Intel® Cyclone® 10 GX Device Datasheet

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ID 683828
Date 2/14/2022
Public
Document Table of Contents
Document Table of Contents x
Intel® Cyclone® 10 GX Device Datasheet
Intel® Cyclone® 10 GX Device Datasheet x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Intel® Cyclone® 10 GX Device Datasheet
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions Transceiver Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption I/O Pin Leakage Current Bus Hold Specifications OCT Calibration Accuracy Specifications OCT Without Calibration Resistance Tolerance Specifications Pin Capacitance Internal Weak Pull-Up and Weak Pull-Down Resistor
I/O Standard Specifications x
Single-Ended I/O Standards Specifications Single-Ended SSTL, HSTL, and HSUL I/O Reference Voltage Specifications Single-Ended SSTL, HSTL, and HSUL I/O Standards Signal Specifications Differential SSTL I/O Standards Specifications Differential HSTL and HSUL I/O Standards Specifications Differential I/O Standards Specifications
Switching Characteristics x
Transceiver Performance Specifications Core Performance Specifications Periphery Performance Specifications
Transceiver Performance Specifications x
Transceiver Performance for Intel® Cyclone® 10 GX Devices High-Speed Serial Transceiver-Fabric Interface Performance for Intel® Cyclone® 10 GX Devices Transceiver Specifications for Intel® Cyclone® 10 GX Devices
Core Performance Specifications x
Clock Tree Specifications PLL Specifications DSP Block Specifications Memory Block Specifications Temperature Sensing Diode Specifications Internal Voltage Sensor Specifications
PLL Specifications x
Fractional PLL Specifications I/O PLL Specifications
Temperature Sensing Diode Specifications x
Internal Temperature Sensing Diode Specifications External Temperature Sensing Diode Specifications
Periphery Performance Specifications x
High-Speed I/O Specifications DPA Lock Time Specifications LVDS Soft-CDR/DPA Sinusoidal Jitter Tolerance Specifications Memory Standards Supported by the Hard Memory Controller DLL Range Specifications DQS Logic Block Specifications Memory Output Clock Jitter Specifications OCT Calibration Block Specifications
Configuration Specifications x
POR Specifications JTAG Configuration Timing FPP Configuration Timing AS Configuration Timing DCLK Frequency Specification in the AS Configuration Scheme PS Configuration Timing Initialization Configuration Files Minimum Configuration Time Estimation Remote System Upgrades User Watchdog Internal Circuitry Timing Specifications
FPP Configuration Timing x
DCLK-to-DATA[] Ratio (r) for FPP Configuration FPP Configuration Timing when DCLK-to-DATA[] = 1 FPP Configuration Timing when DCLK-to-DATA[] >1
Intel® Cyclone® 10 GX Device Datasheet

Bus Hold Specifications

The bus-hold trip points are based on calculated input voltages from the JEDEC standard.

Table 6.  Bus Hold Parameters for Intel® Cyclone® 10 GX Devices
Parameter Symbol Condition VCCIO (V) Unit
1.2 1.5 1.8 2.5 3.0
Min Max Min Max Min Max Min Max Min Max
Bus-hold, low, sustaining current ISUSL VIN > VIL (max) 8 15, 26 16 — 12 15, 32 16 — 30 15, 55 16 — 60 — 70 — µA
Bus-hold, high, sustaining current ISUSH VIN < VIH (min) –8 15, –26 16 — –12 15, –32 16 — –30 15, –55 16 — –60 — –70 — µA
Bus-hold, low, overdrive current IODL 0 V < VIN < VCCIO — 125 — 175 — 200 — 300 — 500 µA
Bus-hold, high, overdrive current IODH 0 V < VIN < VCCIO — –125 — –175 — –200 — –300 — –500 µA
Bus-hold trip point VTRIP — 0.3 0.9 0.38 1.13 0.68 1.07 0.70 1.7 0.8 2 V
15 This value is only applicable for LVDS I/O bank.
16 This value is only applicable for 3 V I/O bank.
Level Two Title