Cyclone® V SoC Development Kit User Guide

ID 830285
Date 10/07/2024
Public
Document Table of Contents

2.2. Inspecting the Boards

To inspect each board, perform these steps:

  1. Place the board on an anti-static surface and inspect it to ensure that it has not been damaged during shipment. Without proper anti-static handling, you may damage the board.
  2. Verify that all components on the boards appear in place and intact.
In typical applications with the Cyclone® V development board, a heat sink is not necessary. However, under extreme conditions or for engineering sample silicon, the board might require additional cooling to stay within operating temperature guidelines. The board has two holes near the FPGA that accommodate many different heat sinks, including the Dynatron V31G*. You can perform power consumption and thermal modeling to determine whether your application requires additional cooling. For information about measuring board and FPGA power in real time, refer to the The Power Monitor section.