Visible to Intel only — GUID: hco1416490779864
Ixiasoft
2.1.1. Selecting Your External Memory Device
2.1.2. Selecting Your FPGA
2.1.3. Planning Your Pin Requirements
2.1.4. Planning Your FPGA Resources
2.1.5. Determining Your Board Layout
2.1.6. Specifying Parameters for Your External Memory Interface
2.1.7. Performing Functional Simulation
2.1.8. Adding Design Constraints
2.1.9. Compiling Your Design and Verifying Timing
2.1.10. Verifying and Debugging External Memory Interface Operation
3.1. DDR SDRAM Features
3.2. DDR2 SDRAM Features
3.3. DDR3 SDRAM Features
3.4. QDR, QDR II, and QDR II+ SRAM Features
3.5. RLDRAM II and RLDRAM 3 Features
3.6. LPDDR2 Features
3.7. Memory Selection
3.8. Example of High-Speed Memory in Embedded Processor
3.9. Example of High-Speed Memory in Telecom
3.10. Document Revision History
Visible to Intel only — GUID: hco1416490779864
Ixiasoft
4.6.2. Device Operating Temperature
The operating temperature of the FPGA is divided into the following categories:
- Commercial grade—Used for all device families. The operating temperature range from 0 degrees C to 85 degrees C.
- Industrial grade—Used for all device families. The operating temperature range from -40 degrees C to 100 degrees C.
- Military grade—Used for Stratix IV device family only. The operating temperature range from -55 degrees C to 125 degrees C.
- Automotive grade—Used for Cyclone V device families only. The operating temperature range from -40 degrees C to 125 degrees C.