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Ixiasoft
1. Overview
2. Getting Started
3. Development Kit Setup
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Agilex™ 7 FPGA M-Series HBM2e Development Kit User Guide
A. Development Kit Components
B. Developer Resources
C. Safety and Regulatory Compliance Information
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Ixiasoft
1.2. Feature Summary
- Agilex™ 7 FPGA M-Series (AGM039) device in 4700A BGA package
- Quad-core 64-bit Arm Cortex-A53 hard processor (HPS)
- 0.8 V VID-adjustable VCC core
- F-Tile x3, R-Tile x1, and HBM2E
- F-Tile 32G NRZ (58G PAM4) / High-Speed Transceiver 58G NRZ (116G PAM4) / R-Tile 32G PCIe* (CXL) Lanes
- 3.9M logic elements (LE)
- 1.3M adaptive logic modules (ALM)
- 12.3K digital signal processing (DSP) blocks
- FPGA configuration
- Avalon® streaming interface x8 configuration mode support
- 2 Gb flash for Avalon® streaming interface x8 configuration mode
- JTAG header for device programming
- Built-in Intel® FPGA Download Cable II for device programming
- Programmable clock sources
- Transceiver interfaces
- PCI Express* ( PCIe* ) x16 interface supporting 5.0 endpoint connected to an MCIO connector
- 2x QSFPDD optical module interface connected to F-Tile transceiver
- 1x QSFPDD 800 optical module interface connected to F-Tile transceiver
- 16 F-Tile transceiver connect to FMC+ connector
- Memory interfaces
- 2 x40 DIMM sockets supporting DDR5-5600
- 1 x40 DDR5-5600 component interface for HPS processor memory
- 1 x40 DDR5-5600 component interface for fabric I/O memory
- 2 x16 LPDDR5 component, 2 channels and each is 16 bit data line interface
- Communication ports
- JTAG header
- Micro USB on-board Intel® FPGA Download Cable II
- System I2C header
- Buttons, switches, and LEDs
- CPU reset push button
- PCIe* reset push button
- CXL reset push button
- HPS reset push button
- Four dedicated user LEDs
- Board power good LED
- BMC MAX® 10 configuration done LED
- FPGA configuration done LED
- Heatsink and fan
- Air-cooled heatsink assembly for FPGA
- Air-cooled heatsink assembly for 1 port of QSFPDD-800 and 2 ports of QSFPDD, and all 3 ports support class 8
- Red over-temperature warning LED
- Power
- PCIe* input power including required 2x4 auxiliary power connector
- Blue power-good status LED
- On/Off slide power switch for benchtop operation
- On-board power and temperature measurement circuitry
- Mechanical
- 4.375" x 10.0" board size
- Operating environment
- Maximum ambient temperature of 0°C–30°C