Intel® MAX® 10 External Memory Interface User Guide

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ID 683087
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 External Memory Interface Overview 2. Intel® MAX® 10 External Memory Interface Architecture and Features 3. Intel® MAX® 10 External Memory Interface Design Considerations 4. Intel® MAX® 10 External Memory Interface Implementation Guides 5. UniPHY IP References for Intel® MAX® 10 Devices 6. Intel® MAX® 10 External Memory Interface User Guide Archives 7. Document Revision History for the Intel® MAX® 10 External Memory Interface User Guide
1. Intel® MAX® 10 External Memory Interface Overview x
1.1. Intel® MAX® 10 External Memory Interface Support and Performance
2. Intel® MAX® 10 External Memory Interface Architecture and Features x
2.1. Intel® MAX® 10 I/O Banks for External Memory Interface 2.2. Intel® MAX® 10 DQ/DQS Groups 2.3. Intel® MAX® 10 External Memory Interfaces Maximum Width 2.4. Intel® MAX® 10 Memory Controller 2.5. Intel® MAX® 10 External Memory Read Datapath 2.6. Intel® MAX® 10 External Memory Write Datapath 2.7. Intel® MAX® 10 Address/Command Path 2.8. Intel® MAX® 10 PHY Clock (PHYCLK) Network 2.9. Phase Detector for VT Tracking 2.10. On-Chip Termination 2.11. Phase-Locked Loop 2.12. Intel® MAX® 10 Low Power Feature
2.5. Intel® MAX® 10 External Memory Read Datapath x
2.5.1. DDR Input Registers
2.6. Intel® MAX® 10 External Memory Write Datapath x
2.6.1. DDR Output Registers
3. Intel® MAX® 10 External Memory Interface Design Considerations x
3.1. Intel® MAX® 10 DDR2 and DDR3 Design Considerations 3.2. LPDDR2 Design Considerations 3.3. Guidelines: Intel® MAX® 10 DDR3, DDR2, and LPDDR2 External Memory Interface I/O Limitation 3.4. Guidelines: Intel® MAX® 10 Board Design Requirement for DDR2, DDR3, and LPDDR2 3.5. Guidelines: Reading the Intel® MAX® 10 Pin-Out Files
3.1. Intel® MAX® 10 DDR2 and DDR3 Design Considerations x
3.1.1. DDR2/DDR3 External Memory Interface Pins 3.1.2. DDR2/DDR3 Recommended Termination Schemes for Intel® MAX® 10 Devices
3.1.1. DDR2/DDR3 External Memory Interface Pins x
3.1.1.1. Intel® MAX® 10 Data and Data Clock (Data Strobe) Pins 3.1.1.2. Data Mask Pins 3.1.1.3. DDR2/DDR3 Error Correction Coding Pins 3.1.1.4. DDR2/DDR3 Address and Control/Command Pins 3.1.1.5. Memory Clock Pins
3.1.1.1. Intel® MAX® 10 Data and Data Clock (Data Strobe) Pins x
3.1.1.1.1. Intel® MAX® 10 I/O Bank DQ/DQS Support for DDR2/DDR3
3.2. LPDDR2 Design Considerations x
3.2.1. LPDDR2 External Memory Interface Pins 3.2.2. LPPDDR2 Power Supply Variation Constraint 3.2.3. LPDDR2 Recommended Termination Schemes for Intel® MAX® 10 Devices
3.2.1. LPDDR2 External Memory Interface Pins x
3.2.1.1. Intel® MAX® 10 Data and Data Clock (Data Strobe) Pins 3.2.1.2. Data Mask Pins 3.2.1.3. LPDDR2 Address and Control/Command Pins 3.2.1.4. Memory Clock Pins
3.2.1.1. Intel® MAX® 10 Data and Data Clock (Data Strobe) Pins x
3.2.1.1.1. Intel® MAX® 10 I/O Bank DQ/DQS Support for LPDDR2
4. Intel® MAX® 10 External Memory Interface Implementation Guides x
4.1. UniPHY IP Core 4.2. LPDDR2 External Memory Interface Implementation 4.3. DDR2 and DDR3 External Memory Interface Implementation
4.2. LPDDR2 External Memory Interface Implementation x
4.2.1. Supported LPDDR2 Topology
4.3. DDR2 and DDR3 External Memory Interface Implementation x
4.3.1. Intel® MAX® 10 Supported DDR2 or DDR3 Topology
5. UniPHY IP References for Intel® MAX® 10 Devices x
5.1. UniPHY Parameter Settings for Intel® MAX® 10
5.1. UniPHY Parameter Settings for Intel® MAX® 10 x
5.1.1. UniPHY Parameters—PHY Settings 5.1.2. UniPHY Parameters—Memory Parameters 5.1.3. UniPHY Parameters—Memory Timing 5.1.4. UniPHY Parameters—Board Settings 5.1.5. UniPHY Parameters—Controller Settings 5.1.6. UniPHY Parameters—Diagnostics
1. Intel® MAX® 10 External Memory Interface Overview
2. Intel® MAX® 10 External Memory Interface Architecture and Features
3. Intel® MAX® 10 External Memory Interface Design Considerations
4. Intel® MAX® 10 External Memory Interface Implementation Guides
5. UniPHY IP References for Intel® MAX® 10 Devices
6. Intel® MAX® 10 External Memory Interface User Guide Archives
7. Document Revision History for the Intel® MAX® 10 External Memory Interface User Guide

2.11. Phase-Locked Loop

For the external memory interface, the PLL generates the memory clock, write clock, capture clock, and the logic–core clock.
  • The memory clock provides clock for DQS write strobe, and address and command signals.
  • The write clock that is shifted –90° from the memory clock provides clock for DQ signals during memory writes.

You can use the PLL reconfiguration feature to calibrate the read–capture phase shift to balance the setup and hold margins. At startup, the sequencer calibrates the capture clock.

For external memory interfaces in Intel® MAX® 10 devices, you must use the top right PLL (PLL 2).

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