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1. Overview
2. Getting Started
3. Development Kit Setup
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Agilex™ 7 FPGA M-Series HBM2e Development Kit User Guide
A. Development Kit Components
B. Additional Information
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1.4. Recommended Operating Conditions
Operating Condition | Range of Values |
---|---|
Ambient operating temperature range | 0°C to 30°C |
ICC load current | 195 A |
ICC load transient percentage | 200 A/µs |
FPGA maximum power supported by active heatsink/fan | 410 W |
When handling the board, it is important to observe static discharge precautions.
CAUTION:
Without proper anti-static handling, the board can be damaged. Therefore, use anti-static handling precautions when touching the development kit.
Note: This development kit should not be operated in a vibration environment.