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1. Intel® MAX® 10 I/O Overview
2. Intel® MAX® 10 I/O Architecture and Features
3. Intel® MAX® 10 I/O Design Considerations
4. Intel® MAX® 10 I/O Implementation Guides
5. GPIO Lite Intel® FPGA IP References
6. Intel® MAX® 10 General Purpose I/O User Guide Archives
7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide
2.3.2.1. Programmable Open Drain
2.3.2.2. Programmable Bus Hold
2.3.2.3. Programmable Pull-Up Resistor
2.3.2.4. Programmable Current Strength
2.3.2.5. Programmable Output Slew Rate Control
2.3.2.6. Programmable IOE Delay
2.3.2.7. PCI Clamp Diode
2.3.2.8. Programmable Pre-Emphasis
2.3.2.9. Programmable Differential Output Voltage
2.3.2.10. Programmable Emulated Differential Output
2.3.2.11. Programmable Dynamic Power Down
3.1. Guidelines: VCCIO Range Considerations
3.2. Guidelines: Voltage-Referenced I/O Standards Restriction
3.3. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers
3.4. Guidelines: Adhere to the LVDS I/O Restrictions Rules
3.5. Guidelines: I/O Restriction Rules
3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin
3.7. Guidelines: Analog-to-Digital Converter I/O Restriction
3.8. Guidelines: External Memory Interface I/O Restrictions
3.9. Guidelines: Dual-Purpose Configuration Pin
3.10. Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package
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3.5. Guidelines: I/O Restriction Rules
For different I/O standards and conditions, you must limit the number of I/O pins. This I/O restriction rule is applicable if you use LVDS transmitters or receivers. Apply this restriction if one or more LVDS I/O standards reside in the I/O bank.
I/O Standard | Condition | Max Output Pins Per Bank (%) |
---|---|---|
2.5 V LVTTL/LVCMOS | 16 mA current strength or 25 Ω OCT | 25 |
12 mA current strength | 30 | |
8 mA current strength or 50 Ω OCT | 45 | |
4 mA current strength | 65 | |
2.5 V SSTL | — | 100 |
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