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2.1.1. Selecting Your External Memory Device
2.1.2. Selecting Your FPGA
2.1.3. Planning Your Pin Requirements
2.1.4. Planning Your FPGA Resources
2.1.5. Determining Your Board Layout
2.1.6. Specifying Parameters for Your External Memory Interface
2.1.7. Performing Functional Simulation
2.1.8. Adding Design Constraints
2.1.9. Compiling Your Design and Verifying Timing
2.1.10. Verifying and Debugging External Memory Interface Operation
3.1. DDR SDRAM Features
3.2. DDR2 SDRAM Features
3.3. DDR3 SDRAM Features
3.4. QDR, QDR II, and QDR II+ SRAM Features
3.5. RLDRAM II and RLDRAM 3 Features
3.6. LPDDR2 Features
3.7. Memory Selection
3.8. Example of High-Speed Memory in Embedded Processor
3.9. Example of High-Speed Memory in Telecom
3.10. Document Revision History
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2.1.5. Determining Your Board Layout
Before you can specify parameters for your external memory interface, you must determine the necessary board-related settings for your IP.
- Review the recommended board design guidelines for your external memory interface protocol.
- Select the termination scheme and drive strength settings for all the memory interface signals connected between the FPGA and the external memory device.
- Perform board-level simulations to determine the optimal settings for best signal integrity, appropriate timing margins, and sufficient eye opening.
- Successful board-level simulation is often an iterative process, experimenting with different combinations of drive strength, terminations, IP board parameters, and timing results.
- Ensure that your simulation applies the latest FPGA and memory device IBIS models, board trace characteristics, drive strength, and termination settings.
- You might identify board-level timing uncertainties such as crosstalk, ISI, or slew rate deration during simulation. If you identify such timing uncertainties, adjust the Board Settings in the IP Catalog with the slew rate deration, ISI/crosstalk, and board skews to ensure the accuracy of the timing margins report.