Agilex™ 7 Power Management User Guide

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ID 683373
Date 7/08/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 Power Management Overview 2. Agilex™ 7 Power Basics 3. Agilex™ 7 Power and I/O State Sequencing 4. Agilex™ 7 Sensor Monitoring System 5. Agilex™ 7 Power Optimization Techniques and Features 6. Document Revision History for the Agilex™ 7 Power Management User Guide
1. Agilex™ 7 Power Management Overview x
1.1. Power System Design Phases 1.2. Power Supplies
1.1. Power System Design Phases x
1.1.1. Choosing a Power Tree 1.1.2. Power Estimation 1.1.3. Power Optimization 1.1.4. Power Generation
2. Agilex™ 7 Power Basics x
2.1. Power Consumption 2.2. Power Estimation Basics 2.3. Intel® FPGA Power and Thermal Calculator 2.4. Power Analyzer
3. Agilex™ 7 Power and I/O State Sequencing x
3.1. Overview 3.2. Power-Up Sequence Requirements 3.3. Power-Down Sequence Requirements for Agilex™ 7 Devices with E-Tile 3.4. Power-Down Sequence Requirements for the Agilex™ 7 M-Series Devices 3.5. Floating Voltage 3.6. Power-On Reset
3.2. Power-Up Sequence Requirements x
3.2.1. Guidelines for I/O Pins in GPIO, HPS, SDM Banks, and UIB Subsystem During Power Sequencing
3.6. Power-On Reset x
3.6.1. Power Supplies Monitored by the POR Circuitry
4. Agilex™ 7 Sensor Monitoring System x
4.1. Voltage Monitoring System 4.2. Temperature Monitoring System 4.3. Sensors Design Considerations 4.4. Temperature Reading Design Example
4.1. Voltage Monitoring System x
4.1.1. Voltage Sensor Transfer Function
4.2. Temperature Monitoring System x
4.2.1. Local Temperature Sensor 4.2.2. Remote Temperature Sensing Diode 4.2.3. Temperature Sensor Locations 4.2.4. Retrieving Local Temperature Sensor Reading 4.2.5. Temperature Sensor Error Codes
4.2.3. Temperature Sensor Locations x
4.2.3.1. Getting Approximate Locations of the Transceiver Banks
4.3. Sensors Design Considerations x
4.3.1. Voltage Monitor Design Guidelines 4.3.2. Temperature Monitor Design Guidelines 4.3.3. Transceiver Tile Local Temperature Sensor Design Guidelines 4.3.4. Guidelines: Calibrate Temperature Sensing Chip Interfacing the Agilex™ 7 Remote TSD 4.3.5. Guidelines: Reading the R-Tile Local Temperature Sensor
4.4. Temperature Reading Design Example x
4.4.1. Directory Structure 4.4.2. Hardware and Software Requirements 4.4.3. Temperature Reading Design Example Description 4.4.4. Using the Temperature Reading Design Example 4.4.5. Verifying the Interaction between the Design Example and the Mailbox Client with Avalon® Streaming Interface IP
4.4.4. Using the Temperature Reading Design Example x
4.4.4.1. Opening the Temperature Reading Design Example 4.4.4.2. Compiling the Temperature Reading Design Example and Generating the Software Object File 4.4.4.3. Programming and Starting Up the Temperature Reading Design Example 4.4.4.4. Sending Commands to the Temperature Reading Design Example
4.4.4.4. Sending Commands to the Temperature Reading Design Example x
4.4.4.4.1. Default Commands for the Temperature Reading Design Example
5. Agilex™ 7 Power Optimization Techniques and Features x
5.1. SmartVID Standard Power Devices 5.2. DSP and M20K Power Gating 5.3. Clock Gating 5.4. Power Sense Line 5.5. Power Optimization Techniques in the Quartus® Prime Software
5.1. SmartVID Standard Power Devices x
5.1.1. SmartVID Feature Implementation in Agilex™ 7 Devices 5.1.2. SDM Power Manager 5.1.3. Temperature Compensation 5.1.4. Agilex™ 7 Power Management and VID Implementation Guide
5.1.2. SDM Power Manager x
5.1.2.1. PMBus Master Mode 5.1.2.2. PMBus Slave Mode 5.1.2.3. Fail Safe Mechanism 5.1.2.4. Fault Management and Error Reporting
5.1.4. Agilex™ 7 Power Management and VID Implementation Guide x
5.1.4.1. Specifying Power Management and VID Parameters and Options
5.1.4.1. Specifying Power Management and VID Parameters and Options x
5.1.4.1.1. Configuration Pin Parameters 5.1.4.1.2. Power Management and VID Parameters 5.1.4.1.3. Power Management and VID Interface QSF Constraint Guide
1. Agilex™ 7 Power Management Overview
2. Agilex™ 7 Power Basics
3. Agilex™ 7 Power and I/O State Sequencing
4. Agilex™ 7 Sensor Monitoring System
5. Agilex™ 7 Power Optimization Techniques and Features
6. Document Revision History for the Agilex™ 7 Power Management User Guide

4.3.2. Temperature Monitor Design Guidelines

You can measure the on-chip temperature of the core fabric or transceiver tiles through the remote TSDs while the device is powered on or powered off. However, the local temperature sensors are available only after the device is powered up and configured.
  • Connect the remote TSD pins to external temperature sensing devices to monitor the on-chip temperature.
  • To interface with the remote TSD, use temperature sensing chips with features that allow you to perform calibration and measurement compensation to improve accuracy, such as:
    • Configurable ideality factor
    • Offset adjustment with or without Beta compensation
  • Keep the resistance of both board traces to the remote TSD p and n pins to less than 0.2 Ω.
  • Route both traces in equal lengths and shield them.
  • Altera recommends a 10-mils width and space for both traces.
  • Route both traces through the most minimum number of vias and crossunders possible to minimize the thermocouple effects.
  • Ensure that the number of vias for both traces are the same.
  • To avoid coupling, insert a GND plane between the remote TSD pins traces and high-frequency toggling signals, such as clocks and I/O signals.
  • To filter high-frequency noise, place an external capacitor between the traces close to the external sensors.
  • If you use only the local temperature sensors, you can leave the remote TSD p and n pins unconnected.

For details about device specifications and connection guidelines, refer to the external temperature sensor manufacturer's documentation.

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