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1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces Intel Agilex 7 FPGA IP for M-Series
3. PHY Lite for Parallel Interfaces Intel Agilex 7 FPGA IP for F-Series and I-Series
4. PHY Lite for Parallel Interfaces Intel Stratix 10 FPGA IP
5. PHY Lite for Parallel Interfaces Intel Arria 10 and Intel Cyclone 10 GX FPGA IPs
6. PHY Lite for Parallel Interfaces Intel® FPGA IP User Guide Document Archives
7. Document Revision History for the PHY Lite for Parallel Interfaces IP User Guide
4.5.6.4.1. Timing Closure: Dynamic Reconfiguration
4.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
4.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
4.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
4.5.6.4.5. I/O Timing Violation
4.5.6.4.6. Internal FPGA Path Timing Violation
5.5.6.4.1. Timing Closure: Dynamic Reconfiguration
5.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
5.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
5.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
5.5.6.4.5. I/O Timing Violation
5.5.6.4.6. Internal FPGA Path Timing Violation
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3.2.1. Intel Agilex® 7 F-Series and I-Series I/O Sub-bank Interconnects
There are interconnects between the sub-banks which chain the sub-banks into a row. The following figures show how I/O lanes in various sub-banks are chained together to form the top and bottom I/O rows in various Intel Agilex® 7 device variants. These figures represent the top view of the silicon die that corresponds to a reverse view of the device package. Each sub-bank is labeled with ID number to facilitate pin placement.
Figure 16. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGF012 and AGF014, Package R24B
Figure 17. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGF012 and AGF014, Package R24B
Figure 18. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGF014, Package R24C
Figure 19. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGF014, Package R24C
Figure 20. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGF022 and AGF027 Devices, Package R25A
Figure 21. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGF022 and AGF027 Devices, Package R25A
Figure 22. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGF022 and AGF027 Devices, Package R31C
Figure 23. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGF022 and AGF027 Devices, Package R31C
Figure 24. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGI022 and AGI027 Devices, Package R29A
Figure 25. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGI022 and AGI027 Devices, Package R29A
Figure 26. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGI027 Devices, Package R29B
Figure 27. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGI027 Devices, Package R29B
Figure 28. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGI022 and AGI027 Devices, Package R31A
Figure 29. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGI022 and AGI027 Devices, Package R31A
Figure 30. Sub-bank Ordering with ID in Top I/O Row in Intel Agilex® 7 AGI022 and AGI027 Devices, Package R31B
Figure 31. Sub-bank Ordering with ID in Bottom I/O Row in Intel Agilex® 7 AGI022 and AGI027 Devices, Package R31B
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