2024.10.09 |
Updated information about PCS features in E-Tile transceivers. |
2024.04.01 |
- Updated the ethernet MAC row in the table listing the features specific to Agilex 7 SoCs.
- Added package 3184E with F-Tile ×2 and R-Tile ×2 (package code R31E) for the AGI 041 device.
- Removed package 3695A.
- Retitled "Available Options" to "Part Number Decoder".
- Updated the figure showing the ordering part number:
- Added package 3184E to I-Series FPGAs.
- Removed package 3695A from M-Series FPGAs.
- Added optional suffixes B and C.
- Added links to updated lists of available Agilex™ 7 FPGAs and SoCs.
- In the summary of Agilex™ 7 SoCs key features, updated the eMMC support from version 4.5 to 5.0.
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2023.10.31 |
- Added package 2340A with F-Tile ×1 (package code R24D) for AGF 006, AGF 008, AGF 012, and AGF 014 devices.
- Added package 3184B to M-Series FPGAs.
- Removed package 3695B from M-Series FPGAs.
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2023.09.07 |
Removed Ethernet AVB from the list of Ethernet standards that the HPS supports. |
2023.07.05 |
Corrected typographical error in the table summarizing the device family features. |
2023.04.19 |
- Added package 3184B to the AGI 041 device.
- Removed packages 3184B and 3687A from M-Series FPGAs.
- Added packages 3695A and 3695B to M-Series FPGAs.
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2023.02.20 |
Added the AGI 041 device. |
2023.01.10 |
- Moved all D-Series information to new Intel® Agilex™ 5 FPGAs and SoCs Device Overview
- Updated product family name to " Intel® Agilex™ 7 FPGAs and SoCs"
- Updated the I-Series FPGA packages
- Added CXL* column to package 1085A
- Added package 3184A
- Updated the figure showing the ordering part numbers
- Updated the table that lists the tile types, hardened IPs, and applications
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2022.09.26 |
- Added the D-Series FPGAs and SoCs
- Restructured and rewrote the document
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2022.06.09 |
- Updated the ordering part numbers
- Removed the 3184A package
- Added information about FHT and FGT transceivers
- Added M-Series FPGAs with F-Tile and HBM2E package options
- Updated the figure showing the hard memory controller
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2022.04.06 |
Updated package code "R19A" to "R18A" in the ordering part number. |
2022.03.06 |
- Revised key innovations in Agilex™ 7 FPGAs and SoCs:
- DDR5 supports up to 5600 Mbps per pin
- Intel 7 technology in the M-Series
- Added Agilex™ 7 SoC FPGAs M-Series
- Added M-Series in the Agilex™ 7 Ordering Part Number (OPN) figure
- Added block diagram for the M-Series in the Agilex™ 7 FPGA and SoC Block Diagram
- Added support for the M-Series FPGAs and SoCs including the AGM 032 and AGM 039 devices
- Added Heterogeneous 3D Stacked HBM2E DRAM Memory
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2021.12.05 |
- Updated Agilex™ 7 FPGA and SoC Device Overview
- Globally revised key innovations in Agilex™ 7 FPGAs and SoCs:
- Device densities of up to 4 million equivalent logic elements
- Configurable networking support is up to 6 x 400G or 12 x 200G in a single device
- Over 25K of 18x19 multipliers, or over 50K of 9x9 multipliers in a single device
- Over 389 Mb of embedded RAM in the largest device
- Updated description of the following features in the Feature Summary table:
- Technology
- General purpose I/Os
- Core clock networks
- Packaging
- Globally added AGI 035 and AGI 040 devices support for the I-Series
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2021.07.22 |
Added Adaptive Logic Modules (ALM) count in the Agilex™ 7 FPGAs and SoCs F-Series Family Plan and Agilex™ 7 FPGAs and SoCs I-Series Family Plan tables. |
2021.06.21 |
- Updated Agilex™ 7 FPGA and SoC Device Overview
- Renamed 10nm FinFET process Technology to 10nm SuperFin Technology
- Updated specification and package code in the Agilex™ 7 FPGAs and SoCs Ordering Part Number (OPN) figure
- Added new high-performance crypto blocks feature
- Globally added AGF 014 and AGF 022 devices support for the F-Series FPGAs
- Globally added AGI 019 and AGI 023 devices support for the I-Series FPGAs
- Added new topic: High-Performance Crypto Block
- Revised figures and diagrams.
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2021.04.19 |
Sections Updated:
- Available Options
- Agilex™ 7 FPGA and SoC Family Plan
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2021.03.23 |
Sections Updated:
- Agilex™ 7 SoC FPGAs M-Series
- Available Options
- Agilex™ 7 FPGA and SoC Summary of Features
- Agilex™ 7 FPGA and SoC Family Plan
- Heterogeneous 3D SiP Transceiver Tile
- Agilex™ 7 FPGA Transceivers
- External Memory and General Purpose I/O
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2020.09.30 |
Sections Updated:
- Agilex™ 7 FPGA and SoC Device Overview
- Agilex™ 7 FPGA and SoC Summary of Features
- Agilex™ 7 FPGA and SoC Family Plan
- Hyperflex® Core Architecture
- Agilex™ 7 FPGA Transceivers
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2019.07.02 |
Sections Updated:
- Agilex™ 7 FPGA and SoC Device Overview
- Agilex™ 7 FPGA and SoC Family Variants
- Agilex™ 7 SoC FPGAs F-Series
- Agilex™ 7 SoC FPGAs I-Series
- Agilex™ 7 SoC FPGAs M-Series
- Common Features
- Available Options
- FPGA and SoC Summary of Features
- FPGA and SoC Family Plan
- Hyperflex® Core Architecture
- Heterogeneous 3D SiP Transceiver Tile
- PCS Features
- P-Tile Transceivers
- External Memory and General Purpose I/O
- Adaptive Logic Module (ALM)
- Internal Embedded Memory
- Variable Precision DSP
- Device Security
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2019.04.02 |
Initial Release |