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1. Intel® MAX® 10 External Memory Interface Overview
2. Intel® MAX® 10 External Memory Interface Architecture and Features
3. Intel® MAX® 10 External Memory Interface Design Considerations
4. Intel® MAX® 10 External Memory Interface Implementation Guides
5. UniPHY IP References for Intel® MAX® 10 Devices
6. Intel® MAX® 10 External Memory Interface User Guide Archives
7. Document Revision History for the Intel® MAX® 10 External Memory Interface User Guide
2.1. Intel® MAX® 10 I/O Banks for External Memory Interface
2.2. Intel® MAX® 10 DQ/DQS Groups
2.3. Intel® MAX® 10 External Memory Interfaces Maximum Width
2.4. Intel® MAX® 10 Memory Controller
2.5. Intel® MAX® 10 External Memory Read Datapath
2.6. Intel® MAX® 10 External Memory Write Datapath
2.7. Intel® MAX® 10 Address/Command Path
2.8. Intel® MAX® 10 PHY Clock (PHYCLK) Network
2.9. Phase Detector for VT Tracking
2.10. On-Chip Termination
2.11. Phase-Locked Loop
2.12. Intel® MAX® 10 Low Power Feature
3.1. Intel® MAX® 10 DDR2 and DDR3 Design Considerations
3.2. LPDDR2 Design Considerations
3.3. Guidelines: Intel® MAX® 10 DDR3, DDR2, and LPDDR2 External Memory Interface I/O Limitation
3.4. Guidelines: Intel® MAX® 10 Board Design Requirement for DDR2, DDR3, and LPDDR2
3.5. Guidelines: Reading the Intel® MAX® 10 Pin-Out Files
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3.2.1. LPDDR2 External Memory Interface Pins
In LPDDR2 interfaces, the Intel® MAX® 10 devices use data (DQ), data strobe (DQS), clock, command, and address pins to interface with external memory devices. The devices also use the data mask (DM) pins to enable data masking.