Agilex™ 7 FPGA M-Series HBM2e Development Kit User Guide

ID 782461
Date 12/04/2024
Public
Document Table of Contents

1.2. Feature Summary

  • Agilex™ 7 FPGA M-Series (AGM039) device in 4700A BGA package
    • Quad-core 64-bit Arm Cortex-A53 hard processor (HPS)
    • 0.8 V VID-adjustable VCC core
    • F-Tile x3, R-Tile x1, and HBM2E
    • F-Tile 32G NRZ (58G PAM4) / High-Speed Transceiver 58G NRZ (116G PAM4) / R-Tile 32G PCIe* (CXL) Lanes
    • 3.9M logic elements (LE)
    • 1.3M adaptive logic modules (ALM)
    • 12.3K digital signal processing (DSP) blocks
  • FPGA configuration
    • Avalon® streaming interface x8 configuration mode support
    • 2 Gb flash for Avalon® streaming interface x8 configuration mode
    • JTAG header for device programming
    • Built-in Intel® FPGA Download Cable II for device programming
  • Programmable clock sources
  • Transceiver interfaces
    • PCI Express* ( PCIe* ) x16 interface supporting 5.0 endpoint connected to an MCIO connector
    • 2x QSFPDD optical module interface connected to F-Tile transceiver
    • 1x QSFPDD 800 optical module interface connected to F-Tile transceiver
    • 16 F-Tile transceiver connect to FMC+ connector
  • Memory interfaces
    • 2 x40 DIMM sockets supporting DDR5-5600
    • 1 x40 DDR5-5600 component interface for HPS processor memory
    • 1 x40 DDR5-5600 component interface for fabric I/O memory
    • 2 x16 LPDDR5 component, 2 channels and each is 16 bit data line interface
  • Communication ports
    • JTAG header
    • Micro USB on-board Intel® FPGA Download Cable II
    • System I2C header
  • Buttons, switches, and LEDs
    • CPU reset push button
    • PCIe* reset push button
    • CXL reset push button
    • HPS reset push button
    • Four dedicated user LEDs
    • Board power good LED
    • BMC MAX® 10 configuration done LED
    • FPGA configuration done LED
  • Heatsink and fan
    • Air-cooled heatsink assembly for FPGA
    • Air-cooled heatsink assembly for 1 port of QSFPDD-800 and 2 ports of QSFPDD, and all 3 ports support class 8
    • Red over-temperature warning LED
  • Power
    • PCIe* input power including required 2x4 auxiliary power connector
    • Blue power-good status LED
    • On/Off slide power switch for benchtop operation
    • On-board power and temperature measurement circuitry
  • Mechanical
    • 4.375" x 10.0" board size
  • Operating environment
    • Maximum ambient temperature of 0°C–30°C