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2.1.1. Selecting Your External Memory Device
2.1.2. Selecting Your FPGA
2.1.3. Planning Your Pin Requirements
2.1.4. Planning Your FPGA Resources
2.1.5. Determining Your Board Layout
2.1.6. Specifying Parameters for Your External Memory Interface
2.1.7. Performing Functional Simulation
2.1.8. Adding Design Constraints
2.1.9. Compiling Your Design and Verifying Timing
2.1.10. Verifying and Debugging External Memory Interface Operation
3.1. DDR SDRAM Features
3.2. DDR2 SDRAM Features
3.3. DDR3 SDRAM Features
3.4. QDR, QDR II, and QDR II+ SRAM Features
3.5. RLDRAM II and RLDRAM 3 Features
3.6. LPDDR2 Features
3.7. Memory Selection
3.8. Example of High-Speed Memory in Embedded Processor
3.9. Example of High-Speed Memory in Telecom
3.10. Document Revision History
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4.2. I/O Interfaces
Ideally any interface should reside entirely in a single bank; however, interfaces that span across multiple adjacent banks or the entire side of a device are also fully supported.
Interfaces that span across sides (top and bottom, or left and right) and wraparound interfaces provide the same level of performance.
For information about the I/O interfaces supported for each device, and the locations of those I/O interfaces, refer to the I/O Features section in the appropriate device handbook.