. 1 Rank x 8 Discrete (Memory Down) Topology
6.4.3.2. 1 Rank x 16 Discrete (Memory Down) Topology
6.4.3.3. VREF_CA/RESET Signal Routing Guidelines for 1 Rank x 8 and 1 Rank x 16 Discrete (Memory Down) Topology
6.4.3.4. Skew Matching Guidelines for DDR4 (Memory Down) Discrete Configurations
6.4.3.5. Power Delivery Recommendation for DDR4 Discrete Configurations
6.4.3.6. DDR4 Simulation Strategy
12.1. Interface Configuration Performance Issues
12.2. Functional Issue Evaluation
12.3. Timing Issue Characteristics
12.4. Verifying Memory IP Using the Signal Tap Logic Analyzer
12.5. Debugging with the External Memory Interface Debug Toolkit
12.6. Generating Traffic with the Test Engine IP
12.7. Guidelines for Developing HDL for Traffic Generator
12.8. Guidelines for Traffic Generator Status Check
12.9. Hardware Debugging Guidelines
12.10. Create a Simplified Design that Demonstrates the Same Issue
12.11. Measure Power Distribution Network
12.12. Measure Signal Integrity and Setup and Hold Margin
12.13. Vary Voltage
12.14. Operate at a Lower Speed
12.15. Determine Whether the Issue Exists in Previous Versions of Software
12.16. Determine Whether the Issue Exists in the Current Version of Software
12.17. Try A Different PCB
12.18. Try Other Configurations
12.19. Debugging Checklist
12.20. Categorizing Hardware Issues
12.21. Signal Integrity Issues
12.22. Characteristics of Signal Integrity Issues
12.23. Evaluating Signal Integrity Issues
12.24. Skew
12.25. Crosstalk
12.26. Power System
12.27. Clock Signals
12.28. Address and Command Signals
12.29. Read Data Valid Window and Eye Diagram
12.30. Write Data Valid Window and Eye Diagram
12.31. Hardware and Calibration Issues
12.32. Memory Timing Parameter Evaluation
12.33. Verify that the Board Has the Correct Memory Component or DIMM Installed
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7.2.3.4. Command and Address Signals
Command and address signals in SDRAM devices are clocked into the memory device using the CK_T or CK_C signal. These pins operate at single data rate (SDR) using only one clock edge. The number of address pins depends on the SDRAM device capacity. The address pins are multiplexed, so two clock cycles are required to send the row, column, and bank address.
Although DDR5 operates in fundamentally the same way as other SDRAM, there are no dedicated pins for RAS_N, CAS_N, and WE_N, as those are shared with higher-order address pins. DDR5 has CS_N, CKE, ODT, and RESET_N pins, similar to DDR4. DDR5 also has some additional pins, including the ACT_N (activate) pin and BG (bank group) pins.