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1. Intel® MAX® 10 I/O Overview
2. Intel® MAX® 10 I/O Architecture and Features
3. Intel® MAX® 10 I/O Design Considerations
4. Intel® MAX® 10 I/O Implementation Guides
5. GPIO Lite Intel® FPGA IP References
6. Intel® MAX® 10 General Purpose I/O User Guide Archives
7. Document Revision History for Intel® MAX® 10 General Purpose I/O User Guide
2.3.2.1. Programmable Open Drain
2.3.2.2. Programmable Bus Hold
2.3.2.3. Programmable Pull-Up Resistor
2.3.2.4. Programmable Current Strength
2.3.2.5. Programmable Output Slew Rate Control
2.3.2.6. Programmable IOE Delay
2.3.2.7. PCI Clamp Diode
2.3.2.8. Programmable Pre-Emphasis
2.3.2.9. Programmable Differential Output Voltage
2.3.2.10. Programmable Emulated Differential Output
2.3.2.11. Programmable Dynamic Power Down
3.1. Guidelines: VCCIO Range Considerations
3.2. Guidelines: Voltage-Referenced I/O Standards Restriction
3.3. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers
3.4. Guidelines: Adhere to the LVDS I/O Restrictions Rules
3.5. Guidelines: I/O Restriction Rules
3.6. Guidelines: Placement Restrictions for 1.0 V I/O Pin
3.7. Guidelines: Analog-to-Digital Converter I/O Restriction
3.8. Guidelines: External Memory Interface I/O Restrictions
3.9. Guidelines: Dual-Purpose Configuration Pin
3.10. Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package
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1.1. Intel® MAX® 10 Devices I/O Resources Per Package
Device | Package | ||||||
---|---|---|---|---|---|---|---|
Type | V81 81-pin WLCSP |
Y180 180-pin WLCSP |
M153 153-pin MBGA |
U169 169-pin UBGA |
U324 324-pin UBGA |
E144 144-pin EQFP |
|
Size | 4 mm × 4 mm | 6 mm × 5 mm | 8 mm × 8 mm | 11 mm × 11 mm | 15 mm × 15 mm | 22 mm × 22 mm | |
Ball Pitch | 0.4 mm | 0.35 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm | |
10M02 | — | — | 112 | 130 | 246 | 101 | |
10M04 | — | — | 112 | 130 | 246 | 101 | |
10M08 | 58 | — | 112 | 130 | 246 | 101 | |
10M16 | — | 125 | — | 130 | 246 | 101 | |
10M25 | — | — | — | — | — | 101 | |
10M40 | — | — | — | — | — | 101 | |
10M50 | — | — | — | — | — | 101 |
Device | Package | ||||||
---|---|---|---|---|---|---|---|
Type | V36 36-pin WLCSP |
V81 81-pin WLCSP |
U324 324-pin UBGA |
F256 256-pin FBGA |
F484 484-pin FBGA |
F672 672-pin FBGA |
|
Size | 3 mm × 3 mm | 4 mm × 4 mm | 15 mm × 15 mm | 17 mm × 17 mm | 23 mm × 23 mm | 27 mm × 27 mm | |
Ball Pitch | 0.4 mm | 0.4 mm | 0.8 mm | 1.0 mm | 1.0 mm | 1.0 mm | |
10M02 | 27 | — | 160 | — | — | — | |
10M04 | — | — | 246 | 178 | — | — | |
10M08 | — | 56 | 246 | 178 | 250 | — | |
10M16 | — | — | 246 | 178 | 320 | — | |
10M25 | — | — | — | 178 | 360 | — | |
10M40 | — | — | — | 178 | 360 | 500 | |
10M50 | — | — | — | 178 | 360 | 500 |
Related Information
1 For the performance specifications of the V36 and V81 packages of Intel® MAX® 10 dual power supply devices, follow the data sheet specifications for single supply devices.