Intel® MAX® 10 General Purpose I/O User Guide

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ID 683751
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 I/O Overview 2. Intel® MAX® 10 I/O Architecture and Features 3. Intel® MAX® 10 I/O Design Considerations 4. Intel® MAX® 10 I/O Implementation Guides 5. GPIO Lite Intel® FPGA IP References 6. Intel® MAX® 10 General Purpose I/O User Guide Archives 7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide
1. Intel® MAX® 10 I/O Overview x
1.1. Intel® MAX® 10 Devices I/O Resources Per Package 1.2. Intel® MAX® 10 I/O Vertical Migration Support
2. Intel® MAX® 10 I/O Architecture and Features x
2.1. Intel® MAX® 10 I/O Standards Support 2.2. Intel® MAX® 10 I/O Elements 2.3. Intel® MAX® 10 I/O Buffers 2.4. I/O Standards Termination
2.1. Intel® MAX® 10 I/O Standards Support x
2.1.1. Intel® MAX® 10 I/O Standards Voltage and Pin Support
2.2. Intel® MAX® 10 I/O Elements x
2.2.1. Intel® MAX® 10 I/O Banks Architecture 2.2.2. Intel® MAX® 10 I/O Banks Performance 2.2.3. Intel® MAX® 10 I/O Banks Locations
2.3. Intel® MAX® 10 I/O Buffers x
2.3.1. Schmitt-Trigger Input Buffer 2.3.2. Programmable I/O Buffer Features
2.3.2. Programmable I/O Buffer Features x
2.3.2.1. Programmable Open Drain 2.3.2.2. Programmable Bus Hold 2.3.2.3. Programmable Pull-Up Resistor 2.3.2.4. Programmable Current Strength 2.3.2.5. Programmable Output Slew Rate Control 2.3.2.6. Programmable IOE Delay 2.3.2.7. PCI Clamp Diode 2.3.2.8. Programmable Pre-Emphasis 2.3.2.9. Programmable Differential Output Voltage 2.3.2.10. Programmable Emulated Differential Output 2.3.2.11. Programmable Dynamic Power Down
2.4. I/O Standards Termination x
2.4.1. Voltage-Referenced I/O Standards Termination 2.4.2. Differential I/O Standards Termination 2.4.3. Intel® MAX® 10 On-Chip I/O Termination
2.4.3. Intel® MAX® 10 On-Chip I/O Termination x
2.4.3.1. OCT Calibration 2.4.3.2. RS OCT in Intel® MAX® 10 Devices
3. Intel® MAX® 10 I/O Design Considerations x
3.1. Guidelines: VCCIO Range Considerations 3.2. Guidelines: Voltage-Referenced I/O Standards Restriction 3.3. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers 3.4. Guidelines: Adhere to the LVDS I/O Restrictions Rules 3.5. Guidelines: I/O Restriction Rules 3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin 3.7. Guidelines: Analog-to-Digital Converter I/O Restriction 3.8. Guidelines: External Memory Interface I/O Restrictions 3.9. Guidelines: Dual-Purpose Configuration Pin 3.10. Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package
3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin x
3.6.1. Calculating the Total Inductance for 1.0 V Pin Placement
4. Intel® MAX® 10 I/O Implementation Guides x
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP 4.2. Verifying Pin Migration Compatibility
4.1. GPIO Lite Intel FPGA IP GPIO Lite Intel® FPGA IP x
4.1.1. GPIO Lite Intel® FPGA IP Data Paths
4.1.1. GPIO Lite Intel® FPGA IP Data Paths x
4.1.1.1. DDR Input Path 4.1.1.2. DDR Output Path with Output Enable
5. GPIO Lite Intel® FPGA IP References x
5.1. GPIO Lite Intel® FPGA IP Parameter Settings 5.2. GPIO Lite Intel® FPGA IP Interface Signals
1. Intel® MAX® 10 I/O Overview
2. Intel® MAX® 10 I/O Architecture and Features
3. Intel® MAX® 10 I/O Design Considerations
4. Intel® MAX® 10 I/O Implementation Guides
5. GPIO Lite Intel® FPGA IP References
6. Intel® MAX® 10 General Purpose I/O User Guide Archives
7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide

2.3. Intel® MAX® 10 I/O Buffers

The general purpose I/Os (GPIOs) in Intel® MAX® 10 devices consist of LVDS I/O and DDR I/O buffers.
Table 5.  Types of GPIO Buffers in Intel® MAX® 10 Devices
LVDS I/O Buffers DDR I/O Buffers
  • Support differential and single-ended I/O standards.
  • Available only on I/O banks at the bottom side of the device.
  • For LVDS, the bottom I/O banks support LVDS transmitter, emulated LVDS transmitter, and LVDS receiver buffers.
  • Support differential and single-ended I/O standards.
  • Available on I/O banks at the left, right, and top sides of the device.
  • For LVDS, the DDR I/O buffers support only LVDS receiver and emulated LVDS transmitter buffers.
  • For DDR, only the DDR I/O buffers on the right side of the device supports DDR3 external memory interfaces. DDR3 support is only available for Intel® MAX® 10 16, 25, 40, and 50 devices.

Section Content
Schmitt-Trigger Input Buffer
Programmable I/O Buffer Features

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