Arria® 10 Core Fabric and General Purpose I/Os Handbook

ID 683461
Date 7/08/2024
Public
Document Table of Contents

5.8. I/O and High Speed I/O in Arria® 10 Devices Revision History

Document Version Changes
2024.07.08
  • Updated the footnote about using a 3.0 V LVTTL /3.0 V LVCMOS I/O standard with a 2.5 V VCCIO voltage to clarify that the input signals that exceed 2.5 V will be clamped as the protection diode is turned on.
  • Added information about the maximum IOE delays in Programmable IOE Delay.
2023.10.25
  • Clarified in the Supported I/O Standards in FPGA I/O for Arria® 10 Devices that SSTL- 12, SSTL -12 Class I and Class II are supportable for 3V I/O buffer type.
  • Updated the Guideline: Pin Placement for Differential Channels chapter for better clarity.
  • Added the Guideline: LVDS Reference Clock Source topic.
  • Removed the RSKM Report for LVDS Receiver topic.
2023.01.18 Added LVDS, RSDS, mini-LVDS, Differential POD12, and LVPECL to the list of I/O standards that support programmable I/O delay.
2022.09.29
  • Updated the outclk2 and outclk4 phase shift values in the topic listing the IOPLL parameter values for external PLL mode.
  • Added .qsf assignment information for on-chip differential I/O termination.
  • In the guideline for VREF sources and VREF pins, clarified that the internal VREF is supported only for external memory interfaces.
2021.08.13 Updated the table that lists the SERDES transmitter I/O standards support to remove all previously listed I/O standards except True LVDS, mini-LVDS, and RSDS.
2020.11.05 Updated the pin placement guidelines for differential channels to clarify that the I/O bank PLL can drive transmitter channels in an adjacent I/O bank only in a wide transmitter interface that spans multiple I/O banks.
2020.06.30 Added a footnote to table Intel Arria 10 I/O Standards Voltage Levels in section I/O Standards Voltage Levels in Arria® 10 Devices.
2019.12.30 Updated the programmable pre-emphasis diagram to remove the word "peak-peak".
2019.05.06 Added a topic that provides a usage modes summary of the Arria® 10 LVDS SERDES.
2019.01.11
  • Removed statement that says that the programmable VOD value of "0" is not available for the LVDS I/O standard.
  • Removed ext_loaden signal in figures showing the LVDS receiver in soft-CDR mode.
  • Specified that connecting the IOPLL loaden signal to the LVDS receiver ext_loaden signal is not required for LVDS receivers in soft-CDR mode.
  • Updated the VREF sources and pins guideline to specify that the internal VREF is supported only for the POD12 I/O standard.
2018.08.28
  • Removed the MultiVolt I/O Interface in Intel® Arria® 10 Devices topic.
  • Updated the I/O Standards Voltage Levels in Intel® Arria® 10 Devices topic to add information about interfacing with systems of different voltages.
2018.04.17 Updated the table listing the OCT schemes supported in Arria® 10 devices to specify that 3 V I/O and HPS I/O do not support bidirectional OCT.
2018.03.09
  • Changed "logic-to-pin" to "logic to the output buffer" in the topic about programmable open-drain output.
  • In the guideline topic about pin placement for differential channels, clarified that in an I/O bank where a DPA channel is enabled, you can assign unused pins an I/O standard that has the same VCCIO as the I/O bank.
  • Added link to the Intel FPGA PHYLite for Parallel Interfaces IP Core User Guide for more information about using internal VREF for the POD 12 I/O standards.
  • Removed the guideline topic about not driving I/O pins during power sequencing.
  • Added guideline topic about maximum currents driving through I/O pins on LVDS I/O banks while turned off and during power sequencing.
  • Changed the term "modular I/O bank" to "I/O bank". In Arria® 10 devices, all I/O banks are modular.
Date Version Changes
December 2017 2017.12.15
  • Added SSTL-12, SSTL-125, SSTL135, Differential SSTL-12, Differential SSTL-125, and Differential SSTL-135 I/O standards into Supported I/O Standards in FPGA I/O for Arria® 10 Devices and Arria® 10 I/O Standards Voltage Levels tables.
  • Removed DDR3 OCT Setting from Programmable Current Strength Settings for Arria® 10 Devices table and added a note to refer to On-Chip I/O Termination in Cyclone® 10 GX Devices section for I/O standards with DDR3 OCT Setting.
  • Added a note to the topic about the open-drain output to specify that you must not pull the output voltage higher than the Vi (DC) level.
  • Updated the table listing the programmable current strength to update the 3.0 V LVTTL current strength settings—added 24 mA and 20 mA, and specified 16 mA as the default setting.
  • Updated the note about driving LVDS channels with the PLL in integer PLL mode to clarify that you do not need a PLL if you bypass the SERDES.
  • Updated the topic about the serializer bypass for DDR and SDR operation to add more information about clocks to the IOE.
  • Updated the topic about the deserializer to add more information about bypassing the deserializer.
  • Removed the statement about SDR and DDR data width from the figures that show the receiver datapath in non-DPA, DPA, and soft-CDR modes.
  • Corrected typographical error in the example showing the parameter values to generate output clock in external PLL mode by updating "c0" to "outclk0".
  • Updated the figure titles in the topic about LVPECL termination to clarify that the figures refer to external termination. There is no OCT support for LVPECL I/O standard.
  • Updated the RSKM calculation example.
  • Updated several links and link titles.
  • Clarified that I/O banks used for differential receiver, the PLL can drive only the channels within the same I/O bank in Guideline: Pin Placement for Differential Channels.
  • Added Intel FPGA PHYLite for Parallel Interfaces IP core description in FPGA I/O IP Cores for Arria® 10 Devices.
  • Clarified that to utilize the I/O registers when implementing DDR circuitry, use the Intel FPGA GPIO IP core in I/O Buffer and Registers in Arria® 10 Devices.
  • Clarified that 3 V I/O bank supports single-ended and differential SSTL, HSTL, and HSUL I/O standards.
  • Clarified that all singled-ended I/O configured to 3 V I/O bank supports all programmable I/O elements except programmable pre-emphasis, RD on-chip termination (OCT), calibrated RS and RT OCT, and internal VREF generation.
  • Updated I/O and Differential I/O Buffers in Arria® 10 Devices topic that differential reference clock is supported for the I/O PLL that drives the SERDES.
  • Specified that VREF pins are dedicated for voltage-reference signal-ended I/O standards in Guideline: VREF Sources and VREF Pins.
  • Clarified the type of I/O buffers available in Arria® 10 FPGA devices and Arria® 10 SoC devices in I/O Standards and Voltage Levels in Arria® 10 Devices.
May 2017 2017.05.08
  • Updated the vertical migration table to remove vertical migration between Arria® 10 GX and Arria® 10 SX device variants.
  • Updated the topic about the LVDS interface with external PLL mode to clarify that the Clock Resource Summary tab in the LVDS SERDES IP core parameter editor provides the details for the signals required from the GPIO IP core.
  • Updated the table that lists the programmable IOE features supported by the I/O buffer types and I/O standards.
  • Removed all "Preliminary" marks.
March 2017 2017.03.15 Rebranded as Intel.
October 2016 2016.10.31
  • Added information about the default predefined current strength if you do not specifically assign a current strength in the Quartus® Prime software.
  • Updated the topic about OCT calibration block to verify that you can calibrate the OCT using OCT calibration block in any I/O bank of the same I/O column.
  • Removed the F36 package from the Arria® 10 GX device family variant.
  • Updated the topic about receiver skew margin for non-DPA mode to clarify TCCS and RCCS usage in calculating the RSKM value.
  • Updated the guideline about not driving the I/O pins during power sequencing to stress that excess I/O pin current can affect device reliability and damage the device.
June 13 2016.06.13
  • Updated the I/O vertical migration figure to add the KF40 package for the SX 570 and SX 660 devices.
  • Updated the table listing the I/O standards voltage levels to add 2.5 V input to 3.0 V LVTTL/3.0 V LVCMOS, and 3.0 V input to 2.5 V LVCMOS.
May 2016 2016.05.02
  • Removed the NF40 and UF45 packages from the Arria® 10 GT device family variant.
  • Corrected the modular I/O banks information for the Arria® 10 GT 1150 device by updating the package from NF45 to SF45.
  • Updated the tables listing the I/O standards to clarify Class I and Class II support for SSTL-12, SSTL-125, SSTL-135, Differential SSTL-12, Differential SSTL-125, and Differential SSTL-135 I/O standards.
  • Corrected the table listing programmable IOE features to remove differential output voltage support for 3 V I/O banks.
  • Updated the list of programmable current strengths to add support for SSTL-135, SSTL-125, SSTL-12, POD-12, Differential SSTL-135, Differential SSTL-125, Differential SSTL-12, and Differential POD12 I/O standards.
  • Added 120 Ω OCT option for SSTL-12 and Differential SSTL-12 I/O standards.
  • Added guideline about clocking DPA interfaces that use more than 24 channels.
  • Added guideline about the I/O PLL reference clock source.
  • Added guideline about the I/O standards supported for the I/O PLL reference clock input pin.
  • Added guideline about using I/O pins in the HPS shared I/O banks.
  • Updated the maximum DC current restrictions guideline topic to specify that there are no restrictions for any number of consecutive I/O pins.
  • Updated the topics about using the LVDS interface with external PLL mode. The update adds examples and connection diagrams for using transmitter channels that span multiple banks and shared with receiver channels in DPA and soft-CDR modes.
  • Removed the restriction of using I/O bank 2A for external memory interfaces and added guidelines for using I/O bank 2A for external memory interfaces.
December 2015 2015.12.14
  • Updated the table listing the I/O standards voltage support to remove 3.0 V VCCIO input from the 2.5 V I/O standard.
  • Updated the topic about MultiVolt I/O interface to update VCCP to VCC.
  • Corrected the I/O standards supported for the open-drain output, bus-hold, and weak pull-up resistor features in the table summarizing the programmable IOE features.
  • Updated the topic about the data realignment block (bit slip) to specify that valid data is available four parallel clock cycles after the rising edge of rx_bitslip_ctrl. Previously, valid data is available after two parallel clock cycles.
  • Updated the topic about external I/O termination for devices to add footnotes about using OCT for SSTL-12 and Differential SSTL-12 I/O standards, and note about recommendation to perform IBIS or SPICE simulations.
  • Updated the topic about uncalibrated RS OCT:
    • Updated the RS values of SSTL-15 to remove 25 Ω and 50 Ω.
    • Added the Differential SSTL-15, Differential SSTL-135, Differential SSTL-125, Differential SSTL-12, Differential POD12, and Differential HSUL-12 I/O standards.
  • Updated the topic about calibrated RS OCT to add the Differential POD12 I/O standard.
  • Updated the topic about calibrated RT OCT to remove 20 Ω RT OCT support and to add the Differential POD12 I/O standard.
  • Removed the Differential SSTL-2 Class I and Class II I/O standards from the tables listing the SERDES receiver and transmitter I/O standards support.
  • Updated the topic about the voltage-referenced I/O standard under the guideline for mixing voltage-referenced and non-voltage-referenced I/O standards.
  • Added design guideline for minimizing high jitter impact on the GPIO performance.
  • Updated the following signal names:
    • dpa_diffioclk to dpa_fast_clock
    • dpa_load_en to dpa_load_enable
November 2015 2015.11.02
  • Updated the topic about serializer bypass for SDR and DDR operations to specify that the serializer bypass is supported through the GPIO IP core.
  • Added a footnote with the definition of unit interval (UI) in the topic about the DPA block.
  • Updated the topic about the data realignment block (bit slip). The bit slip rollover value is now automatically set to the deserialization factor.
  • Updated the topic about the deserializer to specify that the deserializer bypass is supported through the GPIO IP core.
  • Updated the topic about PLLs and clocking to correct the parallel clock names from rx_outclock and tx_outclock to rx_coreclock and tx_coreclock.
  • Updated the topic about using the PLLs in integer mode for LVDS to clarify that the I/O PLLs operate in integer mode only.
  • Updated the following port/signal names:
    • rx_dpll_hold to rx_dpa_hold
    • rx_reset to rx_dpa_reset
    • rx_channel_data_align to rx_bitslip_ctrl
    • rx_cda_max to rx_bitslip_max
    • rx_outclock to rx_coreclock
    • lvds_diffioclk and diffioclk to fast_clock
    • lvds_load_en and load_en to load_enable
  • Updated the topic about pin placement for differential channels:
    • Improved clarity about PLLs driving interleaved differential transmitter and DPA-enabled receiver channels
    • Removed the note about bank placement DDIO and SDR I/Os
  • Updated the topic about the signal interface between IOPLL and the LVDS SERDES IP core in external PLL mode.
  • Updated the topic about IOPLL IP core parameter values for external PLL mode:
    • Phase shift of outclk0 from -180° to 180°
    • Phase shift of outclk2 from -180/serialization factor to 180/serialization factor (-18° to 18°)
  • Updated the definition of RSKM for the RSKM equation in the topic about the receiver skew margin in non-DPA mode.
  • Changed instances of Quartus II to Quartus Prime.
June 2015 2015.06.15 Corrected label for Arria® 10 GT product lines in the vertical migration figure.
May 2015 2015.05.04
  • Updated the statements in the topic about the I/O and differential I/O buffers to improve clarity.
  • Updated the I/O resources information for the U19 package of the Arria® 10 GX 160, GX 220, SX 160, and SX 220 devices:
    • Updated LVDS I/O count from 144 to 148
    • Updated total GPIO from 192 to 196
    • Updated number of LVDS channels from 72 to 74
    • Added bank 3A and removed bank 3C in the figures and related modular I/O banks tables
  • Updated the figure showing the IOE structure to clarify that the delay chains are separate.
  • Updated the modular I/Os for banks 3A (from null to 48) and 3B (from 48 to null) for the F27 package of the Arria® 10 GX 270, GX 320, SX 270, and SX 320 devices.
January 2015 2014.01.23
  • Added topic about programmable open-drain output.
  • Restructured the topic about pin placement for differential channels to enhance clarity.
  • Corrected contents that specified DPA-enabled transmitter channels. There is no DPA for transmitter channels.
  • Added guideline about instantiating only one Altera LVDS SERDES IP core instance for each I/O bank.
  • Added guideline about using only specific LVDS pin pairs in soft-CDR mode.
  • Updated the section that describes usage of the LVDS interface with external PLL:
    • Updated information about the required signals in Altera IOPLL and Altera LVDS SERDES IP cores.
    • Updated the examples of parameter values to generate output clocks using Altera IOPLL IP core.
    • Updated the LVDS clock phase relationship diagram for external PLL interface signals.
    • Updated the diagrams that show the connections between Altera IOPLL and Altera LVDS SERDES IP cores.
  • Added footnote to clarify that you can use pre-emphasis for LVDS and POD12 I/O standards. The POD12 I/O standard supports DDR4.
August 2014 2014.08.18
  • Updated description of the 3 V I/O bank regarding support for programmable IOE features.
  • Added statement to clarify that apart from FPGA I/O buffers, the Arria® 10 SoC devices also contains HPS I/O buffers with different I/O standards support.
  • Separated I/O bank 2A in each I/O banks location figures to signify that it is not consecutive with other I/O banks.
  • Updated LVDS I/O and SERDES circuitry descriptions to clarify that each LVDS channel have built-in transmit SERDES and receive SERDES.
  • Removed reference to on-chip clamping diode. Arria 10 devices do not have on-chip clamping diode. Use an external clamping diode where applicable.
  • Added a related information link to the Arria 10 Transceiver PHY User Guide that describes the transceiver I/O banks locations.
  • Updated the I/O vertical migration figure to show vertical migration between Arria 10 GX and Arria 10 SX devices.
  • Updated all references to "megafunction" to "IP core".
  • Updated all references to "MegaWizard Plug-in Manager" to "parameter editor".
  • Updated all references to Altera PLL IP core to Altera IOPLL IP core.
  • Updated the signal names for using the LVDS interface with the External PLL mode:
    • tx_inclock and rx_inclock to ext_fclk
    • tx_enable rx_enable to ext_loaden
    • rx_dpaclock to ext_vcoph[7..0]
    • rx_synclock to ext_coreclock
December 2013 2013.12.02 Initial release.