Intel® MAX® 10 FPGA Signal Integrity Design Guidelines

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ID 683572
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
Intel® MAX® 10 FPGA Signal Integrity Design Guidelines
Intel® MAX® 10 FPGA Signal Integrity Design Guidelines x
Definitions Understanding SSN Guidelines: Clock and Asynchronous Control Input Signal Guidelines: Data Input Pin Guidelines: Clock and Data Input Signal for Intel® MAX® 10 E144 Package Guidelines: I/O Restriction Rules Guidelines: Placement Restrictions for 1.0 V I/O Pin Guidelines: Analog-to-Digital Converter I/O Restriction Guidelines: Voltage-Referenced I/O Standards Restriction Guidelines: Adhere to the LVDS I/O Restrictions Rules Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers Guidelines: External Memory Interface I/O Restrictions Guidelines: ADC Ground Plane Connection Guidelines: Board Design for ADC Reference Voltage Pin Guidelines: Board Design for Analog Input Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND) Guidelines: Intel® MAX® 10 Board Design Requirement for DDR2, DDR3, and LPDDR2 Document Revision History for Intel® MAX® 10 FPGA Signal Integrity Design Guidelines
Guidelines: Clock and Asynchronous Control Input Signal x
Schmitt-Trigger Input Buffer
Guidelines: Placement Restrictions for 1.0 V I/O Pin x
Calculating the Total Inductance for 1.0 V Pin Placement
Intel® MAX® 10 FPGA Signal Integrity Design Guidelines

Guidelines: Adhere to the LVDS I/O Restrictions Rules

For LVDS applications, adhere to the I/O restriction pin connection guidelines to avoid excessive jitter on the LVDS transmitter output pins. The Intel® Quartus® Prime software generates a critical warning if these rules are violated.

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