Agilex™ 3 FPGAs and SoCs Device Overview

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ID 817231
Date 9/23/2024
Public
Document Table of Contents
Document Table of Contents x
1. Overview of the Agilex™ 3 FPGAs and SoCs 2. Agilex™ 3 FPGAs and SoCs Family Plan 3. Second Generation Hyperflex® Core Architecture 4. Adaptive Logic Module in Agilex™ 3 FPGAs and SoCs 5. Internal Embedded Memory in Agilex™ 3 FPGAs and SoCs 6. Variable-Precision DSP in Agilex™ 3 FPGAs and SoCs 7. Core Clock Network in Agilex™ 3 FPGAs and SoCs 8. I/O PLLs in Agilex™ 3 FPGAs and SoCs 9. General Purpose I/Os in Agilex™ 3 FPGAs and SoCs 10. External Memory Interface in Agilex™ 3 FPGAs and SoCs 11. Hard Processor System in Agilex™ 3 SoCs 12. Transceivers in Agilex™ 3 FPGAs and SoCs 13. MIPI* Protocols Support in Agilex™ 3 FPGAs and SoCs 14. Variable Pitch BGA (VPBGA) Package Design of Agilex™ 3 FPGAs and SoCs 15. Configuration via Protocol Using PCIe* for Agilex™ 3 FPGAs and SoCs 16. Device Configuration and the SDM in Agilex™ 3 FPGAs and SoCs 17. Partial and Dynamic Configuration of Agilex™ 3 FPGAs and SoCs 18. Device Security for Agilex™ 3 FPGAs and SoCs 19. SEU Error Detection and Correction in Agilex™ 3 FPGAs and SoCs 20. Power Management for Agilex™ 3 FPGAs and SoCs 21. Software and Tools for Agilex™ 3 FPGAs and SoCs 22. Revision History for the Agilex™ 3 FPGAs and SoCs Device Overview
1. Overview of the Agilex™ 3 FPGAs and SoCs x
1.1. Key Features and Innovations in Agilex™ 3 FPGAs and SoCs 1.2. Agilex™ 3 FPGAs and SoCs Block Diagram 1.3. Agilex™ 3 FPGAs and SoCs Summary of Features 1.4. Additional Features for Agilex™ 3 SoCs
2. Agilex™ 3 FPGAs and SoCs Family Plan x
2.1. Agilex™ 3 FPGAs and SoCs C-Series 2.2. Agilex™ 3 FPGAs and SoCs C-Series Package Options 2.3. Part Number Decoder
10. External Memory Interface in Agilex™ 3 FPGAs and SoCs x
10.1. External Memory Interface Performance 10.2. Features of the Hard Memory Controller
12. Transceivers in Agilex™ 3 FPGAs and SoCs x
12.1. PMA Features in Agilex™ 3 FPGA GTS Transceivers 12.2. PCS Features in Agilex™ 3 FPGA GTS Transceivers 12.3. GTS Transceiver PLL in Agilex™ 3 FPGAs and SoCs
1. Overview of the Agilex™ 3 FPGAs and SoCs
2. Agilex™ 3 FPGAs and SoCs Family Plan
3. Second Generation Hyperflex® Core Architecture
4. Adaptive Logic Module in Agilex™ 3 FPGAs and SoCs
5. Internal Embedded Memory in Agilex™ 3 FPGAs and SoCs
6. Variable-Precision DSP in Agilex™ 3 FPGAs and SoCs
7. Core Clock Network in Agilex™ 3 FPGAs and SoCs
8. I/O PLLs in Agilex™ 3 FPGAs and SoCs
9. General Purpose I/Os in Agilex™ 3 FPGAs and SoCs
10. External Memory Interface in Agilex™ 3 FPGAs and SoCs
11. Hard Processor System in Agilex™ 3 SoCs
12. Transceivers in Agilex™ 3 FPGAs and SoCs
13. MIPI* Protocols Support in Agilex™ 3 FPGAs and SoCs
14. Variable Pitch BGA (VPBGA) Package Design of Agilex™ 3 FPGAs and SoCs
15. Configuration via Protocol Using PCIe* for Agilex™ 3 FPGAs and SoCs
16. Device Configuration and the SDM in Agilex™ 3 FPGAs and SoCs
17. Partial and Dynamic Configuration of Agilex™ 3 FPGAs and SoCs
18. Device Security for Agilex™ 3 FPGAs and SoCs
19. SEU Error Detection and Correction in Agilex™ 3 FPGAs and SoCs
20. Power Management for Agilex™ 3 FPGAs and SoCs
21. Software and Tools for Agilex™ 3 FPGAs and SoCs
22. Revision History for the Agilex™ 3 FPGAs and SoCs Device Overview

1. Overview of the Agilex™ 3 FPGAs and SoCs

The Agilex™ 3 FPGA product family extends the innovations of the Agilex™ FPGA portfolio to low power and cost optimized FPGA applications. The Agilex™ 3 FPGAs and SoCs serve a broad range of applications that require higher performance, lower power consumption, smaller form factor, and lower logic densities.
  • Enhanced DSP with AI Tensor block—delivers high-efficiency artificial intelligence (AI) and digital signal processing (DSP)
  • Dual-core Arm* Cortex* -A55 processors enables you to optimize the performance and power efficiency of processing workloads
  • Monolithic die architecture—provides higher system integration and lower power with smaller form factor packages
  • Advanced connectivity features:
    • High-speed GTS transceivers up to 12.5 Gbps
    • PCI Express* ( PCIe* ) 3.0 ×4 support
    • DDR external memory interface up to 2,133 Mbps LPDDR4
    • General purpose I/Os supporting voltages from 1.0 V to 3.3 V

The Agilex™ 3 FPGA product family delivers on average 1.9x higher fabric performance and up to 38% lower total power consumption compared to previous generation Altera FPGAs. To achieve this improvement, the product family leverages these key innovations and techniques:

  • Advanced Intel® 7 technology
  • Second generation Hyperflex® FPGA architecture
  • High level of system integration
  • Fixed low core voltage device
  • Power islands, power gating, and other power reduction techniques

The Agilex™ 3 FPGA product family brings high performance capabilities and features to the cost optimized FPGA application space. The applications span across many segments including video and broadcast equipments, industrial, test and measurement, medical electronics, data centers, and defense.

Note: The information contained in this document is preliminary and subject to change.

Section Content
Key Features and Innovations in Agilex 3 FPGAs and SoCs
Agilex 3 FPGAs and SoCs Block Diagram
Agilex 3 FPGAs and SoCs Summary of Features
Additional Features for Agilex 3 SoCs

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