Arria® V Device Datasheet

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ID 683022
Date 5/23/2023
Public
Document Table of Contents
Document Table of Contents x
1. Arria® V GX, GT, SX, and ST Device Datasheet 2. Arria V GZ Device Datasheet
1. Arria® V GX, GT, SX, and ST Device Datasheet x
1.1. Electrical Characteristics 1.2. Switching Characteristics 1.3. Configuration Specifications 1.4. I/O Timing 1.5. Glossary 1.6. Arria® V GX, GT, SX, and ST Device Datasheet Revision History
1.1. Electrical Characteristics x
1.1.1. Operating Conditions
1.1.1. Operating Conditions x
1.1.1.1. Absolute Maximum Ratings 1.1.1.2. Maximum Allowed Overshoot and Undershoot Voltage 1.1.1.3. Recommended Operating Conditions 1.1.1.4. DC Characteristics 1.1.1.5. I/O Standard Specifications
1.1.1.3. Recommended Operating Conditions x
1.1.1.3.1. Recommended Operating Conditions 1.1.1.3.2. Transceiver Power Supply Operating Conditions 1.1.1.3.3. HPS Power Supply Operating Conditions
1.1.1.4. DC Characteristics x
1.1.1.4.1. Supply Current and Power Consumption 1.1.1.4.2. I/O Pin Leakage Current 1.1.1.4.3. Bus Hold Specifications 1.1.1.4.4. OCT Calibration Accuracy Specifications 1.1.1.4.5. OCT Without Calibration Resistance Tolerance Specifications 1.1.1.4.6. OCT Variation after Power-Up Calibration 1.1.1.4.7. Pin Capacitance 1.1.1.4.8. Hot Socketing 1.1.1.4.9. Internal Weak Pull-Up Resistor
1.1.1.5. I/O Standard Specifications x
1.1.1.5.1. Single-Ended I/O Standards 1.1.1.5.2. Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications 1.1.1.5.3. Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications 1.1.1.5.4. Differential SSTL I/O Standards 1.1.1.5.5. Differential HSTL and HSUL I/O Standards 1.1.1.5.6. Differential I/O Standard Specifications
1.2. Switching Characteristics x
1.2.1. Transceiver Performance Specifications 1.2.2. Core Performance Specifications 1.2.3. Periphery Performance 1.2.4. HPS Specifications
1.2.1. Transceiver Performance Specifications x
1.2.1.1. Transceiver Specifications for Arria V GX and SX Devices 1.2.1.2. Transceiver Specifications for Arria V GT and ST Devices 1.2.1.3. CTLE Response at Data Rates > 3.25 Gbps across Supported AC Gain and DC Gain 1.2.1.4. CTLE Response at Data Rates ≤ 3.25 Gbps across Supported AC Gain and DC Gain 1.2.1.5. Typical TX VOD Setting for Arria® V Transceiver Channels with termination of 100 Ω 1.2.1.6. Transmitter Pre-Emphasis Levels 1.2.1.7. Transceiver Compliance Specification
1.2.2. Core Performance Specifications x
1.2.2.1. Clock Tree Specifications 1.2.2.2. PLL Specifications 1.2.2.3. DSP Block Performance Specifications 1.2.2.4. Memory Block Performance Specifications 1.2.2.5. Internal Temperature Sensing Diode Specifications
1.2.3. Periphery Performance x
1.2.3.1. High-Speed I/O Specifications 1.2.3.2. DPA Lock Time Specifications 1.2.3.3. LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications 1.2.3.4. DLL Frequency Range Specifications 1.2.3.5. DQS Logic Block Specifications 1.2.3.6. Memory Output Clock Jitter Specifications 1.2.3.7. OCT Calibration Block Specifications 1.2.3.8. Duty Cycle Distortion (DCD) Specifications
1.2.4. HPS Specifications x
1.2.4.1. HPS Clock Performance 1.2.4.2. HPS PLL Specifications 1.2.4.3. Quad SPI Flash Timing Characteristics 1.2.4.4. SPI Timing Characteristics 1.2.4.5. SD/MMC Timing Characteristics 1.2.4.6. USB Timing Characteristics 1.2.4.7. Ethernet Media Access Controller (EMAC) Timing Characteristics 1.2.4.8. I2C Timing Characteristics 1.2.4.9. NAND Timing Characteristics 1.2.4.10. Arm* Trace Timing Characteristics 1.2.4.11. UART Interface 1.2.4.12. GPIO Interface 1.2.4.13. HPS JTAG Timing Specifications
1.2.4.2. HPS PLL Specifications x
1.2.4.2.1. HPS PLL VCO Frequency Range 1.2.4.2.2. HPS PLL Input Clock Range 1.2.4.2.3. HPS PLL Input Jitter
1.3. Configuration Specifications x
1.3.1. POR Specifications 1.3.2. FPGA JTAG Configuration Timing 1.3.3. FPP Configuration Timing 1.3.4. Active Serial (AS) Configuration Timing 1.3.5. DCLK Frequency Specification in the AS Configuration Scheme 1.3.6. Passive Serial (PS) Configuration Timing 1.3.7. Initialization 1.3.8. Configuration Files 1.3.9. Minimum Configuration Time Estimation 1.3.10. Remote System Upgrades 1.3.11. User Watchdog Internal Oscillator Frequency Specifications
1.3.3. FPP Configuration Timing x
1.3.3.1. DCLK-to-DATA[] Ratio (r) for FPP Configuration 1.3.3.2. FPP Configuration Timing when DCLK-to-DATA[] = 1 1.3.3.3. FPP Configuration Timing when DCLK-to-DATA[] >1
1.4. I/O Timing x
1.4.1. Programmable IOE Delay 1.4.2. Programmable Output Buffer Delay
2. Arria V GZ Device Datasheet x
2.1. Electrical Characteristics 2.2. Switching Characteristics 2.3. Configuration Specification 2.4. I/O Timing 2.5. Glossary 2.6. Arria® V GZ Device Datasheet Revision History
2.1. Electrical Characteristics x
2.1.1. Operating Conditions
2.1.1. Operating Conditions x
2.1.1.1. Absolute Maximum Ratings 2.1.1.2. Maximum Allowed Overshoot and Undershoot Voltage 2.1.1.3. Recommended Operating Conditions 2.1.1.4. DC Characteristics 2.1.1.5. I/O Standard Specifications
2.1.1.3. Recommended Operating Conditions x
2.1.1.3.1. Recommended Transceiver Power Supply Operating Conditions 2.1.1.3.2. Transceiver Power Supply Requirements
2.1.1.4. DC Characteristics x
2.1.1.4.1. Supply Current 2.1.1.4.2. Power Consumption 2.1.1.4.3. I/O Pin Leakage Current 2.1.1.4.4. Bus Hold Specifications 2.1.1.4.5. On-Chip Termination (OCT) Specifications 2.1.1.4.6. Pin Capacitance 2.1.1.4.7. Hot Socketing 2.1.1.4.8. Internal Weak Pull-Up Resistor
2.2. Switching Characteristics x
2.2.1. Transceiver Performance Specifications 2.2.2. Core Performance Specifications 2.2.3. Periphery Performance
2.2.1. Transceiver Performance Specifications x
2.2.1.1. Reference Clock 2.2.1.2. Transceiver Clocks 2.2.1.3. Receiver 2.2.1.4. Transmitter 2.2.1.5. CMU PLL 2.2.1.6. ATX PLL 2.2.1.7. Fractional PLL 2.2.1.8. Clock Network Data Rate 2.2.1.9. Standard PCS Data Rate 2.2.1.10. 10G PCS Data Rate 2.2.1.11. Typical VOD Settings
2.2.2. Core Performance Specifications x
2.2.2.1. Clock Tree Specifications 2.2.2.2. PLL Specifications 2.2.2.3. DSP Block Specifications 2.2.2.4. Memory Block Specifications 2.2.2.5. Temperature Sensing Diode Specifications
2.2.3. Periphery Performance x
2.2.3.1. High-Speed I/O Specification 2.2.3.2. DLL Range Specifications 2.2.3.3. DQS Logic Block Specifications 2.2.3.4. Memory Output Clock Jitter Specifications 2.2.3.5. OCT Calibration Block Specifications 2.2.3.6. Duty Cycle Distortion (DCD) Specifications
2.2.3.1. High-Speed I/O Specification x
2.2.3.1.1. High-Speed Clock Specifications 2.2.3.1.2. Transmitter High-Speed I/O Specifications 2.2.3.1.3. Receiver High-Speed I/O Specifications 2.2.3.1.4. DPA Mode High-Speed I/O Specifications 2.2.3.1.5. Soft CDR Mode High-Speed I/O Specifications 2.2.3.1.6. Non DPA Mode High-Speed I/O Specifications
2.3. Configuration Specification x
2.3.1. POR Specifications 2.3.2. JTAG Configuration Specifications 2.3.3. Fast Passive Parallel (FPP) Configuration Timing 2.3.4. Active Serial Configuration Timing 2.3.5. Passive Serial Configuration Timing 2.3.6. Initialization 2.3.7. Configuration Files 2.3.8. Remote System Upgrades Circuitry Timing Specification 2.3.9. User Watchdog Internal Oscillator Frequency Specification
2.3.3. Fast Passive Parallel (FPP) Configuration Timing x
2.3.3.1. DCLK-to-DATA[] Ratio (r) for FPP Configuration 2.3.3.2. FPP Configuration Timing when DCLK to DATA[] = 1 2.3.3.3. FPP Configuration Timing when DCLK to DATA[] > 1
2.4. I/O Timing x
2.4.1. Programmable IOE Delay 2.4.2. Programmable Output Buffer Delay
1. Arria® V GX, GT, SX, and ST Device Datasheet
2. Arria V GZ Device Datasheet

1.3.3.3. FPP Configuration Timing when DCLK-to-DATA[] >1

Table 67.  FPP Timing Parameters When DCLK-to-DATA[] Ratio is >1 for Arria® V Devices

The specifications in this table are not applicable to Arria® V QS package.

Use these timing parameters when you use the decompression and design security features.

Symbol Parameter Minimum Maximum Unit
tCF2CD nCONFIG low to CONF_DONE low — 600 ns
tCF2ST0 nCONFIG low to nSTATUS low — 600 ns
tCFG nCONFIG low pulse width 2 — µs
tSTATUS nSTATUS low pulse width 268 150699 µs
tCF2ST1 nCONFIG high to nSTATUS high — 1506100 µs
tCF2CK 101 nCONFIG high to first rising edge on DCLK 1506 — µs
tST2CK 101 nSTATUS high to first rising edge of DCLK 2 — µs
tDSU DATA[] setup time before rising edge on DCLK 5.5 — ns
tDH DATA[] hold time after rising edge on DCLK N – 1/fDCLK 102 — s
tCH DCLK high time 0.45 × 1/fMAX — s
tCL DCLK low time 0.45 × 1/fMAX — s
tCLK DCLK period 1/fMAX — s
fMAX DCLK frequency (FPP ×8/ ×16) — 125 MHz
tR Input rise time — 40 ns
tF Input fall time — 40 ns
tCD2UM CONF_DONE high to user mode103 175 437 µs
tCD2CU CONF_DONE high to CLKUSR enabled 4 × maximum DCLK period — —
tCD2UMC CONF_DONE high to user mode with CLKUSR option on tCD2CU + (Tinit × CLKUSR period) — —
Tinit Number of clock cycles required for device initialization 8,576 — Cycles
Related Information
99 This value can be obtained if you do not delay configuration by extending the nCONFIG or nSTATUS low pulse width.
100 This value can be obtained if you do not delay configuration by externally holding nSTATUS low.
101 If nSTATUS is monitored, follow the tST2CK specification. If nSTATUS is not monitored, follow the tCF2CK specification.
102 N is the DCLK-to-DATA[] ratio and fDCLK is the DCLK frequency of the system.
103 The minimum and maximum numbers apply only if you chose the internal oscillator as the clock source for initializing the device.
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