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1.1.1.4.1. Supply Current and Power Consumption
1.1.1.4.2. I/O Pin Leakage Current
1.1.1.4.3. Bus Hold Specifications
1.1.1.4.4. OCT Calibration Accuracy Specifications
1.1.1.4.5. OCT Without Calibration Resistance Tolerance Specifications
1.1.1.4.6. OCT Variation after Power-Up Calibration
1.1.1.4.7. Pin Capacitance
1.1.1.4.8. Hot Socketing
1.1.1.4.9. Internal Weak Pull-Up Resistor
1.1.1.5.1. Single-Ended I/O Standards
1.1.1.5.2. Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications
1.1.1.5.3. Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications
1.1.1.5.4. Differential SSTL I/O Standards
1.1.1.5.5. Differential HSTL and HSUL I/O Standards
1.1.1.5.6. Differential I/O Standard Specifications
1.2.1.1. Transceiver Specifications for Arria V GX and SX Devices
1.2.1.2. Transceiver Specifications for Arria V GT and ST Devices
1.2.1.3. CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain
1.2.1.4. CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain
1.2.1.5. Typical TX VOD Setting for Arria® V Transceiver Channels with termination of 100 Ω
1.2.1.6. Transmitter Pre-Emphasis Levels
1.2.1.7. Transceiver Compliance Specification
1.2.3.1. High-Speed I/O Specifications
1.2.3.2. DPA Lock Time Specifications
1.2.3.3. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications
1.2.3.4. DLL Frequency Range Specifications
1.2.3.5. DQS Logic Block Specifications
1.2.3.6. Memory Output Clock Jitter Specifications
1.2.3.7. OCT Calibration Block Specifications
1.2.3.8. Duty Cycle Distortion (DCD) Specifications
1.2.4.1. HPS Clock Performance
1.2.4.2. HPS PLL Specifications
1.2.4.3. Quad SPI Flash Timing Characteristics
1.2.4.4. SPI Timing Characteristics
1.2.4.5. SD/MMC Timing Characteristics
1.2.4.6. USB Timing Characteristics
1.2.4.7. Ethernet Media Access Controller (EMAC) Timing Characteristics
1.2.4.8. I2C Timing Characteristics
1.2.4.9. NAND Timing Characteristics
1.2.4.10. Arm* Trace Timing Characteristics
1.2.4.11. UART Interface
1.2.4.12. GPIO Interface
1.2.4.13. HPS JTAG Timing Specifications
1.3.1. POR Specifications
1.3.2. FPGA JTAG Configuration Timing
1.3.3. FPP Configuration Timing
1.3.4. Active Serial (AS) Configuration Timing
1.3.5. DCLK Frequency Specification in the AS Configuration Scheme
1.3.6. Passive Serial (PS) Configuration Timing
1.3.7. Initialization
1.3.8. Configuration Files
1.3.9. Minimum Configuration Time Estimation
1.3.10. Remote System Upgrades
1.3.11. User Watchdog Internal Oscillator Frequency Specifications
2.2.3.1.1. High-Speed Clock Specifications
2.2.3.1.2. Transmitter High-Speed I/O Specifications
2.2.3.1.3. Receiver High-Speed I/O Specifications
2.2.3.1.4. DPA Mode High-Speed I/O Specifications
2.2.3.1.5. Soft CDR Mode High-Speed I/O Specifications
2.2.3.1.6. Non DPA Mode High-Speed I/O Specifications
2.3.1. POR Specifications
2.3.2. JTAG Configuration Specifications
2.3.3. Fast Passive Parallel (FPP) Configuration Timing
2.3.4. Active Serial Configuration Timing
2.3.5. Passive Serial Configuration Timing
2.3.6. Initialization
2.3.7. Configuration Files
2.3.8. Remote System Upgrades Circuitry Timing Specification
2.3.9. User Watchdog Internal Oscillator Frequency Specification
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2.3.3.3. FPP Configuration Timing when DCLK to DATA[] > 1
Figure 30. FPP Configuration Timing Waveform When the DCLK-to-DATA[] Ratio is >1 , Timing when using a MAX® II device, MAX® V device, or microprocessor as an external host.
Symbol | Parameter | Minimum | Maximum | Unit |
---|---|---|---|---|
tCF2CD | nCONFIG low to CONF_DONE low | — | 600 | ns |
tCF2ST0 | nCONFIG low to nSTATUS low | — | 600 | ns |
tCFG | nCONFIG low pulse width | 2 | — | μs |
tSTATUS | nSTATUS low pulse width | 268 | 1,506 214 | μs |
tCF2ST1 | nCONFIG high to nSTATUS high | — | 1,506 215 | μs |
tCF2CK 216 | nCONFIG high to first rising edge on DCLK | 1,506 | — | μs |
tST2CK 216 | nSTATUS high to first rising edge of DCLK | 2 | — | μs |
tDSU | DATA[] setup time before rising edge on DCLK | 5.5 | — | ns |
tDH | DATA[] hold time after rising edge on DCLK | N–1/fDCLK 217 | — | s |
tCH | DCLK high time | 0.45 × 1/fMAX | — | s |
tCL | DCLK low time | 0.45 × 1/fMAX | — | s |
tCLK | DCLK period | 1/fMAX | — | s |
fMAX | DCLK frequency (FPP ×8/×16) | — | 125 | MHz |
DCLK frequency (FPP ×32) | — | 100 | MHz | |
tR | Input rise time | — | 40 | ns |
tF | Input fall time | — | 40 | ns |
tCD2UM | CONF_DONE high to user mode 218 | 175 | 437 | μs |
tCD2CU | CONF_DONE high to CLKUSR enabled | 4 × maximum DCLK period | — | — |
tCD2UMC | CONF_DONE high to user mode with CLKUSR option on | tCD2CU + (8576 × CLKUSR period) 219 | — | — |
214 You can obtain this value if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.
215 You can obtain this value if you do not delay configuration by externally holding the nSTATUS low.
216 If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
217 N is the DCLK-to-DATA ratio and fDCLK is the DCLK frequency the system is operating.
218 The minimum and maximum numbers apply only if you use the internal oscillator as the clock source for initializing the device.
219 To enable the CLKUSR pin as the initialization clock source and to obtain the maximum frequency specification on these pins, refer to the Initialization section of the Configuration, Design Security, and Remote System Upgrades in Arria V Devices chapter.