Arria® V Device Datasheet

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ID 683022
Date 5/23/2023
Public
Document Table of Contents
Document Table of Contents x
1. Arria® V GX, GT, SX, and ST Device Datasheet 2. Arria V GZ Device Datasheet
1. Arria® V GX, GT, SX, and ST Device Datasheet x
1.1. Electrical Characteristics 1.2. Switching Characteristics 1.3. Configuration Specifications 1.4. I/O Timing 1.5. Glossary 1.6. Arria® V GX, GT, SX, and ST Device Datasheet Revision History
1.1. Electrical Characteristics x
1.1.1. Operating Conditions
1.1.1. Operating Conditions x
1.1.1.1. Absolute Maximum Ratings 1.1.1.2. Maximum Allowed Overshoot and Undershoot Voltage 1.1.1.3. Recommended Operating Conditions 1.1.1.4. DC Characteristics 1.1.1.5. I/O Standard Specifications
1.1.1.3. Recommended Operating Conditions x
1.1.1.3.1. Recommended Operating Conditions 1.1.1.3.2. Transceiver Power Supply Operating Conditions 1.1.1.3.3. HPS Power Supply Operating Conditions
1.1.1.4. DC Characteristics x
1.1.1.4.1. Supply Current and Power Consumption 1.1.1.4.2. I/O Pin Leakage Current 1.1.1.4.3. Bus Hold Specifications 1.1.1.4.4. OCT Calibration Accuracy Specifications 1.1.1.4.5. OCT Without Calibration Resistance Tolerance Specifications 1.1.1.4.6. OCT Variation after Power-Up Calibration 1.1.1.4.7. Pin Capacitance 1.1.1.4.8. Hot Socketing 1.1.1.4.9. Internal Weak Pull-Up Resistor
1.1.1.5. I/O Standard Specifications x
1.1.1.5.1. Single-Ended I/O Standards 1.1.1.5.2. Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications 1.1.1.5.3. Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications 1.1.1.5.4. Differential SSTL I/O Standards 1.1.1.5.5. Differential HSTL and HSUL I/O Standards 1.1.1.5.6. Differential I/O Standard Specifications
1.2. Switching Characteristics x
1.2.1. Transceiver Performance Specifications 1.2.2. Core Performance Specifications 1.2.3. Periphery Performance 1.2.4. HPS Specifications
1.2.1. Transceiver Performance Specifications x
1.2.1.1. Transceiver Specifications for Arria V GX and SX Devices 1.2.1.2. Transceiver Specifications for Arria V GT and ST Devices 1.2.1.3. CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain 1.2.1.4. CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain 1.2.1.5. Typical TX VOD Setting for Arria® V Transceiver Channels with termination of 100 Ω 1.2.1.6. Transmitter Pre-Emphasis Levels 1.2.1.7. Transceiver Compliance Specification
1.2.2. Core Performance Specifications x
1.2.2.1. Clock Tree Specifications 1.2.2.2. PLL Specifications 1.2.2.3. DSP Block Performance Specifications 1.2.2.4. Memory Block Performance Specifications 1.2.2.5. Internal Temperature Sensing Diode Specifications
1.2.3. Periphery Performance x
1.2.3.1. High-Speed I/O Specifications 1.2.3.2. DPA Lock Time Specifications 1.2.3.3. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications 1.2.3.4. DLL Frequency Range Specifications 1.2.3.5. DQS Logic Block Specifications 1.2.3.6. Memory Output Clock Jitter Specifications 1.2.3.7. OCT Calibration Block Specifications 1.2.3.8. Duty Cycle Distortion (DCD) Specifications
1.2.4. HPS Specifications x
1.2.4.1. HPS Clock Performance 1.2.4.2. HPS PLL Specifications 1.2.4.3. Quad SPI Flash Timing Characteristics 1.2.4.4. SPI Timing Characteristics 1.2.4.5. SD/MMC Timing Characteristics 1.2.4.6. USB Timing Characteristics 1.2.4.7. Ethernet Media Access Controller (EMAC) Timing Characteristics 1.2.4.8. I2C Timing Characteristics 1.2.4.9. NAND Timing Characteristics 1.2.4.10. Arm* Trace Timing Characteristics 1.2.4.11. UART Interface 1.2.4.12. GPIO Interface 1.2.4.13. HPS JTAG Timing Specifications
1.2.4.2. HPS PLL Specifications x
1.2.4.2.1. HPS PLL VCO Frequency Range 1.2.4.2.2. HPS PLL Input Clock Range 1.2.4.2.3. HPS PLL Input Jitter
1.3. Configuration Specifications x
1.3.1. POR Specifications 1.3.2. FPGA JTAG Configuration Timing 1.3.3. FPP Configuration Timing 1.3.4. Active Serial (AS) Configuration Timing 1.3.5. DCLK Frequency Specification in the AS Configuration Scheme 1.3.6. Passive Serial (PS) Configuration Timing 1.3.7. Initialization 1.3.8. Configuration Files 1.3.9. Minimum Configuration Time Estimation 1.3.10. Remote System Upgrades 1.3.11. User Watchdog Internal Oscillator Frequency Specifications
1.3.3. FPP Configuration Timing x
1.3.3.1. DCLK-to-DATA[] Ratio (r) for FPP Configuration 1.3.3.2. FPP Configuration Timing when DCLK-to-DATA[] = 1 1.3.3.3. FPP Configuration Timing when DCLK-to-DATA[] >1
1.4. I/O Timing x
1.4.1. Programmable IOE Delay 1.4.2. Programmable Output Buffer Delay
2. Arria V GZ Device Datasheet x
2.1. Electrical Characteristics 2.2. Switching Characteristics 2.3. Configuration Specification 2.4. I/O Timing 2.5. Glossary 2.6. Arria® V GZ Device Datasheet Revision History
2.1. Electrical Characteristics x
2.1.1. Operating Conditions
2.1.1. Operating Conditions x
2.1.1.1. Absolute Maximum Ratings 2.1.1.2. Maximum Allowed Overshoot and Undershoot Voltage 2.1.1.3. Recommended Operating Conditions 2.1.1.4. DC Characteristics 2.1.1.5. I/O Standard Specifications
2.1.1.3. Recommended Operating Conditions x
2.1.1.3.1. Recommended Transceiver Power Supply Operating Conditions 2.1.1.3.2. Transceiver Power Supply Requirements
2.1.1.4. DC Characteristics x
2.1.1.4.1. Supply Current 2.1.1.4.2. Power Consumption 2.1.1.4.3. I/O Pin Leakage Current 2.1.1.4.4. Bus Hold Specifications 2.1.1.4.5. On-Chip Termination (OCT) Specifications 2.1.1.4.6. Pin Capacitance 2.1.1.4.7. Hot Socketing 2.1.1.4.8. Internal Weak Pull-Up Resistor
2.2. Switching Characteristics x
2.2.1. Transceiver Performance Specifications 2.2.2. Core Performance Specifications 2.2.3. Periphery Performance
2.2.1. Transceiver Performance Specifications x
2.2.1.1. Reference Clock 2.2.1.2. Transceiver Clocks 2.2.1.3. Receiver 2.2.1.4. Transmitter 2.2.1.5. CMU PLL 2.2.1.6. ATX PLL 2.2.1.7. Fractional PLL 2.2.1.8. Clock Network Data Rate 2.2.1.9. Standard PCS Data Rate 2.2.1.10. 10G PCS Data Rate 2.2.1.11. Typical VOD Settings
2.2.2. Core Performance Specifications x
2.2.2.1. Clock Tree Specifications 2.2.2.2. PLL Specifications 2.2.2.3. DSP Block Specifications 2.2.2.4. Memory Block Specifications 2.2.2.5. Temperature Sensing Diode Specifications
2.2.3. Periphery Performance x
2.2.3.1. High-Speed I/O Specification 2.2.3.2. DLL Range Specifications 2.2.3.3. DQS Logic Block Specifications 2.2.3.4. Memory Output Clock Jitter Specifications 2.2.3.5. OCT Calibration Block Specifications 2.2.3.6. Duty Cycle Distortion (DCD) Specifications
2.2.3.1. High-Speed I/O Specification x
2.2.3.1.1. High-Speed Clock Specifications 2.2.3.1.2. Transmitter High-Speed I/O Specifications 2.2.3.1.3. Receiver High-Speed I/O Specifications 2.2.3.1.4. DPA Mode High-Speed I/O Specifications 2.2.3.1.5. Soft CDR Mode High-Speed I/O Specifications 2.2.3.1.6. Non DPA Mode High-Speed I/O Specifications
2.3. Configuration Specification x
2.3.1. POR Specifications 2.3.2. JTAG Configuration Specifications 2.3.3. Fast Passive Parallel (FPP) Configuration Timing 2.3.4. Active Serial Configuration Timing 2.3.5. Passive Serial Configuration Timing 2.3.6. Initialization 2.3.7. Configuration Files 2.3.8. Remote System Upgrades Circuitry Timing Specification 2.3.9. User Watchdog Internal Oscillator Frequency Specification
2.3.3. Fast Passive Parallel (FPP) Configuration Timing x
2.3.3.1. DCLK-to-DATA[] Ratio (r) for FPP Configuration 2.3.3.2. FPP Configuration Timing when DCLK to DATA[] = 1 2.3.3.3. FPP Configuration Timing when DCLK to DATA[] > 1
2.4. I/O Timing x
2.4.1. Programmable IOE Delay 2.4.2. Programmable Output Buffer Delay
1. Arria® V GX, GT, SX, and ST Device Datasheet
2. Arria V GZ Device Datasheet

1.2.4.5. SD/MMC Timing Characteristics

Table 54.  Secure Digital (SD)/MultiMediaCard (MMC) Timing Requirements for Arria® V Devices

After power up or cold reset, the Boot ROM uses drvsel = 3 and smplsel = 0 to execute the code. At the same time, the SD/MMC controller enters the Identification Phase followed by the Data Phase. During this time, the value of interface output clock SDMMC_CLK_OUT changes from a maximum of 400 kHz (Identification Phase) up to a maximum of 12.5 MHz (Data Phase), depending on the internal reference clock SDMMC_CLK and the CSEL setting. The value of SDMMC_CLK is based on the external oscillator frequency and has a maximum value of 50 MHz.

After the Boot ROM code exits and control is passed to the preloader, software can adjust the value of drvsel and smplsel via the system manager. drvsel can be set from 1 to 7 and smplsel can be set from 0 to 7. While the preloader is executing, the values for SDMMC_CLK and SDMMC_CLK_OUT increase to a maximum of 200 MHz and 50 MHz respectively.

Symbol Description Min Max Unit
Tsdmmc_clk (internal reference clock) SDMMC_CLK clock period (Identification mode) 20 — ns
SDMMC_CLK clock period (Default speed mode) 5 — ns
SDMMC_CLK clock period (High speed mode) 5 — ns
Tsdmmc_clk_out (interface output clock) SDMMC_CLK_OUT clock period (Identification mode) 2500 — ns
SDMMC_CLK_OUT clock period (Default speed mode) 40 — ns
SDMMC_CLK_OUT clock period (High speed mode) 20 — ns
Tdutycycle SDMMC_CLK_OUT duty cycle 45 55 %
Td SDMMC_CMD/SDMMC_D output delay (Tsdmmc_clk × drvsel)/2 – 1.23 88 (Tsdmmc_clk × drvsel)/2 + 1.69 88 ns
Tsu Input setup time 1.05 – (Tsdmmc_clk × smplsel)/2 89 — ns
Th Input hold time (Tsdmmc_clk × smplsel)/2 89 — ns
Figure 12. SD/MMC Timing Diagram


Related Information
88 drvsel is the drive clock phase shift select value.
89 smplsel is the sample clock phase shift select value.
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