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2.1.1. Selecting Your External Memory Device
2.1.2. Selecting Your FPGA
2.1.3. Planning Your Pin Requirements
2.1.4. Planning Your FPGA Resources
2.1.5. Determining Your Board Layout
2.1.6. Specifying Parameters for Your External Memory Interface
2.1.7. Performing Functional Simulation
2.1.8. Adding Design Constraints
2.1.9. Compiling Your Design and Verifying Timing
2.1.10. Verifying and Debugging External Memory Interface Operation
3.1. DDR SDRAM Features
3.2. DDR2 SDRAM Features
3.3. DDR3 SDRAM Features
3.4. QDR, QDR II, and QDR II+ SRAM Features
3.5. RLDRAM II and RLDRAM 3 Features
3.6. LPDDR2 Features
3.7. Memory Selection
3.8. Example of High-Speed Memory in Embedded Processor
3.9. Example of High-Speed Memory in Telecom
3.10. Document Revision History
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4.6.3. Device Package Size
Each FPGA family has a range of package sizes.
Package size refers to the actual size of an FPGA device and corresponds to the number of pin counts. For example,the package size for the smallest FPGA device in the Stratix IV family is 29 mm x 29 mm, categorized under the F780 package option, where F780 refers to a device with 780 pin counts.
For more information about the package size available for your device, refer to the respective device handbooks.