Arria® 10 Core Fabric and General Purpose I/Os Handbook

Download PDF
ID 683461
Date 7/08/2024
Public
Document Table of Contents
Document Table of Contents x
1. Logic Array Blocks and Adaptive Logic Modules in Arria® 10 Devices 2. Embedded Memory Blocks in Arria® 10 Devices 3. Variable Precision DSP Blocks in Arria® 10 Devices 4. Clock Networks and PLLs in Arria® 10 Devices 5. I/O and High Speed I/O in Arria® 10 Devices 6. External Memory Interfaces in Arria® 10 Devices 7. Configuration, Design Security, and Remote System Upgrades in Arria® 10 Devices 8. SEU Mitigation for Arria® 10 Devices 9. JTAG Boundary-Scan Testing in Arria® 10 Devices 10. Power Management in Arria® 10 Devices
1. Logic Array Blocks and Adaptive Logic Modules in Arria® 10 Devices x
1.1. LAB 1.2. ALM Operating Modes 1.3. LAB Power Management Techniques 1.4. Logic Array Blocks and Adaptive Logic Modules in Arria® 10 Devices Revision History
1.1. LAB x
1.1.1. MLAB 1.1.2. Local and Direct Link Interconnects 1.1.3. Shared Arithmetic Chain and Carry Chain Interconnects 1.1.4. LAB Control Signals 1.1.5. ALM Resources 1.1.6. ALM Output
1.2. ALM Operating Modes x
1.2.1. Normal Mode 1.2.2. Extended LUT Mode 1.2.3. Arithmetic Mode 1.2.4. Shared Arithmetic Mode
2. Embedded Memory Blocks in Arria® 10 Devices x
2.1. Types of Embedded Memory 2.2. Embedded Memory Design Guidelines for Arria® 10 Devices 2.3. Embedded Memory Features 2.4. Embedded Memory Modes 2.5. Embedded Memory Clocking Modes 2.6. Parity Bit in Embedded Memory Blocks 2.7. Byte Enable in Embedded Memory Blocks 2.8. Memory Blocks Packed Mode Support 2.9. Memory Blocks Address Clock Enable Support 2.10. Memory Blocks Asynchronous Clear 2.11. Memory Blocks Error Correction Code Support 2.12. Embedded Memory Blocks in Arria® 10 Devices Revision History
2.1. Types of Embedded Memory x
2.1.1. Embedded Memory Capacity in Arria® 10 Devices
2.2. Embedded Memory Design Guidelines for Arria® 10 Devices x
2.2.1. Consider the Memory Block Selection 2.2.2. Guideline: Implement External Conflict Resolution 2.2.3. Guideline: Customize Read-During-Write Behavior 2.2.4. Guideline: Consider Power-Up State and Memory Initialization 2.2.5. Guideline: Control Clocking to Reduce Power Consumption
2.2.3. Guideline: Customize Read-During-Write Behavior x
2.2.3.1. Same-Port Read-During-Write Mode 2.2.3.2. Mixed-Port Read-During-Write Mode
2.4. Embedded Memory Modes x
2.4.1. Embedded Memory Configurations for Single-port Mode 2.4.2. Embedded Memory Configurations for Dual-port Modes
2.5. Embedded Memory Clocking Modes x
2.5.1. Clocking Modes for Each Memory Mode 2.5.2. Asynchronous Clears in Clocking Modes 2.5.3. Output Read Data in Simultaneous Read/Write 2.5.4. Independent Clock Enables in Clocking Modes
2.5.1. Clocking Modes for Each Memory Mode x
2.5.1.1. Single Clock Mode 2.5.1.2. Read/Write Clock Mode 2.5.1.3. Input/Output Clock Mode 2.5.1.4. Independent Clock Mode
2.7. Byte Enable in Embedded Memory Blocks x
2.7.1. Byte Enable Controls in Memory Blocks 2.7.2. Data Byte Output 2.7.3. RAM Blocks Operations
2.11. Memory Blocks Error Correction Code Support x
2.11.1. Error Correction Code Truth Table
3. Variable Precision DSP Blocks in Arria® 10 Devices x
3.1. Supported Operational Modes in Arria® 10 Devices 3.2. Resources 3.3. Design Considerations 3.4. Block Architecture 3.5. Operational Mode Descriptions 3.6. Variable Precision DSP Blocks in Arria® 10 Devices Revision History
3.1. Supported Operational Modes in Arria® 10 Devices x
3.1.1. Features
3.3. Design Considerations x
3.3.1. Operational Modes 3.3.2. Internal Coefficient and Pre-Adder for Fixed-Point Arithmetic 3.3.3. Accumulator for Fixed-Point Arithmetic 3.3.4. Chainout Adder 3.3.5. DSP Block Cascade Limit in Agilex™ 7 Devices
3.4. Block Architecture x
3.4.1. Input Register Bank 3.4.2. Pipeline Register 3.4.3. Pre-Adder for Fixed-Point Arithmetic 3.4.4. Internal Coefficient for Fixed-Point Arithmetic 3.4.5. Multipliers 3.4.6. Adder 3.4.7. Accumulator and Chainout Adder for Fixed-Point Arithmetic 3.4.8. Systolic Registers for Fixed-Point Arithmetic 3.4.9. Double Accumulation Register for Fixed-Point Arithmetic 3.4.10. Output Register Bank
3.4.1. Input Register Bank x
3.4.1.1. Two Sets of Delay Registers for Fixed-Point Arithmetic
3.5. Operational Mode Descriptions x
3.5.1. Operational Modes for Fixed-Point Arithmetic 3.5.2. Operational Modes for Floating-Point Arithmetic
3.5.1. Operational Modes for Fixed-Point Arithmetic x
3.5.1.1. Independent Multiplier Mode 3.5.1.2. Independent Complex Multiplier 3.5.1.3. Multiplier Adder Sum Mode 3.5.1.4. 18 x 19 Multiplication Summed with 36-Bit Input Mode 3.5.1.5. Systolic FIR Mode
3.5.1.1. Independent Multiplier Mode x
3.5.1.1.1. 18 x 18 or 18 x 19 Independent Multiplier 3.5.1.1.2. 27 x 27 Independent Multiplier
3.5.1.2. Independent Complex Multiplier x
3.5.1.2.1. 18 x 19 Complex Multiplier
3.5.1.5. Systolic FIR Mode x
3.5.1.5.1. Mapping Systolic Mode User View to Variable Precision Block Architecture View 3.5.1.5.2. 18-Bit Systolic FIR Mode 3.5.1.5.3. 27-Bit Systolic FIR Mode
3.5.2. Operational Modes for Floating-Point Arithmetic x
3.5.2.1. Single Floating-Point Arithmetic Functions 3.5.2.2. Multiple Floating-Point Arithmetic Functions
3.5.2.1. Single Floating-Point Arithmetic Functions x
3.5.2.1.1. Multiplication Mode 3.5.2.1.2. Adder or Subtract Mode 3.5.2.1.3. Multiply Accumulate Mode
3.5.2.2. Multiple Floating-Point Arithmetic Functions x
3.5.2.2.1. Multiply-Add or Multiply-Subtract Mode 3.5.2.2.2. Vector One Mode 3.5.2.2.3. Vector Two Mode 3.5.2.2.4. Direct Vector Dot Product 3.5.2.2.5. Complex Multiplication
4. Clock Networks and PLLs in Arria® 10 Devices x
4.1. Clock Networks 4.2. Arria® 10 PLLs 4.3. Clock Networks and PLLs in Arria® 10 Devices Revision History
4.1. Clock Networks x
4.1.1. Clock Resources in Arria® 10 Devices 4.1.2. Hierarchical Clock Networks 4.1.3. Types of Clock Networks 4.1.4. Clock Network Sources 4.1.5. Clock Control Block 4.1.6. Clock Power Down 4.1.7. Clock Enable Signals
4.1.3. Types of Clock Networks x
4.1.3.1. Global Clock Networks 4.1.3.2. Regional Clock Networks 4.1.3.3. Periphery Clock Networks
4.1.4. Clock Network Sources x
4.1.4.1. Dedicated Clock Input Pins 4.1.4.2. Internal Logic 4.1.4.3. DPA Outputs 4.1.4.4. HSSI Clock Outputs 4.1.4.5. PLL Clock Outputs
4.1.5. Clock Control Block x
4.1.5.1. Pin Mapping in Arria® 10 Devices 4.1.5.2. GCLK Control Block 4.1.5.3. RCLK Control Block 4.1.5.4. PCLK Control Block
4.2. Arria® 10 PLLs x
4.2.1. PLL Usage 4.2.2. PLL Architecture 4.2.3. PLL Control Signals 4.2.4. Clock Feedback Modes 4.2.5. Clock Multiplication and Division 4.2.6. Programmable Phase Shift 4.2.7. Programmable Duty Cycle 4.2.8. PLL Cascading 4.2.9. Reference Clock Sources 4.2.10. Clock Switchover 4.2.11. PLL Reconfiguration and Dynamic Phase Shift
4.2.3. PLL Control Signals x
4.2.3.1. Reset 4.2.3.2. Locked
4.2.10. Clock Switchover x
4.2.10.1. Automatic Switchover 4.2.10.2. Automatic Switchover with Manual Override 4.2.10.3. Manual Clock Switchover 4.2.10.4. Guidelines
5. I/O and High Speed I/O in Arria® 10 Devices x
5.1. I/O and Differential I/O Buffers in Arria® 10 Devices 5.2. I/O Standards and Voltage Levels in Arria® 10 Devices 5.3. Altera FPGA I/O IP Cores for Arria® 10 Devices 5.4. I/O Resources in Arria® 10 Devices 5.5. Architecture and General Features of I/Os in Arria® 10 Devices 5.6. High Speed Source-Synchronous SERDES and DPA in Arria® 10 Devices 5.7. Using the I/Os and High Speed I/Os in Arria® 10 Devices 5.8. I/O and High Speed I/O in Arria® 10 Devices Revision History
5.2. I/O Standards and Voltage Levels in Arria® 10 Devices x
5.2.1. I/O Standards Support for FPGA I/O in Arria® 10 Devices 5.2.2. I/O Standards Support for HPS I/O in Arria® 10 Devices 5.2.3. I/O Standards Voltage Levels in Arria® 10 Devices
5.4. I/O Resources in Arria® 10 Devices x
5.4.1. GPIO Banks, SERDES, and DPA Locations in Arria® 10 Devices 5.4.2. GPIO Buffers and LVDS Channels in Arria® 10 Devices 5.4.3. I/O Banks Groups in Arria® 10 Devices 5.4.4. I/O Vertical Migration for Arria® 10 Devices
5.4.2. GPIO Buffers and LVDS Channels in Arria® 10 Devices x
5.4.2.1. FPGA I/O Resources in Arria® 10 GX Packages 5.4.2.2. FPGA I/O Resources in Arria® 10 GT Packages 5.4.2.3. FPGA I/O Resources in Arria® 10 SX Packages
5.4.3. I/O Banks Groups in Arria® 10 Devices x
5.4.3.1. I/O Banks for Arria® 10  GX Devices 5.4.3.2. I/O Banks for Arria® 10  GT Devices 5.4.3.3. I/O Banks for Arria® 10  SX Devices
5.4.4. I/O Vertical Migration for Arria® 10 Devices x
5.4.4.1. Verifying Pin Migration Compatibility
5.5. Architecture and General Features of I/Os in Arria® 10 Devices x
5.5.1. I/O Element Structure in Arria® 10 Devices 5.5.2. Features of I/O Pins in Arria® 10 Devices 5.5.3. Programmable IOE Features in Arria® 10 Devices 5.5.4. On-Chip I/O Termination in Arria® 10 Devices 5.5.5. External I/O Termination for Arria® 10 Devices
5.5.1. I/O Element Structure in Arria® 10 Devices x
5.5.1.1. I/O Bank Architecture in Arria® 10 Devices 5.5.1.2. I/O Buffer and Registers in Arria® 10 Devices
5.5.2. Features of I/O Pins in Arria® 10 Devices x
5.5.2.1. Open-Drain Output 5.5.2.2. Bus-Hold Circuitry 5.5.2.3. Weak Pull-up Resistor
5.5.3. Programmable IOE Features in Arria® 10 Devices x
5.5.3.1. Programmable Current Strength 5.5.3.2. Programmable Output Slew Rate Control 5.5.3.3. Programmable IOE Delay 5.5.3.4. Programmable Open-Drain Output 5.5.3.5. Programmable Pre-Emphasis 5.5.3.6. Programmable Differential Output Voltage
5.5.4. On-Chip I/O Termination in Arria® 10 Devices x
5.5.4.1. RS OCT without Calibration in Arria® 10 Devices 5.5.4.2. RS OCT with Calibration in Arria® 10 Devices 5.5.4.3. RT OCT with Calibration in Arria® 10 Devices 5.5.4.4. Dynamic OCT 5.5.4.5. Differential Input RD OCT 5.5.4.6. OCT Calibration Block in Arria® 10 Devices
5.5.5. External I/O Termination for Arria® 10 Devices x
5.5.5.1. Single-Ended I/O Termination 5.5.5.2. Differential I/O Termination for Arria® 10 Devices
5.5.5.2. Differential I/O Termination for Arria® 10 Devices x
5.5.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination 5.5.5.2.2. LVDS, RSDS, and Mini-LVDS Termination 5.5.5.2.3. LVPECL Termination
5.6. High Speed Source-Synchronous SERDES and DPA in Arria® 10 Devices x
5.6.1. Arria® 10 LVDS SERDES Usage Modes 5.6.2. SERDES Circuitry 5.6.3. SERDES I/O Standards Support in Arria® 10 Devices 5.6.4. Differential Transmitter in Arria® 10 Devices 5.6.5. Differential Receiver in Arria® 10 Devices 5.6.6. PLLs and Clocking for Arria® 10 Devices 5.6.7. Timing and Optimization for Arria® 10 Devices
5.6.4. Differential Transmitter in Arria® 10 Devices x
5.6.4.1. Transmitter Blocks in Arria® 10 Devices 5.6.4.2. Serializer Bypass for DDR and SDR Operations
5.6.5. Differential Receiver in Arria® 10 Devices x
5.6.5.1. Receiver Blocks in Arria® 10 Devices 5.6.5.2. Receiver Modes in Arria® 10 Devices
5.6.5.1. Receiver Blocks in Arria® 10 Devices x
5.6.5.1.1. DPA Block 5.6.5.1.2. Synchronizer 5.6.5.1.3. Data Realignment Block (Bit Slip) 5.6.5.1.4. Deserializer
5.6.5.2. Receiver Modes in Arria® 10 Devices x
5.6.5.2.1. Non-DPA Mode 5.6.5.2.2. DPA Mode 5.6.5.2.3. Soft-CDR Mode
5.6.6. PLLs and Clocking for Arria® 10 Devices x
5.6.6.1. Clocking Differential Transmitters 5.6.6.2. Clocking Differential Receivers 5.6.6.3. Guideline: LVDS Reference Clock Source 5.6.6.4. Guideline: Use PLLs in Integer PLL Mode for LVDS 5.6.6.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only 5.6.6.6. Guideline: Pin Placement for Differential Channels 5.6.6.7. LVDS Interface with External PLL Mode
5.6.6.2. Clocking Differential Receivers x
5.6.6.2.1. Guideline: Clocking DPA Interfaces Spanning Multiple I/O Banks 5.6.6.2.2. Guideline: I/O PLL Reference Clock Source for DPA or Non-DPA Receiver
5.6.6.7. LVDS Interface with External PLL Mode x
5.6.6.7.1. IOPLL IP Signal Interface with LVDS SERDES IP 5.6.6.7.2. IOPLL Parameter Values for External PLL Mode 5.6.6.7.3. Connection between IOPLL and LVDS SERDES in External PLL Mode
5.6.7. Timing and Optimization for Arria® 10 Devices x
5.6.7.1. Source-Synchronous Timing Budget
5.6.7.1. Source-Synchronous Timing Budget x
5.6.7.1.1. Differential Data Orientation 5.6.7.1.2. Differential I/O Bit Position 5.6.7.1.3. Transmitter Channel-to-Channel Skew 5.6.7.1.4. Receiver Skew Margin for Non-DPA Mode
5.7. Using the I/Os and High Speed I/Os in Arria® 10 Devices x
5.7.1. I/O and High-Speed I/O General Guidelines for Arria® 10 Devices 5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards 5.7.3. Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing 5.7.4. Guideline: Using the I/O Pins in HPS Shared I/O Banks 5.7.5. Guideline: Maximum DC Current Restrictions 5.7.6. Guideline: LVDS SERDES IP Core Instantiation 5.7.7. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode 5.7.8. Guideline: Minimizing High Jitter Impact on Arria® 10 GPIO Performance 5.7.9. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
5.7.1. I/O and High-Speed I/O General Guidelines for Arria® 10 Devices x
5.7.1.1. Guideline: VREF Sources and VREF Pins 5.7.1.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing 5.7.1.3. Guideline: I/O Standards Supported for I/O PLL Reference Clock Input Pin
5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards x
5.7.2.1. Non-Voltage-Referenced I/O Standards 5.7.2.2. Voltage-Referenced I/O Standards 5.7.2.3. Mixing Voltage-Referenced and Non-Voltage Referenced I/O Standards
6. External Memory Interfaces in Arria® 10 Devices x
6.1. Key Features of the Arria® 10 External Memory Interface Solution 6.2. Memory Standards Supported by Arria® 10 Devices 6.3. External Memory Interface Widths in Arria® 10 Devices 6.4. External Memory Interface I/O Pins in Arria® 10 Devices 6.5. Memory Interfaces Support in Arria® 10 Device Packages 6.6. External Memory Interface IP Support in Arria® 10 Devices 6.7. External Memory Interface Architecture of Arria® 10 Devices 6.8. External Memory Interface in Arria® 10 Devices Revision History
6.4. External Memory Interface I/O Pins in Arria® 10 Devices x
6.4.1. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
6.5. Memory Interfaces Support in Arria® 10 Device Packages x
6.5.1. Arria® 10 Package Support for DDR3 x40 with ECC 6.5.2. Arria® 10 Package Support for DDR3 x72 with ECC Single and Dual-Rank 6.5.3. Arria® 10 Package Support for DDR4 x40 with ECC 6.5.4. Arria® 10 Package Support for DDR4 x72 with ECC Single-Rank 6.5.5. Arria® 10 Package Support for DDR4 x72 with ECC Dual-Rank 6.5.6. HPS External Memory Interface Connections in Arria® 10
6.5.6. HPS External Memory Interface Connections in Arria® 10 x
6.5.6.1. Arria® 10 Package Support for DDR3 x40 with ECC for HPS 6.5.6.2. Arria® 10 Package Support for DDR3 x72 with ECC Single and Dual-Rank for HPS 6.5.6.3. Arria® 10 Package Support for DDR4 x40 with ECC for HPS 6.5.6.4. Arria® 10 Package Support for DDR4 x72 with ECC Single-Rank for HPS
6.6. External Memory Interface IP Support in Arria® 10 Devices x
6.6.1. Ping Pong PHY IP
6.7. External Memory Interface Architecture of Arria® 10 Devices x
6.7.1. I/O Bank 6.7.2. I/O AUX
6.7.1. I/O Bank x
6.7.1.1. Hard Memory Controller 6.7.1.2. Delay-Locked Loop 6.7.1.3. Sequencer 6.7.1.4. Clock Tree 6.7.1.5. I/O Lane
6.7.1.1. Hard Memory Controller x
6.7.1.1.1. Hard Memory Controller Features 6.7.1.1.2. Main Control Path 6.7.1.1.3. Data Buffer Controller
6.7.1.5. I/O Lane x
6.7.1.5.1. DQS Logic Block
7. Configuration, Design Security, and Remote System Upgrades in Arria® 10 Devices x
7.1. Enhanced Configuration and Configuration via Protocol 7.2. Configuration Schemes 7.3. Configuration Details 7.4. Remote System Upgrades Using Active Serial Scheme 7.5. Design Security 7.6. Configuration, Design Security, and Remote System Upgrades in Arria® 10 Devices Revision History
7.2. Configuration Schemes x
7.2.1. Active Serial Configuration 7.2.2. Passive Serial Configuration 7.2.3. Fast Passive Parallel Configuration 7.2.4. JTAG Configuration
7.2.1. Active Serial Configuration x
7.2.1.1. DATA Clock (DCLK) 7.2.1.2. Active Serial Single-Device Configuration 7.2.1.3. Active Serial Multi-Device Configuration 7.2.1.4. Active Serial Configuration with Multiple EPCQ-L Devices 7.2.1.5. Using EPCQ-L Devices
7.2.1.3. Active Serial Multi-Device Configuration x
7.2.1.3.1. Pin Connections and Guidelines 7.2.1.3.2. Using Multiple Configuration Data
7.2.1.5. Using EPCQ-L Devices x
7.2.1.5.1. Controlling EPCQ-L Devices 7.2.1.5.2. Trace Length Guideline 7.2.1.5.3. Programming EPCQ-L Devices
7.2.2. Passive Serial Configuration x
7.2.2.1. Passive Serial Single-Device Configuration Using an External Host 7.2.2.2. Passive Serial Single-Device Configuration Using an Intel FPGA Download Cable 7.2.2.3. Passive Serial Multi-Device Configuration
7.2.2.3. Passive Serial Multi-Device Configuration x
7.2.2.3.1. Pin Connections and Guidelines 7.2.2.3.2. Using Multiple Configuration Data 7.2.2.3.3. Using One Configuration Data 7.2.2.3.4. Using PC Host and Download Cable
7.2.3. Fast Passive Parallel Configuration x
7.2.3.1. Fast Passive Parallel Single-Device Configuration 7.2.3.2. Fast Passive Parallel Multi-Device Configuration
7.2.3.2. Fast Passive Parallel Multi-Device Configuration x
7.2.3.2.1. Pin Connections and Guidelines 7.2.3.2.2. Using Multiple Configuration Data 7.2.3.2.3. Using One Configuration Data
7.2.4. JTAG Configuration x
7.2.4.1. JTAG Single-Device Configuration 7.2.4.2. JTAG Multi-Device Configuration
7.2.4.2. JTAG Multi-Device Configuration x
7.2.4.2.1. Pin Connections and Guidelines 7.2.4.2.2. Using a Download Cable
7.3. Configuration Details x
7.3.1. MSEL Pin Settings 7.3.2. CLKUSR 7.3.3. Configuration Sequence 7.3.4. Configuration Timing Waveforms 7.3.5. Estimating Configuration Time 7.3.6. Device Configuration Pins 7.3.7. Configuration Data Compression
7.3.3. Configuration Sequence x
7.3.3.1. Power Up 7.3.3.2. Reset 7.3.3.3. Configuration 7.3.3.4. Configuration Error Handling 7.3.3.5. Initialization 7.3.3.6. User Mode
7.3.3.3. Configuration x
7.3.3.3.1. Configuration Error Detection
7.3.4. Configuration Timing Waveforms x
7.3.4.1. FPP Configuration Timing 7.3.4.2. AS Configuration Timing 7.3.4.3. PS Configuration Timing
7.3.6. Device Configuration Pins x
7.3.6.1. I/O Standards and Drive Strength for Configuration Pins 7.3.6.2. Configuration Pin Options in the Quartus® Prime Software
7.3.7. Configuration Data Compression x
7.3.7.1. Enabling Compression Before Design Compilation 7.3.7.2. Enabling Compression After Design Compilation 7.3.7.3. Using Compression in Multi-Device Configuration
7.4. Remote System Upgrades Using Active Serial Scheme x
7.4.1. Configuration Images 7.4.2. Configuration Sequence in the Remote Update Mode 7.4.3. Remote System Upgrade Circuitry 7.4.4. Enabling Remote System Upgrade Circuitry 7.4.5. Remote System Upgrade Registers 7.4.6. Remote System Upgrade State Machine 7.4.7. User Watchdog Timer
7.4.5. Remote System Upgrade Registers x
7.4.5.1. Control Register 7.4.5.2. Status Register
7.5. Design Security x
7.5.1. Security Key Types 7.5.2. Security Modes 7.5.3. Arria® 10 Qcrypt Security Tool 7.5.4. Design Security Implementation Steps
7.5.2. Security Modes x
7.5.2.1. JTAG Secure Mode
8. SEU Mitigation for Arria® 10 Devices x
8.1. Arria® 10 SEU Mitigation Overview 8.2. Arria® 10 SEU Mitigation Techniques 8.3. CRAM Error Detection Settings Reference 8.4. Specifications 8.5. SEU Mitigation for Arria® 10 Devices Revision History
8.1. Arria® 10 SEU Mitigation Overview x
8.1.1. Mitigating Single Event Upset
8.1.1. Mitigating Single Event Upset x
8.1.1.1. Configuration RAM 8.1.1.2. Embedded Memory 8.1.1.3. Failure Rates
8.2. Arria® 10 SEU Mitigation Techniques x
8.2.1. Mitigating SEU Effects in Configuration RAM 8.2.2. Mitigating SEU Effects in Embedded User RAM 8.2.3. Triple-Module Redundancy 8.2.4. Quartus® Prime Software SEU FIT Reports
8.2.1. Mitigating SEU Effects in Configuration RAM x
8.2.1.1. Error Detection Cyclic Redundancy Check 8.2.1.2. SEU Sensitivity Processing 8.2.1.3. Hierarchy Tagging 8.2.1.4. Evaluating Your System’s Response to Functional Upsets 8.2.1.5. Recovering from CRC Errors
8.2.1.1. Error Detection Cyclic Redundancy Check x
8.2.1.1.1. Column-Based and Frame-Based Check-Bits 8.2.1.1.2. Error Message Register 8.2.1.1.3. CRC_ERROR Pin Behavior
8.2.1.5. Recovering from CRC Errors x
8.2.1.5.1. Enabling Error Correction (Internal Scrubbing)
8.2.2. Mitigating SEU Effects in Embedded User RAM x
8.2.2.1. Configuring RAM to Enable ECC
8.2.4. Quartus® Prime Software SEU FIT Reports x
8.2.4.1. SEU FIT Parameters Report 8.2.4.2. Projected SEU FIT by Component Usage Report 8.2.4.3. Enabling the Projected SEU FIT by Component Usage Report
8.2.4.2. Projected SEU FIT by Component Usage Report x
8.2.4.2.1. Component FIT Rates 8.2.4.2.2. Raw FIT 8.2.4.2.3. Utilized FIT 8.2.4.2.4. Mitigated FIT 8.2.4.2.5. Architectural Vulnerability Factor
8.4. Specifications x
8.4.1. Error Detection Frequency 8.4.2. Error Detection Time 8.4.3. EMR Update Interval 8.4.4. Error Correction Time
9. JTAG Boundary-Scan Testing in Arria® 10 Devices x
9.1. BST Operation Control 9.2. I/O Voltage for JTAG Operation 9.3. Performing BST 9.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry 9.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing 9.6. IEEE Std. 1149.1 Boundary-Scan Register 9.7. JTAG Boundary-Scan Testing in Arria® 10 Devices Revision History
9.1. BST Operation Control x
9.1.1. IDCODE 9.1.2. Supported JTAG Instruction 9.1.3. JTAG Secure Mode 9.1.4. JTAG Private Instruction
9.6. IEEE Std. 1149.1 Boundary-Scan Register x
9.6.1. Boundary-Scan Cells of an Arria® 10 Device I/O Pin 9.6.2. IEEE Std. 1149.6 Boundary-Scan Register
10. Power Management in Arria® 10 Devices x
10.1. Power Consumption 10.2. Power Reduction Techniques 10.3. Power Sense Line 10.4. Voltage Sensor 10.5. Temperature Sensing Diode 10.6. Power-On Reset Circuitry 10.7. Power Sequencing Considerations for Arria® 10 Devices 10.8. Power Supply Design 10.9. Power Management in Arria® 10 Devices Revision History
10.1. Power Consumption x
10.1.1. Dynamic Power Equation
10.2. Power Reduction Techniques x
10.2.1. SmartVID 10.2.2. Programmable Power Technology 10.2.3. Low Static Power Device Grades 10.2.4. SmartVID Feature Implementation
10.4. Voltage Sensor x
10.4.1. Input Signal Range for External Analog Signal 10.4.2. Using Voltage Sensor in Arria® 10 Devices
10.4.1. Input Signal Range for External Analog Signal x
10.4.1.1. Unipolar Input Mode
10.4.2. Using Voltage Sensor in Arria® 10 Devices x
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access 10.4.2.2. Voltage Sensor Transfer Function
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access x
10.4.2.1.1. Configuration Registers for the Core Access Mode 10.4.2.1.2. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is not Equal to 2'b11 10.4.2.1.3. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is Equal to 2'b11
10.5. Temperature Sensing Diode x
10.5.1. Internal Temperature Sensing Diode 10.5.2. External Temperature Sensing Diode 10.5.3. Design Consideration
10.5.1. Internal Temperature Sensing Diode x
10.5.1.1. Transfer Function for Internal TSD
10.5.3. Design Consideration x
10.5.3.1. Comparing Temperature Readouts of Arria® 10 External TSD and Arria® 10 Internal Temperature Sensor
10.6. Power-On Reset Circuitry x
10.6.1. Power Supplies Monitored and Not Monitored by the POR Circuitry
10.7. Power Sequencing Considerations for Arria® 10 Devices x
10.7.1. Power-Up Sequence Requirements for Arria® 10 Devices 10.7.2. Power-Down Sequence Recommendations and Requirements for Arria® 10 Devices
1. Logic Array Blocks and Adaptive Logic Modules in Arria® 10 Devices
2. Embedded Memory Blocks in Arria® 10 Devices
3. Variable Precision DSP Blocks in Arria® 10 Devices
4. Clock Networks and PLLs in Arria® 10 Devices
5. I/O and High Speed I/O in Arria® 10 Devices
6. External Memory Interfaces in Arria® 10 Devices
7. Configuration, Design Security, and Remote System Upgrades in Arria® 10 Devices
8. SEU Mitigation for Arria® 10 Devices
9. JTAG Boundary-Scan Testing in Arria® 10 Devices
10. Power Management in Arria® 10 Devices

6.5.2. Arria® 10 Package Support for DDR3 x72 with ECC Single and Dual-Rank

To support one DDR3 x72 interface with ECC (64 bits data + 8 bits ECC) single and dual-rank, you require three I/O banks.

Table 79.  Number of DDR3 x72 Interfaces (with ECC) Single and Dual-rank Supported Per Device Package (without HPS Instance)
Note: For some device packages, you can also use the 3 V I/O banks for external memory interfaces. However, the maximum memory interface clock frequency is capped at 533 MHz. To use higher memory clock frequencies, exclude the 3 V I/O bank from external memory interfaces.
Product Line Package
U19 F27 F29 F34 F35 NF40 KF40 RF40 NF45 SF45 UF45
GX 160 116 1 16 116 — — — — — — — —
GX 220 116 116 116 — — — — — — — —
GX 270 — 116 216 216 216 — — — — — —
GX 320 — 116 216 216 216 — — — — — —
GX 480 — — 216 316 216 — — — — — —
GX 570 — — — 316 216 316 3 — — — —
GX 660 — — — 316 216 316 3 — — — —
GX 900 — — — 3 — 3 — 0 4 3 2
GX 1150 — — — 3 — 3 — 0 4 3 2
GT 900 — — — — — — — — — 3 —
GT 1150 — — — — — — — — — 3 —
SX 160 116 17 116 17 116 17 — — — — — — — —
SX 220 116 17 116 17 116 17 — — — — — — — —
SX 270 — 116 17 216 17 216 17 216 17 — — — — — —
SX 320 — 116 17 216 17 216 17 216 17 — — — — — —
SX 480 — — 216 17 316 17 216 17 — — — — — —
SX 570 — — — 316 17 216 17 316 17 3 17 — — — —
SX 660 — — — 316 17 216 17 316 17 3 17 — — — —
Table 80.  Number of DDR3 x72 Interfaces (with ECC) Single and Dual-rank Supported Per Device Package (with HPS Instance)The number of supported interfaces shown in this table excludes the interface used to connect the HPS to external SDRAM. Masters in the FPGA core can access the HPS-connected external memory interface via FPGA-to-SDRAM bridge ports configurable in the HPS.
Note: For some device packages, you can also use the 3 V I/O banks for external memory interfaces. However, the maximum memory interface clock frequency is capped at 533 MHz. To use higher memory clock frequencies, exclude the 3 V I/O bank from external memory interfaces.
Product Line Package
U19 F27 F29 F34 F35 NF40 KF40 RF40 NF45 SF45 UF45
SX 160 0 0 0 — — — — — — — —
SX 220 0 0 0 — — — — — — — —
SX 270 — 0 1 18 118 118 — — — — — —
SX 320 — 0 1 18 118 1 18 — — — — — —
SX 480 — — 1 18 2 18 1 18 — — — — — —
SX 570 — — — 2 18 1 18 2 18 2 — — — —
SX 660 — — — 2 18 1 18 2 18 2 — — — —
Related Information
16 This number includes using the 3 V I/O bank for external memory interfaces. Otherwise, the number of external memory interfaces possible is reduced by one.
17 This number includes HPS shared I/O banks to implement core EMIF configurations.
18 This number includes using the 3 V I/O bank for external memory interfaces. Otherwise, the number of external memory interfaces possible is reduced by one.
Level Two Title