External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide
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8.3.6.3. Example of an LPDDR5 Layout on an Intel® FPGA Platform Board
This example has been designed on a thick PCB (120mil stackup) using micro vias and through vias with backdrill. The LPDDR5 signal routing is on upper layers to avoid vertical crosstalk on interface and achieve high performance.


In addition, the following figure shows a LPDDR5 64-bit device board routing sample with pitch dimension of 0.4×0.4mm. The microvia has been used for via transitions on this interface.
