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1. Agilex™ 5 LVDS SERDES Overview
2. Agilex™ 5 LVDS SERDES Architecture
3. Agilex™ 5 LVDS SERDES Transmitter
4. Agilex™ 5 LVDS SERDES Receiver
5. Agilex™ 5 High-Speed LVDS I/O Implementation Guide
6. Agilex™ 5 LVDS SERDES Timing
7. LVDS SERDES Intel® FPGA IP Design Examples
8. Agilex™ 5 LVDS SERDES Design Guidelines
9. Agilex™ 5 LVDS SERDES Troubleshooting Guidelines
10. Document Revision History for the LVDS SERDES User Guide: Agilex™ 5 FPGAs and SoCs
8.1. Use PLLs in Integer PLL Mode for LVDS SERDES
8.2. Use High-Speed Clock from PLL to Clock SERDES Only
8.3. Pin Placement for Differential Channels
8.4. SERDES Pin Pairs for Soft-CDR Mode
8.5. Placing LVDS SERDES Transmitters and Receivers with External PLL
8.6. Sharing LVDS SERDES I/O Lane with Other Intel® FPGA IPs
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2.1. Agilex™ 5 HSIO Banks, SERDES, and DPA Locations
The HSIO banks are located at the top and bottom I/O bank rows.
Figure 1. Agilex™ 5 HSIO Bank Structure (Die Top View)This figure shows the HSIO bank structure of the Agilex™ 5 device. The figure shows the view of the die as shown in the Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View". Different device packages have different number of HSIO banks. Refer to the device pin-out files for available HSIO banks and the locations of the HPS shared HSIO banks for each device package.
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