High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 M-Series FPGA IP User Guide

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ID 773264
Date 12/04/2023
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Document Table of Contents
Document Table of Contents x
1. About the High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 FPGA IP User Guide 2. Introduction to High Bandwidth Memory 3. Intel Agilex® 7 M-Series HBM2E Architecture 4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP 5. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Interface 6. High Bandwidth Memory (HBM2E) Interface Intel FPGA IP Performance 7. Debugging the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP 8. Document Revision History for High Bandwidth Memory (HBM2E) Interface Intel FPGA IP User Guide A. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Intel® Quartus® Prime Software Flow
1. About the High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 FPGA IP User Guide x
1.1. Release Information
2. Introduction to High Bandwidth Memory x
2.1. HBM2E in Intel Agilex® 7 M-Series Devices 2.2. HBM2E DRAM Structure 2.3. Intel Agilex® 7 HBM2E Features 2.4. Intel Agilex® 7 M-Series HBM2E Controller Features 2.5. Intel Agilex® 7 M-Series FPGA HBM2E IP Device Family Support
3. Intel Agilex® 7 M-Series HBM2E Architecture x
3.1. Intel Agilex® 7 M-Series HBM2E Introduction 3.2. Intel Agilex® 7 M-Series Hard Memory NoC Subsystem 3.3. Address Mapping of the HBM2E Targets 3.4. Intel Agilex® 7 M-Series UIB Architecture 3.5. Intel Agilex® 7 M-Series HBM2E Controller Architecture
3.5. Intel Agilex® 7 M-Series HBM2E Controller Architecture x
3.5.1. Intel Agilex® 7 M-Series HBM2E Controller Details
4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP x
4.1. Creating an Intel® Quartus® Prime Pro Edition Project for High Bandwidth Memory (HBM2E) Interface FPGA IP 4.2. Parameterizing the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP
4.2. Parameterizing the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP x
4.2.1. General Parameters for High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP 4.2.2. Example Design Parameters for High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP 4.2.3. Modifying Your Pin Assignments to Choose the Physical Location of the HBM2E Device
5. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Interface x
5.1. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP High Level Block Diagram 5.2. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Controller Interface Signals 5.3. User AXI Interface Timing 5.4. Platform Designer-Only Interface 5.5. User Accesses to the HBM2E Controller
5.2. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Controller Interface Signals x
5.2.1. Reset, Clock, and Calibration Status Signals 5.2.2. 'Do not connect' Signals 5.2.3. Asynchronous HBM2E Controller Signals 5.2.4. AXI4 Interface Signals 5.2.5. AXI4-Lite Interface
5.3. User AXI Interface Timing x
5.3.1. AXI Write Transaction 5.3.2. AXI Read Transaction
5.5. User Accesses to the HBM2E Controller x
5.5.1. Initialization Control Register and Initialization Status Register 5.5.2. Thermal Status Register 5.5.3. ECC Error Counters Register 5.5.4. Error Login Registers
6. High Bandwidth Memory (HBM2E) Interface Intel FPGA IP Performance x
6.1. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Controller Performance 6.2. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP System Performance
6.1. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Controller Performance x
6.1.1. High Bandwidth Memory (HBM2E) DRAM Bandwidth 6.1.2. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Efficiency 6.1.3. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Latency 6.1.4. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Timing
7. Debugging the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP x
7.1. Debugging Guidelines for High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP
A. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Intel® Quartus® Prime Software Flow x
A.1. Initiators Placement Recommendations A.2. Simulating HBM2E User Designs
1. About the High Bandwidth Memory (HBM2E) Interface Intel Agilex® 7 FPGA IP User Guide
2. Introduction to High Bandwidth Memory
3. Intel Agilex® 7 M-Series HBM2E Architecture
4. Creating and Parameterizing the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP
5. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Interface
6. High Bandwidth Memory (HBM2E) Interface Intel FPGA IP Performance
7. Debugging the High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP
8. Document Revision History for High Bandwidth Memory (HBM2E) Interface Intel FPGA IP User Guide
A. High Bandwidth Memory (HBM2E) Interface Intel® FPGA IP Intel® Quartus® Prime Software Flow

2.3. Intel Agilex® 7 HBM2E Features

Intel Agilex® 7 M-Series FPGAs offer the following HBM2E features.
  • Supports two configurations: 4H/8GB and 8H/16GB.
  • Transfer rate up to 3.2 GT/s for the fastest device speed grade.
  • 2GB capacity per DRAM die.
  • Supports one to eight HBM2E channels per HBM2E interface in the Pseudo Channel mode.
  • Each HBM2E channel supports a 128-bit DDR data bus, with optional ECC support.
  • Pseudo Channel mode divides each channel into two individual 64-bit I/O pseudo-channels. The two pseudo-channels operate semi-independently; they share the channel’s row and column command bus as well as CK and CKE inputs, but they decode and execute commands individually. Address BA4 directs commands to either pseudo-channel 0 (BA4 = 0) or pseudo-channel 1 (BA4 = 1), offering unique address space to each pseudo-channel. Pseudo Channel mode requires that the burst length for DRAM transactions is set to 4.
  • Data referenced to strobes RDQS_t / RDQS_c and WDQS_t / WDQS_c, one strobe pair per 32 DQs.
  • Differential clock inputs (CK_t / CK_c). Unterminated data/address/cmd/clk interfaces.
  • DDR commands entered on each positive CK_t and CK_c edge. Row Activate commands require two memory cycles; all other commands are single-cycle commands.
  • Supports command, write data and read data parity.
  • Support for bank grouping.
  • Support for data bus inversion.
  • 64-bit data per pseudo-channel. Eight additional data bits are available per pseudo-channel; you can use these data bits for any of the following:
    • ECC. The ECC scheme implemented is single-bit error correction with double-bit error detection (SECDEC). This includes 8 bits of ECC code (also known as syndrome).
    • Data mask (DM). The data mask for masking write data per byte.
    • User-defined data
    • Can be left unused.
  • I/O voltage of 1.2V and DRAM core voltage of 1.2V.
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