Cyclone® V to Agilex™ 5 Device Migration Guide

ID 787947
Date 9/30/2024
Public
Document Table of Contents

2.1. Device Footprint

With the product features and device performance enhancements, expect the device footprint between Agilex™ 5 and Cyclone® V devices to differ. Intel® recommends recognizing the Agilex™ 5 package and identifying the suitable part number to use in your design.

Device Package Types

Cyclone® V device series offer only the standard ball-grid design.

Agilex™ 5 devices offer Variable Pitch Ball Grid Array (VPBGA) and standard ball grid device package types. Most of the Agilex™ 5 device packages use the VPBGA design, which you can identify through the package code starting with “B” and the conventional standard ball grid design package starting with “M.”

Figure 1. Device Package Types

Compared to the standard ball-grid array (BGA) packages, the VPBGA package has a mixed-ball pitch size with a minimum ball pitch of 0.65 mm. The standard ball grid package offers a 0.5 mm ball pitch package.