Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide

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ID 683780
Date 10/29/2021
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Document Table of Contents
Document Table of Contents x
1. Intel® Agilex™ General-Purpose I/O and LVDS SERDES Overview 2. Intel® Agilex™ I/O Features and Usage 3. Intel® Agilex™ I/O Termination 4. Intel® Agilex™ High-Speed SERDES I/O Architecture 5. I/O and LVDS SERDES Design Guidelines 6. Troubleshooting Guidelines 7. Documentation Related to the Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide 8. Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide Archives 9. Document Revision History for the Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide
1. Intel® Agilex™ General-Purpose I/O and LVDS SERDES Overview x
1.1. Intel® Agilex™ I/O and Differential I/O Buffers 1.2. Package Selection and I/O Vertical Migration Support 1.3. I/O Banks
1.3. I/O Banks x
1.3.1. I/O Buffer and Registers in Intel® Agilex™ Devices
2. Intel® Agilex™ I/O Features and Usage x
2.1. GPIO Features 2.2. Programmable I/O Element (IOE) Features in Intel® Agilex™ Devices 2.3. I/O Standards and Features for Intel® Agilex™ Configuration Pins 2.4. I/O Implementation Guide
2.1. GPIO Features x
2.1.1. Supported I/O Standards 2.1.2. Intel® Agilex™ I/O Buffer Behavior
2.2. Programmable I/O Element (IOE) Features in Intel® Agilex™ Devices x
2.2.1. Programmable Output Slew Rate Control 2.2.2. Programmable IOE Delay 2.2.3. Programmable Open-Drain Output 2.2.4. Programmable Bus-Hold 2.2.5. Programmable Pull-Up Resistor 2.2.6. Programmable Pre-emphasis 2.2.7. Programmable De-emphasis 2.2.8. Programmable Differential Output Voltage 2.2.9. Schmitt Trigger Input Buffer
2.4. I/O Implementation Guide x
2.4.1. Configuring I/O Assignments in Intel® Quartus® Prime Software 2.4.2. Using GPIO Intel FPGA IP for I/O Implementation
2.4.1. Configuring I/O Assignments in Intel® Quartus® Prime Software x
2.4.1.1. Configuring I/O Assignments Using Assignment Editor 2.4.1.2. Configuring I/O Standards Using Pin Planner
2.4.2. Using GPIO Intel FPGA IP for I/O Implementation x
2.4.2.1. Release Information 2.4.2.2. GPIO Intel FPGA IP Quick Start Guide 2.4.2.3. GPIO Intel® FPGA IP Architecture 2.4.2.4. Verifying Resource Utilization and Design Performance 2.4.2.5. GPIO Intel® FPGA IP Timing 2.4.2.6. GPIO Intel® FPGA IP Design Examples
2.4.2.2. GPIO Intel FPGA IP Quick Start Guide x
2.4.2.2.1. Generating the GPIO Intel FPGA IP ( Intel® Quartus® Prime Pro Edition) 2.4.2.2.2. GPIO Intel® FPGA IP Parameter Settings 2.4.2.2.3. IP Core Generation Output ( Intel® Quartus® Prime Pro Edition) 2.4.2.2.4. GPIO Intel® FPGA IP Interface Signals
2.4.2.3. GPIO Intel® FPGA IP Architecture x
2.4.2.3.1. GPIO Intel® FPGA IP Data Paths 2.4.2.3.2. Register Packing
2.4.2.5. GPIO Intel® FPGA IP Timing x
2.4.2.5.1. Timing Components 2.4.2.5.2. Delay Elements 2.4.2.5.3. Full-Rate or Half-Rate DDIO Output Register 2.4.2.5.4. Timing Analysis 2.4.2.5.5. Timing Closure Guidelines
2.4.2.6. GPIO Intel® FPGA IP Design Examples x
2.4.2.6.1. GPIO Intel FPGA IP Synthesizable Intel® Quartus® Prime Design Example 2.4.2.6.2. GPIO Intel FPGA IP Simulation Design Example
3. Intel® Agilex™ I/O Termination x
3.1. Single-Ended I/O Termination in Intel® Agilex™ Devices 3.2. True Differential Signaling I/O Termination
3.1. Single-Ended I/O Termination in Intel® Agilex™ Devices x
3.1.1. Single-Ended I/O Standard OCT Termination 3.1.2. OCT Calibration Block 3.1.3. Single-ended I/O Standards External Termination 3.1.4. Single-ended I/O Termination Implementation Guide
3.1.1. Single-Ended I/O Standard OCT Termination x
3.1.1.1. RS OCT 3.1.1.2. RT OCT 3.1.1.3. Dynamic OCT
3.1.4. Single-ended I/O Termination Implementation Guide x
3.1.4.1. Configuring OCT Using Assignment Editor 3.1.4.2. Using OCT Intel FPGA IP for I/O Termination Implementation
3.1.4.2. Using OCT Intel FPGA IP for I/O Termination Implementation x
3.1.4.2.1. Release Information 3.1.4.2.2. OCT Intel® FPGA IP Quick Start Guide 3.1.4.2.3. OCT Intel® FPGA IP Architecture 3.1.4.2.4. OCT Intel® FPGA IP Design Example
3.2. True Differential Signaling I/O Termination x
3.2.1. External I/O Termination 3.2.2. True Differential Signaling I/O Standard OCT Termination
3.2.2. True Differential Signaling I/O Standard OCT Termination x
3.2.2.1. Configuring Differential Input RD OCT Using Assignment Editor 3.2.2.2. Differential Input RD OCT Restrictions and Guidelines
4. Intel® Agilex™ High-Speed SERDES I/O Architecture x
4.1. Intel® Agilex™ High-Speed SERDES I/O Overview 4.2. Using LVDS SERDES Intel FPGA IP for High-Speed LVDS I/O Implementation 4.3. Intel® Agilex™ LVDS SERDES Transmitter 4.4. Intel® Agilex™ LVDS SERDES Receiver 4.5. Intel® Agilex™ LVDS Interface with External PLL Mode 4.6. LVDS SERDES IP Initialization and Reset 4.7. Intel® Agilex™ LVDS SERDES Source-Synchronous Timing Budget 4.8. LVDS SERDES IP Timing 4.9. LVDS SERDES IP Design Examples
4.1. Intel® Agilex™ High-Speed SERDES I/O Overview x
4.1.1. High-Speed SERDES Architecture 4.1.2. Intel® Agilex™ GPIO Banks, SERDES, and DPA Locations
4.2. Using LVDS SERDES Intel FPGA IP for High-Speed LVDS I/O Implementation x
4.2.1. Release Information 4.2.2. LVDS SERDES Intel FPGA IP Quick Start Guide
4.2.2. LVDS SERDES Intel FPGA IP Quick Start Guide x
4.2.2.1. Generating the LVDS SERDES Intel FPGA IP ( Intel® Quartus® Prime Pro Edition) 4.2.2.2. LVDS SERDES Intel® FPGA IP Parameter Settings 4.2.2.3. IP Generation Output ( Intel® Quartus® Prime Pro Edition) 4.2.2.4. LVDS SERDES IP Signals
4.2.2.2. LVDS SERDES Intel® FPGA IP Parameter Settings x
4.2.2.2.1. LVDS SERDES IP General Settings 4.2.2.2.2. LVDS SERDES IP PLL Settings 4.2.2.2.3. LVDS SERDES IP Receiver Settings 4.2.2.2.4. LVDS SERDES IP Transmitter Settings 4.2.2.2.5. LVDS SERDES IP Clock Resource Summary
4.3. Intel® Agilex™ LVDS SERDES Transmitter x
4.3.1. LVDS SERDES Transmitter Blocks 4.3.2. Serializer Bypass for DDR and SDR Operations 4.3.3. Serializer 4.3.4. Differential I/O Bit Position 4.3.5. Clocking Differential Transmitters
4.3.5. Clocking Differential Transmitters x
4.3.5.1. Setting the Transmitter Output Clock Parameters
4.4. Intel® Agilex™ LVDS SERDES Receiver x
4.4.1. LVDS SERDES Receiver Blocks 4.4.2. Clocking LVDS SERDES Receivers 4.4.3. LVDS SERDES Receiver Modes
4.4.1. LVDS SERDES Receiver Blocks x
4.4.1.1. Receiver Blocks in Intel® Agilex™ Devices
4.4.1.1. Receiver Blocks in Intel® Agilex™ Devices x
4.4.1.1.1. DPA Block 4.4.1.1.2. Synchronizer (DPA FIFO) 4.4.1.1.3. Data Realignment Block (Bit Slip) 4.4.1.1.4. Deserializer
4.4.2. Clocking LVDS SERDES Receivers x
4.4.2.1. Receiver Input Clock Parameters Setup
4.4.3. LVDS SERDES Receiver Modes x
4.4.3.1. Non-DPA Mode 4.4.3.2. DPA Mode 4.4.3.3. Soft-CDR Mode
4.5. Intel® Agilex™ LVDS Interface with External PLL Mode x
4.5.1. IOPLL IP Signal Interface with LVDS SERDES IP 4.5.2. IOPLL Parameter Values for External PLL Mode 4.5.3. Connection between IOPLL IP and LVDS SERDES IP in External PLL Mode
4.6. LVDS SERDES IP Initialization and Reset x
4.6.1. Initializing the LVDS SERDES IP in Non-DPA Mode 4.6.2. Initializing the LVDS SERDES IP in DPA Mode 4.6.3. Resetting the DPA 4.6.4. Word Boundaries Alignment
4.6.4. Word Boundaries Alignment x
4.6.4.1. Aligning Word Boundaries
4.7. Intel® Agilex™ LVDS SERDES Source-Synchronous Timing Budget x
4.7.1. Transmitter Channel-to-Channel Skew 4.7.2. Receiver Skew Margin
4.8. LVDS SERDES IP Timing x
4.8.1. I/O Timing Analysis 4.8.2. FPGA Timing Analysis 4.8.3. Timing Analysis for the External PLL Mode
4.8.1. I/O Timing Analysis x
4.8.1.1. Obtaining RSKM Report 4.8.1.2. Obtaining TCCS Report
4.9. LVDS SERDES IP Design Examples x
4.9.1. LVDS SERDES IP Synthesizable Intel® Quartus® Prime Design Examples 4.9.2. LVDS SERDES IP Simulation Design Example 4.9.3. Combined LVDS SERDES IP Transmitter and Receiver Design Example 4.9.4. LVDS SERDES IP Dynamic Phase Shift Design Example
5. I/O and LVDS SERDES Design Guidelines x
5.1. Intel® Agilex™ I/O Design Guidelines 5.2. Intel® Agilex™ LVDS SERDES Design Guidelines
5.1. Intel® Agilex™ I/O Design Guidelines x
5.1.1. VREF Sources and VREF Pins 5.1.2. I/O Standards Implementation based on VCCIO_PIO Voltages 5.1.3. OCT Calibration Block Requirement 5.1.4. Placement Requirements 5.1.5. Simultaneous Switching Noise (SSN) 5.1.6. Special Pins Requirement 5.1.7. External Memory Interface Pin Placement Requirements 5.1.8. HPS Shared I/O Requirements 5.1.9. Clocking Requirements 5.1.10. SDM Shared I/O Requirements 5.1.11. Configuration Pins 5.1.12. Unused Pins 5.1.13. Voltage Setting for Unused I/O Banks 5.1.14. Guidelines for I/O Pins in GPIO, HPS, and SDM Banks During Power Sequencing 5.1.15. Drive Strength Requirement for GPIO Input Pins 5.1.16. Maximum DC Current Restrictions 5.1.17. 1.2 V I/O Interface Voltage Level Compatibility 5.1.18. GPIO Pins for Avalon-ST Configuration Scheme 5.1.19. Maximum True Differential Signaling RX Pairs Per I/O Lane 5.1.20. I/O Simulation
5.1.20. I/O Simulation x
5.1.20.1. HSPICE* Models 5.1.20.2. Net Length Reports
5.2. Intel® Agilex™ LVDS SERDES Design Guidelines x
5.2.1. Use PLLs in Integer PLL Mode for LVDS 5.2.2. Use High-Speed Clock from PLL to Clock SERDES Only 5.2.3. Pin Placement for Differential Channels 5.2.4. SERDES Pin Pairs for Soft-CDR Mode 5.2.5. Placing LVDS Transmitters and Receivers in the Same I/O Bank
5.2.5. Placing LVDS Transmitters and Receivers in the Same I/O Bank x
5.2.5.1. Using an External PLL
1. Intel® Agilex™ General-Purpose I/O and LVDS SERDES Overview
2. Intel® Agilex™ I/O Features and Usage
3. Intel® Agilex™ I/O Termination
4. Intel® Agilex™ High-Speed SERDES I/O Architecture
5. I/O and LVDS SERDES Design Guidelines
6. Troubleshooting Guidelines
7. Documentation Related to the Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide
8. Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide Archives
9. Document Revision History for the Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide

1.3. I/O Banks

There are three types of I/O banks available in the Intel® Agilex™ I/O interface system.
  • GPIO banks
  • HPS I/O bank
  • SDM I/O bank

In each GPIO bank, there are two sub-banks. The top sub-bank is placed near the edge of the die, and the bottom sub-bank is placed near the FPGA core. The top sub-bank pin indexes are 48-95 and the bottom sub-bank pin indexes are 0-47.

In each sub-bank, there are four I/O lanes with 12 I/O pins in each lane that make up a total of 48 single-ended I/O pins or 24 true differential I/O pairs per sub-bank. When SERDES is used, each I/O lane supports three dedicated differential receiver input buffer pairs and three dedicated differential transmitter output buffer pairs, with SERDES and dynamic phase alignment (DPA) channels. When SERDES is not used, you can configure the true differential buffers as receivers or transmitters with the maximum of three receiver pairs within an I/O lane.

Other than the I/O lanes, SERDES, and DPA, each I/O sub-bank also contains dedicated circuitries including I/O PLL, hard memory controller, and on-chip termination (OCT) calibration blocks.

The total bank count in a GPIO bank varies across different device packages. Certain GPIO banks are shared with the SDM and HPS function blocks. Refer to the device pin-out files for available GPIO banks, GPIO and SDM shared I/O banks, and GPIO and HPS shared I/O banks per package.

The HPS I/O bank consists of 48 I/O pins. These pins are used for HPS clocks, peripherals, mass storage flash, and JTAG.

The SDM I/O bank consists of 24 dedicated pins for device configuration purposes. Refer to the device pin-out files for the dedicated function of each pin in the SDM I/O bank.

Figure 2.  Intel® Agilex™ I/O Bank Structure (Top View)This diagram shows the I/O bank structure of the Intel® Agilex™ AGI 027 device. Different device packages have different number of I/O banks. Refer to the device pin-out files for available I/O banks for each device package.
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