Intel® Stratix® 10 TX Transceiver Signal Integrity Development Kit User Guide

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ID 683591
Date 9/27/2019
Public
Document Table of Contents
Document Table of Contents x
1. Overview 2. Getting Started 3. Development Kit Setup 4. Development Kit Components 5. Board Test System A. Additional Information B. Revision History
1. Overview x
1.1. General Development Kit Description 1.2. Recommended Operating Conditions 1.3. Handling the Kit
2. Getting Started x
2.1. About the Intel® Quartus® Prime Software 2.2. Development Kit Package 2.3. Installing the Intel® FPGA Download Cable II Driver
3. Development Kit Setup x
3.1. Setting up the Development Kit 3.2. Factory Default Switch and Jumper Settings
4. Development Kit Components x
4.1. Development Kit Overview 4.2. Intel® Stratix® 10 TX FPGA 4.3. MAX® V CPLD 4.4. FPGA Configuration 4.5. Status and Setup Elements 4.6. User Input-Output Components 4.7. Clocks 4.8. Transceiver Channels 4.9. Communication Ports 4.10. Flash Memory 4.11. System Power
4.4. FPGA Configuration x
4.4.1. Configuring the FPGA over Embedded Intel® FPGA Download Cable II 4.4.2. Configuring the FPGA through Flash Memory 4.4.3. Configuring the FPGA over External Intel® FPGA Download Cable
4.7. Clocks x
4.7.1. Transceiver Dedicated Clocks 4.7.2. General-Purpose Clocks 4.7.3. Embedded Intel® FPGA Download Cable II Clock
4.10. Flash Memory x
4.10.1. Parallel NOR Flash Memory 4.10.2. EPCQL Flash Memory
4.11. System Power x
4.11.1. Power Guidelines 4.11.2. Power Supply 4.11.3. Power Management 4.11.4. Power Distribution System 4.11.5. Thermal Limitations and Protection Guidelines
5. Board Test System x
5.1. Preparing the Development Kit 5.2. Running the Board Test System 5.3. Using the Board Test System 5.4. Simple Socket Server
5.3. Using the Board Test System x
5.3.1. The Configure Menu 5.3.2. The System Info Tab 5.3.3. The GPIO Tab 5.3.4. The EPCQ Tab 5.3.5. The FMC+ Tab 5.3.6. The PAM4 Tab 5.3.7. The MXP Tab 5.3.8. The QSFPDD1x2 Tab 5.3.9. The QSFPDD2x1 Tab 5.3.10. Power Monitor 5.3.11. Clock Controller
A. Additional Information x
A.1. Add SmartVID settings in QSF file A.2. Safety and Regulatory Information A.3. Compliance and Conformity Information
A.2. Safety and Regulatory Information x
A.2.1. Safety Warnings A.2.2. Safety Cautions
1. Overview
2. Getting Started
3. Development Kit Setup
4. Development Kit Components
5. Board Test System
A. Additional Information
B. Revision History

4.11.5. Thermal Limitations and Protection Guidelines

With 25 °C ambient temperature and 50 °C printed circuit board (PCB) temperature, you must ensure that your FPGA designs do not consume more than 200 W with the liquid cooling solution.

MAX6581 chip is connected to the Intel® Stratix® 10 TX FPGA internal temperature diode to continuously monitor FPGA die temperature. Meanwhile, a dedicated FPGA TSD real-time monitor solution under ~\ip\onchip_sensors\ is added to each transceiver example design to monitor the temperatures of both FPGA core and each transceiver tile.

Based on the data from both MAX6581 and FPGA, MAX V will run fan at its maximum speed whenever any temperature is over 60 °C or immediately power off the board whenever any temperature is over 100 °C. Remember to unplug the power supply when the board is powered off after the temperature crosses 100 °C. Plug the power supply back again to ensure that the board can be normally turned on/off again.

The cooling parts (air duct and fan) for QSFPDD modules are pre-installed, but not powered by default. Plug them into the J60 header if your designs require additional cooling on these interfaces. You can adjust fan speed for both FPGA and optical modules through Power GUI.

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