Stratix® 10 GX/SX Device Overview

ID 683729
Date 6/28/2024
Public

1.2. Innovations in Stratix® 10 FPGAs and SoCs

Stratix® 10 FPGAs and SoCs deliver many significant improvements over the previous generation high-performance Stratix® V FPGAs.

Table 1.   Key Features of Stratix® 10 Devices Compared to Stratix® V Devices
Feature Stratix® V FPGAs Stratix® 10 FPGAs and SoCs
Process technology 28 nm TSMC (planar transistor) 14 nm Intel tri-gate (FinFET)
Hard processor core None Quad-core 64 bit Arm* Cortex* -A53 (SoC only)
Core architecture Conventional core architecture with conventional interconnect Hyperflex® core architecture with Hyper-Registers in the interconnect
Core performance 500 MHz 1 GHz
Power dissipation 1x As low as 0.3x
Logic density 952 KLE 10,200 KLE
Embedded memory (M20K) 52 Mbits 253 Mbits
18x19 multipliers 3,926
Note: Multiplier is 18x18 in Stratix® V devices.
11,520
Note: Multiplier is 18x19 in Stratix® 10 devices.
Floating point DSP capability Up to 1 TFLOP, requires soft floating point adder and multiplier Up to 10 TFLOP, hard IEEE 754 compliant single precision floating point adder and multiplier
Maximum transceivers 66 96
Maximum transceiver data rate (chip-to-chip) 28.05 Gbps

26.6 Gbps L-Tile

28.3 Gbps H-Tile

Maximum transceiver data rate (backplane) 12.5 Gbps

12.5 Gbps L-Tile

28.3 Gbps H-Tile

Hard memory controller None

DDR4 @ 1333 MHz/2666 Mbps

DDR3 @ 1067 MHz/2133 Mbps

Hard protocol IP PCIe* Gen3 x8 (up to 4 instances)

PCIe* Gen3 x16 (up to 4 instances)

SR-IOV (4 physical functions / 2k virtual functions) on H-Tile devices

10GBASE-KR/40GBASE-KR4 FEC

Core clocking and PLLs Global, quadrant and regional clocks supported by fractional-synthesis fPLLs Programmable clock tree synthesis supported by fractional synthesis fPLLs and integer IO PLLs

These innovations result in the following improvements:

  • Improved Core Logic Performance: The Hyperflex® core architecture combined with 14 nm Intel tri-gate technology allows Stratix® 10 devices to achieve 2X the core performance compared to the previous generation
  • Lower Power Stratix® 10 devices use up to 70% lower power compared to the previous generation, enabled by 14 nm Intel tri-gate technology, the Hyperflex® core architecture, and optional power saving features built into the architecture
  • Higher Density: Stratix® 10 devices offer three times the level of integration, with up to 10.2 million logic elements (LEs), over 253 Mbits of embedded memory blocks (M20K), and 11,520 18x19 multipliers
  • Embedded Processing: Stratix® 10 SoCs feature a Quad-Core 64 bit Arm* Cortex* -A53 processor optimized for power efficiency and software compatible with previous generation Arria® and Cyclone® SoC devices
  • Improved Transceiver Performance: With up to 96 transceiver channels implemented in heterogeneous 3D SiP transceiver tiles, Stratix® 10 GX and SX devices support data rates up to 28.3 Gbps chip-to-chip and 28.3 Gbps across the backplane with signal conditioning circuits capable of equalizing over 30 dB of system loss
  • Improved DSP Performance: The variable precision DSP block in Stratix® 10 devices features hard fixed and floating point capability, with up to 10 TFLOP IEEE754 single-precision floating point performance
  • Additional Hard IP: Stratix® 10 devices include many more hard IP blocks than previous generation devices, with a hard memory controller included in each bank of 48 general purpose IOs, a hard PCIe* Gen3 x16 full protocol stack in each transceiver tile, and a hard 10GBASE-KR/40GBASE-KR4 FEC in every transceiver channel
  • Enhanced Core Clocking: Stratix® 10 devices feature programmable clock tree synthesis; clock trees are only synthesized where needed, increasing the flexibility and reducing the power dissipation of the clocking solution
  • Additional Core PLLs: The core fabric in Stratix® 10 devices is supported by both integer IO PLLs and fractional synthesis fPLLs, resulting in a greater total number of PLLs available than the previous generation