General-Purpose I/O User Guide: Agilex™ 5 FPGAs and SoCs

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Date 4/05/2024
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Document Table of Contents
Document Table of Contents x
1. Agilex™ 5 General-Purpose I/O Overview 2. Agilex™ 5 HSIO Banks 3. Agilex™ 5 HVIO Banks 4. Agilex™ 5 HPS I/O Banks 5. Agilex™ 5 SDM I/O Banks 6. Agilex™ 5 I/O Troubleshooting Guidelines 7. GPIO Intel® FPGA IP 8. Programmable I/O Features Description 9. Document Revision History for the General-Purpose I/O User Guide: Agilex™ 5 FPGAs and SoCs
1. Agilex™ 5 General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Agilex™ 5 HSIO Banks x
2.1. HSIO Bank Overview 2.2. HSIO Features 2.3. HSIO Implementation Guide 2.4. HSIO Termination 2.5. HSIO Design Guidelines 2.6. HSIO Simulation
2.1. HSIO Bank Overview x
2.1.1. HSIO Bank Structure 2.1.2. HSIO Buffers and Registers
2.2. HSIO Features x
2.2.1. Supported I/O Standards for HSIO Banks 2.2.2. HSIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the HSIO Bank
2.2.3. Programmable I/O Element Features for the HSIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Pull-Up Resistor 2.2.3.3. Guidelines: Programmable De-Emphasis 2.2.3.4. Guidelines: Programmable Receiver Equalization Calibration
2.3. HSIO Implementation Guide x
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 2.3.1.3. HSIO Programmable IOE Features Assignment Names and Settings
2.4. HSIO Termination x
2.4.1. Single-Ended I/O Termination in Agilex™ 5 Devices 2.4.2. True Differential Signaling I/O Termination in Agilex™ 5 Devices
2.4.1. Single-Ended I/O Termination in Agilex™ 5 Devices x
2.4.1.1. Single-Ended I/O Standards On-Chip Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standards On-Chip Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination in Agilex™ 5 Devices x
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard On-Chip Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. HSIO Design Guidelines x
2.5.1. I/O Standard Placement Restrictions for True Differential I/Os 2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent HSIO Bank 2.5.3. VREF Sources and Input Standards Grouping 2.5.4. HSIO Pin Restrictions for External Memory Interfaces 2.5.5. RZQ Pin Requirement 2.5.6. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.7. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.8. Simultaneous Switching Noise 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. VCCIO_PIO Supply for Unused HSIO Banks 2.5.14. HSIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for HSIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.05 V, 1.1 V, or 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. Connection to True Differential Signaling Input Buffers During Device Reconfiguration 2.5.19. LVSTL700 I/O Standards Differential Pin Pair Requirements 2.5.20. Implementing a Pseudo Open Drain 2.5.21. Allowed Duration for Using RT OCT 2.5.22. Single-Ended Strobe Signal Differential Pin Pair Restriction 2.5.23. Implementing SLVS-400 or DPHY I/O Standard with 1.1 V VCCIO_PIO
2.6. HSIO Simulation x
2.6.1. IBIS Models—HSIO Support 2.6.2. IBIS-AMI Models 2.6.3. HSPICE* Models 2.6.4. Net Length Reports
3. Agilex™ 5 HVIO Banks x
3.1. HVIO Bank Overview 3.2. HVIO Features 3.3. HVIO Implementation Guide 3.4. HVIO Design Guidelines 3.5. HVIO Simulation
3.1. HVIO Bank Overview x
3.1.1. HVIO Bank Structure 3.1.2. HVIO Buffers and Registers
3.2. HVIO Features x
3.2.1. Supported I/O Standards for HVIO Banks 3.2.2. Dedicated Features of HVIO Pins 3.2.3. HVIO Buffer Behavior 3.2.4. Programmable I/O Element Features for the HVIO Bank
3.2.4. Programmable I/O Element Features for the HVIO Bank x
3.2.4.1. Guidelines: Programmable Open-Drain Output
3.3. HVIO Implementation Guide x
3.3.1. I/O Assignments with the Quartus® Prime Assignment Editor
3.3.1. I/O Assignments with the Quartus® Prime Assignment Editor x
3.3.1.1. Assigning Pin I/O Standards in the Quartus® Prime Assignment Editor 3.3.1.2. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 3.3.1.3. HVIO Programmable IOE Features Assignment Names and Settings
3.4. HVIO Design Guidelines x
3.4.1. HVIO Pins During Power Sequencing 3.4.2. Unused HVIO Pins 3.4.3. VCCIO_HVIO Supply for Unused HVIO Banks 3.4.4. Maximum DC Current Restrictions
3.5. HVIO Simulation x
3.5.1. IBIS Models—HVIO Support 3.5.2. HSPICE* Models 3.5.3. Net Length Reports
4. Agilex™ 5 HPS I/O Banks x
4.1. HPS I/O Bank Overview 4.2. HPS I/O Features 4.3. HPS I/O Implementation Guide 4.4. HPS I/O Design Guidelines 4.5. HPS I/O Simulation
4.2. HPS I/O Features x
4.2.1. Supported I/O Standards for HPS I/O Banks 4.2.2. Programmable I/O Element Features for the HPS I/O Bank 4.2.3. HPS I/O Buffer Behavior
4.3. HPS I/O Implementation Guide x
4.3.1. Configuring Open Drain Feature for the HPS I/O 4.3.2. I/O Assignments with the Quartus® Prime Assignment Editor 4.3.3. Assigning Pin I/O Standards in the Quartus® Prime Pin Planner
4.3.2. I/O Assignments with the Quartus® Prime Assignment Editor x
4.3.2.1. Assigning Programmable IOE Features in the Quartus® Prime Assignment Editor 4.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
4.4. HPS I/O Design Guidelines x
4.4.1. HPS I/O Pins During Power Sequencing 4.4.2. HPS Shared I/O Requirements
4.5. HPS I/O Simulation x
4.5.1. IBIS Models—HPS I/O Support 4.5.2. Net Length Reports
5. Agilex™ 5 SDM I/O Banks x
5.1. SDM I/O Bank Overview 5.2. SDM I/O Features 5.3. SDM I/O Design Guidelines 5.4. SDM I/O Simulation
5.2. SDM I/O Features x
5.2.1. Supported I/O Standards for SDM I/O Banks 5.2.2. SDM I/O Buffer Behavior 5.2.3. I/O Standards and Features for Configuration Pins
5.3. SDM I/O Design Guidelines x
5.3.1. SDM I/O Pins During Power Sequencing 5.3.2. Avalon® Streaming Interface Dedicated Configuration Pins
5.4. SDM I/O Simulation x
5.4.1. IBIS Models—SDM I/O Support 5.4.2. Net Length Reports
7. GPIO Intel® FPGA IP x
7.1. Release Information for GPIO Intel® FPGA IP 7.2. Generating the GPIO Intel® FPGA IP 7.3. GPIO Intel® FPGA IP Parameter Settings 7.4. GPIO Intel® FPGA IP Interface Signals 7.5. GPIO Intel® FPGA IP Architecture 7.6. Verifying Resource Utilization and Design Performance 7.7. GPIO Intel® FPGA IP Timing 7.8. GPIO Intel® FPGA IP Design Examples
7.2. Generating the GPIO Intel® FPGA IP x
7.2.1. Intel® FPGA IP Generation Output
7.3. GPIO Intel® FPGA IP Parameter Settings x
7.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
7.4. GPIO Intel® FPGA IP Interface Signals x
7.4.1. Shared Signals 7.4.2. Data Bit-Order for Data Interface 7.4.3. Input and Output Bus High and Low Bits 7.4.4. Data Interface Signals and Corresponding Clocks
7.5. GPIO Intel® FPGA IP Architecture x
7.5.1. GPIO Intel® FPGA IP Data Paths 7.5.2. Register Packing
7.5.1. GPIO Intel® FPGA IP Data Paths x
7.5.1.1. Input Path 7.5.1.2. Output and Output Enable Paths
7.7. GPIO Intel® FPGA IP Timing x
7.7.1. Timing Components 7.7.2. Delay Elements 7.7.3. Timing Analysis 7.7.4. Timing Closure Guidelines
7.7.3. Timing Analysis x
7.7.3.1. Single Data Rate Input Register 7.7.3.2. DDIO Input Register 7.7.3.3. Single Data Rate Output Register 7.7.3.4. DDIO Output Register
7.8. GPIO Intel® FPGA IP Design Examples x
7.8.1. GPIO Intel® FPGA IP Synthesizable Quartus® Prime Design Example 7.8.2. GPIO Intel® FPGA IP Simulation Design Example
8. Programmable I/O Features Description x
8.1. Programmable Pre-Emphasis 8.2. Programmable De-Emphasis 8.3. Programmable Differential Output Voltage 8.4. Continuous Time Linear Equalization 8.5. Decision Feedback Equalization
1. Agilex™ 5 General-Purpose I/O Overview
2. Agilex™ 5 HSIO Banks
3. Agilex™ 5 HVIO Banks
4. Agilex™ 5 HPS I/O Banks
5. Agilex™ 5 SDM I/O Banks
6. Agilex™ 5 I/O Troubleshooting Guidelines
7. GPIO Intel® FPGA IP
8. Programmable I/O Features Description
9. Document Revision History for the General-Purpose I/O User Guide: Agilex™ 5 FPGAs and SoCs

2.5.2. Placement Restrictions for True Differential and Single-Ended I/O Standards in the Same or Adjacent HSIO Bank

If you use true differential I/O standards and single-ended I/O standards in the same or adjacent HSIO banks, adhere to the following placement guidelines.
  • Do not place true differential and toggling single-ended I/O standards in the combinations of locations listed in the following tables.
  • The Quartus® Prime software issues the following errors:
    • Compilation error—violation of the same bank placement restriction.
    • Critical warning—assignment of true differential I/O standards to pin pairs with the following pin index numbers: 0 and 1, 6 and 7, 88 and 89, and 94 and 95.
Table 19.  Restricted Pin Placement Combinations for True Differential and Single-Ended I/O Standards in the Same HSIO Bank

This table lists the combinations of pins and I/O standards not allowed in the same HSIO bank. Examples:

  • If you place a true differential I/O standard in pin pair 10 and 11, do not place single-ended I/O standards in pins 8 or 19.
  • If you place a single-ended I/O standard in pin 57 or 67, do not place a true differential I/O standard in pin pair 58 and 59.
Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number)
True Differential Pin Pair Single-Ended Pin True Differential Pin Pair Single-Ended Pin True Differential Pin Pair Single-Ended Pin True Differential Pin Pair Single-Ended Pin
0 and 1 3, 4 24 and 25 27, 28 48 and 49 51, 52 72 and 73 75, 76
2 and 3 0 26 and 27 16, 24 50 and 51 40, 48 74 and 75 64, 72
4 and 5 1, 15 28 and 29 25, 39 52 and 53 49, 63 76 and 77 73, 87
6 and 7 9 30 and 31 22, 32 54 and 55 46, 56 78 and 79 70, 80
8 and 9 6, 11 32 and 33 31, 34 56 and 57 55, 58 80 and 81 79, 82
10 and 11 8, 19 34 and 35 33, 43 58 and 59 57, 67 82 and 83 81, 90
12 and 13 14, 17 36 and 37 38, 41 60 and 61 62, 65 84 and 85 86, 89
14 and 15 5, 12 38 and 39 29, 36 62 and 63 53, 60 86 and 87 77, 84
16 and 17 13, 26 40 and 41 37, 50 64 and 65 61, 74 88 and 89 85
18 and 19 10, 21 42 and 43 35, 45 66 and 67 59, 69 90 and 91 83, 92
20 and 21 18, 23 44 and 45 42, 47 68 and 69 66, 71 92 and 93 91, 94
22 and 23 20, 30 46 and 47 44, 54 70 and 71 68, 78 94 and 95 93
Table 20.  Restricted Pin Placement Combinations for True Differential and Single-Ended I/O Standards in Adjacent HSIO Banks

This table lists the combinations of pins and I/O standards not allowed in adjacent HSIO banks. Examples:

  • If you place a true differential I/O standard in pin pair 6 and 7 of bank 3B, do not place single-ended I/O standards in pin 95 of bank 3A.
  • If you place a single-ended I/O standard in pin 2 of bank 2B, do not place a true differential I/O standard in pin pair 88 and 89 of bank 2A.
Combinations Not Allowed (Pin Index Number) Combinations Not Allowed (Pin Index Number)
True Differential Single-Ended True Differential Single-Ended
Bank Pin Pair Bank Pin Bank Pin Pair Bank Pin
3A 88 and 89 3B 2 2A 88 and 89 2B 2
94 and 95 7 94 and 95 7
3B 2 and 3 3A 88 2B 2 and 3 2A 88
6 and 7 95 6 and 7 95

Refer to the related information for the figure showing the locations of the HSIO banks.

Related Information
Level Two Title