AN 522: Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families

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ID 683803
Date 7/31/2018
Public
Document Table of Contents
Document Table of Contents x
Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families
Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families x
BLVDS Overview BLVDS Technology in Intel Devices BLVDS Power Consumption BLVDS Design Example Performance Analysis Document Revision History for AN 522: Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families
BLVDS Overview x
Design Considerations Effective Impedance Propagation Delay
BLVDS Technology in Intel Devices x
I/O Standards for BLVDS Interface in Intel FPGA Devices
BLVDS Design Example x
Design Example Guidelines for Intel® Stratix® 10 Devices Design Example Guidelines for Intel® Arria® 10 Devices Design Example Guidelines for Intel® MAX® 10 Devices Design Example Guidelines for All Supported Devices Except Intel® Arria® 10, Intel® Cyclone® 10 GX, and Intel® MAX® 10
Performance Analysis x
System Setup Bus Termination Stub Length Stub Termination Driver Slew Rate Overall System Performance
Implementing Bus LVDS Interface in Supported Intel® FPGA Device Families

Design Considerations

A good multipoint design must consider the capacitive load and termination on the bus to obtain better signal integrity. You can minimize the load capacitance by selecting a transceiver with low pin capacitance, connector with low capacitance, and keeping the stub length short.

One of the multipoint BLVDS design consideration is the effective differential impedance of a fully loaded bus, referred to as effective impedance, and the propagation delay through the bus.

Other multipoint BLVDS design considerations include fail-safe biasing, connector type and pin-out, PCB bus trace layout, and driver edge rate specifications.

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